Strain measurement in micro-electronic packages using the digital image correlation method

Toru Ikeda Graduate School of Engineering, Kyoto University, Kyoto, Japan

Toshifumi Kanno Graduate School of Engineering, Kyoto University, Kyoto, Japan

Nobuyuki Shishido Graduate School of Engineering, Kyoto University, Kyoto, Japan

Noriyuki Miyazaki Graduate School of Engineering, Kyoto University, Kyoto, Japan

Hiroyuki Tanaka Sumitomo Bakelite Co. Ltd, Tokyo, Japan

Takuya Hatao Sumitomo Bakelite Co. Ltd, Tokyo, Japan

References

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