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Articles

Effect on lead-free solder joint reliability caused by solder volume

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Pages 851-856 | Published online: 22 Sep 2011

References

  • Nakai, Sakamoto, Hirano. Chip parts solder fillet shape and soldering reliability. Papers of Mate '98, the fourth micro joints and mounting technology in electronics symposium: p. 221
  • Tanaka, Hakamada, Sakuyama. A study of solder solidification shapes of chip parts by simulation and the effects on fatigue life. Papers of Mate 2009, the fifteenth micro joints and mounting technology in electronics symposium: p. 165
  • Suzuki, Kan, Shibuya, Miyauchi, Noro. The effects of fillet variations in chip resistors on thermal fatigue life. Papers of Mate 2009, the fifteenth micro joints and mounting technology in electronics symposium, p. 175.s

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