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Articles

Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections

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Pages 51-53 | Published online: 01 Nov 2011

References

  • Novosadov , VS . 1972 . “ The mechanism of formation of a joint using liquid metal adhesives ” . In Scientific problems of joining materials with gallium pastes , 27 – 31 . Moscow : Mashprom, MGP NTO .
  • Tikhomirova , IO . 1972 . “ Theoretical problems of the development of gallium pastes ” . In Scientific problems of joining materials with gallium pastes , 6 – 10 . Moscow : Mashprom, MGP NTO .
  • Tikhomirova , OI and Pikunov , MV . 1969 . Effect of the shape and size of the particles of the second component of the properties of gallium solders . Poroshk Metall. , 12 : 51 – 56 .
  • Temnykh , VI . 2006 . Formation of composite gallium-based structures . Tekhnol Mashinostr. , 8 : 46 – 50 .
  • Temnykh , VI . 2008 . Models of formation of composite structures of the solders based on gallium in solidification . Tekhnol Mashinostr. , 9 : 9 – 1 .
  • Temnykh , VI . 2008 . “ The mechanisms of formation of composite structures of diffusion-hardened solders based on titanium ” . In The theory and practice of technologies of production of components from composite materials and new metallic alloys , (TPKMM), Znanie, Moscow 306 – 310 .

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