References
- Temnykh VI, Kazakov VS, Mityaev AE. Formation of composite structures of solders based on gallium. Tekhnol Mashinostr. 2006;(9):46–50
- Novosadov VS. The mechanism of formation of a joint using the liquid metal adhesives. Scientific problems of joining materials with gallium pastes. Moscow: MGP NTO Mash prom; 1972. p. 27–31
- Tikhomirova OI. Theoretical problems of development of gallium pastes. Scientific problems of joining materials with gallium pastes. Moscow: MGP NTO Mash prom; 1972. p. 6–10
- Temnykh VI, Kazakov VS, Mityayev AE. Models of formation of composite structures of gallium-based solders in solidification. Tekhnol Mashinostr. 2008;(9):63–70
- Ancharov AI, Grigor'ev TF. Interaction of solid solutions of the Cu–In, Cu–Sn and Cu–Bi systems with liquid eutectics of gallium with tin and indium. Neorganicheskie Materialy. 2006;(10):1164–70
- Ancharov AI, Grigorieva TF, Barinov AP. Special features of the interaction of mechanocomposites based on copper with liquid gallium. Faz Perekhody, Uporyadoch Sost Novye Materialy 2006;(4):1–4
- Sommadossi S, Troiani Horacio E, Fernandez Armando. Diffusion soldering using a gallium metallic base as a solder alloyed: study of the phase formation systematic. Journal of Materials Science. 2007;42:9707–12
- Kazakov VS, Temnykh EV. Metallographic studies of the products of interaction of gallium–zinc melts with copper alloys. Youth and science in 21st century. Krasnoyarsk: SFU;2009. p. 83–6
- Hansen M, Anderko K. Structure of the binary alloys, translated from the English: Moscow; 1962