A method for determining the bonding strength of a silver coating with a silicon substrate

V.I. LukinResearch Institute for Aviation Materials, Moscow, Russia

V.S. RylnikovResearch Institute for Aviation Materials, Moscow, Russia

A.N. Afanasiev-KhodykinResearch Institute for Aviation Materials, Moscow, Russia

K.E. KutsevichResearch Institute for Aviation Materials, Moscow, Russia

K.N. NishevN.P. Ogarev Mordovia State University, Saransk, Russia

References

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ZhangZ (Zach), LuG-Q. Pressure assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow. IEEE Trans Ind Appl.2002;4:279–283.
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