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Welding International Volume 30, 2016 - Issue 9
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Articles

Interconnection reliability and interfacial structure between Au alloy bump and Al pad using ultrasonic bondingFootnote*

Shinichi FujiwaraYokohama Research Laboratory, Hitachi Ltd., Japan
,
Masahide HaradaYokohama Research Laboratory, Hitachi Ltd., Japan
&
Yuji FujitaMizusawa Works, Hitachi Media Electronics Co. Ltd., Japan
Pages 653-661 | Published online: 09 Mar 2016

References

  • Elliott P. Intermetallic formation in gold-aluminum systems. Solid-State Electron. 1970;13:1391–1394.
  • Uno T, et al. Reliability of Au/Al bonds and its governing factors. Q. J. Jpn. Weld. Soc. 2001;19:156–166.
  • Mori M, et al. Au–Al solid phase diffusion flip chip bonding. IEICE Trans. Electron. (Japanese Edition) 1996;J79-C2:499–506.
  • Mimura T, et al. Ball bond reliability of Au–Pd alloy wire on Al electrode pads. MES’98:47–54.
  • Funaki T, et al. Effect of additive element on high temperature behavior of interface between Au bump and Al electrode. Mate’99:193–196.
  • The Japan Institute of metals and materials. 3rd revised ed. Maruzen: Metals Databook; 1995. p. 468.
  • Francombe et al. Thin Solid Films;1:353.
  • Recent semiconductor assembly technology; increased reliability and automation. Oyogijutsu Shuppan 1971;168–185.

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