A new method of joining stainless steels using Ni micro-plating bonding and the mechanical properties of the joint

References

• Hamada J, Hayashi A, Kanno N, et al. Development of heat resistant ferritic stainless steels "NSSC 429NF" and "NSSC 448EM" utilized dynamic precipitation hardening for automotive exhaust systems. Materia Jpn. 2017;56(1):33–35. (In Japanese)
   Google Scholar
• Kassai S. Chemical plant (materials). J Jpn Weld Soc. 2014;83(7):566–570. (In Japanese)
   Google Scholar
• Haruhiko K. Stainless steels and high alloys. Mater Environ. 2014;63:151–155. (In Japanese)
   Google Scholar
• Kikuchi M. Recent trend of stainless steel. DENKI-SEIKO, 86-1, 2015. p. 37–44. (In Japanese)
   Google Scholar
• Mukai Y. Welding of stainless steel. Tokyo: The Nikkan Kogyo Shimbun; 1971. p. 85–98.
   Google Scholar
• Jiang W, Gonga J, Tu ST. Effect of brazing temperature on tensile strength and microstructure for a stainless steel plate-fin structure. Mater Des. 2011;32–2:736–742.
   Web of Science ®Google Scholar
• Pandia Rajan S, Senthil Kumaran S, Kumaraswamidhas L. Friction welding of 304 austenitic stainless steel tube to tube plate joints using an external tool. Bull JSME. 2015;9–3:1–8.
   Google Scholar
• Kato N, Hashimoto S, Iizuka T, et al. High-temperature-resistant interconnections formed by using nickel micro-plating and Ni nano-particles for power devices. Trans Jpn Inst Electron Packag. 2013;6(1):87–92.
   Google Scholar
• Tatsumi K, Inagaki M, Kamei K, et al. Development of packaging technology for high temperature resistant SiC module of automobile application. IEEE 67th electronic components and technology conference; 2017. p. 1316–1321.
   Google Scholar
• Tatsumi K, Morisako I, Wada K, et al. High temperature resistant packaging technology for SiC power module by using Ni micro-plating bonding. IEEE 69th electronic components and technology conference; 2019. p. 1451–1456.
   Google Scholar
• Tatsumi K, Tanaka Y, Iizuka T, et al. High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles. 7th electronic system-integration technology conference (ESTC); 2018. p. 125–130.
   Google Scholar
• Hakamada M, Miyazawa N, Kohashi Y, et al. Joining of anodized and stacked aluminum sheets by copper electrodeposition: nano-anchor effect. Mater Trans. 2018;59(2):324–326.
   Web of Science ®Google Scholar
• Naito K, Deguchi S, Hakamada M, et al. New dissimilar joining method of CFRP/A6061 Al by Cu electrodeposition. Mater Trans. 2021;62(5):688–690.
   Web of Science ®Google Scholar
• Fukumoto S, Nakamura K, Takahashi M, et al. Low-temperature bonding of copper by copper electrodeposition. Mater Trans. 2022;63(6):783–788.
   Web of Science ®Google Scholar
• Mochizuki K. Materials catalog for R&D no. 34. Tokyo: The Nilaco Corporation; 2022. p. 100. (In Japanese)
   Google Scholar
• Morikawa T, Nakade T, Yokoi M. Adhesion of plating films and techniques for obtaining good adhesion. J Surf Finish Soc Japan. 2007;58(5):267–274. (in Japanese)
   Google Scholar
• Uchimura T. Master’s thesis, Waseda University; 2021. p. 25–30. (In Japanese)
   Google Scholar
• Hasegawa K, Takada H, Yamaoka S, et al. The increase in hardness of electroplated Ni-P films with heating. J Surf Finish Soc Jpn. 1989;40(3):419–424. (In Japanese)
   Google Scholar
• Fukumaru T, Hidaka H, Tsuchiyama T, et al. Effect of wire diameter and grain size on tensile properties of austenitic stainless steel wire. Tetsu-to-Hagane. 2005;91(11):828–833. (In Japanese)
   Web of Science ®Google Scholar
• Callister WD, Nittono O. Materials science and engineering: an introduction. Tokyo: Baifukan Co., Ltd; 2002. p. 108–111. (In Japanese)
   Google Scholar
• Weast RC, Astle MJ. CRC handbook of chemistry and physics. Boca Raton (FL): CRC Press, Inc; 1981. p. F-57.
   Google Scholar
• Watanabe T. Crystallographic structure of plating films. J Surf Finish Soc Jpn. 1989;40(11):1221–1228. (In Japanese)
   Google Scholar
• Tamakawa K, Sakutani K, Miura H. Effect of micro texture of electroplated copper thin films on their mechanical properties. J Soc Mat Sci Jpn. 2007;56(10):907–912. (In Japanese)
   Google Scholar
• Shibata A, Noda H, Sone M, et al. Microstructural development of an electrodeposited Ni layer. Thin Solid Films. 2010;518(18):5153–5158.
   Web of Science ®Google Scholar
• Murata N, Tamagawa K, Suzuki K, et al. Effect of the nano-scale texture of electroplated copper thin films on their mechanical properties. 23rd electronics packaging conference; 2009.
   Google Scholar