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Original Articles

THE IMPROVEMENT OF PCB DESIGN AND ASSEMBLY FOR NOTEBOOK COMPUTER APPLICATIONS THROUGH THE USE OF DESIGN FOR EXPERIMENT

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Pages 23-32 | Received 01 Sep 2001, Accepted 01 Mar 2002, Published online: 15 Feb 2010

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  • Szekely , V. , Rencz , M. and Courtois , B. 1997 . Thermal Transient Testing . Microelectronics International , 14 ( 2 ) : 8 – 10 .

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