Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks

REFERENCES

• ITRS, International Technology Roadmap for Semiconductors, 2008, http://www.itrs.net/Links/2008ITRS/home2008.htm.
   Google Scholar
• F. P. Incropera , Liquid Cooling of Electronic Devices by Single-Phase Convection , John Wiley & Sons , New York , 1999 .
   Google Scholar
• D. S. Steinberg , Cooling Techniques for Electronic Equipment , John Wiley & Sons , New York , 1980 .
   Google Scholar
• D. B. Tuckerman and R. F. W. Pease , High-Performance Heat Sinking for VLSI , IEEE Electronic Device Letter , vol. EDL_2 , pp. 126 – 129 , 1981 .
   Web of Science ®Google Scholar
• R. J. Philips , Forced-Convection, Liquid-Cooled Microchannel Heat Sinks, Ph.D. Dissertation, MIT, 1988
   Google Scholar
• M. E. Steinke , S. G. Kandikar , J. H. Magerlein , E. G. Colgan , and A. D. Raisanen , Development of an Experimental Facility for Investigating Single Phase Liquid Flow in Microchannels , Heat Transfer Eng. , vol. 27 , no. 4 , pp. 41 – 52 , 2006 .
   Web of Science ®Google Scholar
• L. Zhang , J. M. Koo , L. Jiang , K. E. Goodson , J. G. Santiago , and T. W. Kenny , Measurements and Modeling of Two-Phase Flow in Microchannels with Nearly Constant Heat Flux Boundary Conditions , J. Microelectromechanical Systems , vol. 11 , no. 1 , pp. 1057 – 7157 , 2002 .
   Google Scholar
• M. E. Steinke and S. G. Kandlikar , Review of Single-Phase Heat Transfer Enhancement Techniques for Application in Microchannels, Minichannels and Microdevices , Int. J. Heat Technology , vol. 22 , no. 2 , pp. 1 – 10 , 2004 .
   Google Scholar
• S. G. Kandlikar , High Flux Heat Removal with Microchannels—A Roadmap of Challenges and Opportunities , Heat Transfer Eng. , vol. 26 , no. 8 , pp. 5 – 14 , 2005 .
   Web of Science ®Google Scholar
• A. E. Bergles and S. G. Kandlikar , On the Nature of Critical Heat Flux in Microchannels , J. Heat Transfer , vol. 127 , pp. 101 – 107 , 2005 .
   Web of Science ®Google Scholar
• H. Y. Wu and P. Cheng , An Experimental Study of Convective Heat Transfer in Silicon Microchannels with Different Surface Conditions , Int. J. Heat and Mass Transfer , vol. 46 , pp. 2547 – 2556 , 2003 .
   Web of Science ®Google Scholar
• W. Qu and I. Mudawar , Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single-Phase Micro-Channel Heat Sink , Int. J. Heat and Mass Transfer , vol. 45 , pp. 2549 – 2565 , 2002 .
   Web of Science ®Google Scholar
• X. Wei and Y. Joshi , Experimental and Numerical Study of Sidewall Profile Effects on Flow and Heat Transfer inside Microchannels , Int. J. Heat and Mass Transfer , vol. 50 , pp. 4640 – 4651 , 2007 .
   Web of Science ®Google Scholar
• K. R. Williams and R. S. Muller , Etch Rates for Micromachining Processing , J. Microelectromechanical Systems , vol. 5 , no. 4 , pp. 256 – 269 , 1996 .
   Web of Science ®Google Scholar
• J. Zhang , S. Prakash , Y. Jaluria , and L. Lin , An Experimental Study on the Effect of Configuration of Multiple Microchannels on Heat Removal for Electronic Cooling, Proc. Int. Heat Transfer Conf., IHTC-14, Washington D.C., ASME Press, NY, 2010.
   Google Scholar
• J. Zhang , Y. Jaluria , T. T. Zhang , and L. Jia , Combined Experimental and Numerical Study for Multiple Microchannel Heat Transfer System, Proc. Int. Heat Transfer Conf., IHTC-14, Washington D.C., ASME Press, NY, 2010.
   Google Scholar
• T. T. Zhang , L. Jia , J. Zhang , and Y. Jaluria , Numerical Simulation of Fluid Flow and Heat Transfer in U-Shaped Microchannels, Proc. Int. Mech. Eng. Cong. Expo., Vancouver, CA, ASME Press, NY, 2010 .
   Google Scholar