Analysis of micro-channel heat sinks with rectangular-shaped flow obstructions

References

• R. Tummala, Fundamentals of Microsystems Packaging, McGraw-Hill, New York, NY, 2001.
   Google Scholar
• T. P. Cotter, Principles and Prospects for Micro Heat Pipes, 5th Int. Heat Pipe Conf., Tsukuba, Ibaraki, Japan, pp. 325–328, May 14–18, 1984.
   Google Scholar
• R. E. Simons and R. C. Chu, Application of Thermoelectric Cooling to Electronic Equipment: A Review and Analysis, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, NY, USA, 2000.
   Google Scholar
• D. B. Tucker and R. F. W. Pease, High-Performance Heat Sinking for VLSI, IEEE Electron Device Lett., vol. 2, pp. 126–129, 1981.
   Web of Science ®Google Scholar
• E. S. Cho, J. W. Chio, J. S. Yoon, and M. S. Kim, Experimental Study on Micro-Channel Heat Sinks Considering Mass Flow Distribution with Non-Uniform Heat Flux Conditions, Int. J. Heat Mass Transfer, vol. 53, pp. 2159–2168, 2010.
   Web of Science ®Google Scholar
• B. Rimbault, C. T. Nguyen, and N. Galanis, Experimental Investigation of CuO-Water Nonfluid Flow and Heat Transfer Inside a Microchannel Heat Sink, Int. J. Therm. Sci., vol. 84, pp. 275–292, 2014.
   Web of Science ®Google Scholar
• D. Liu and S. V. Garimella, Analysis and Optimization of the Thermal Performance of Micro-Channel Heat Sinks, Int. J. Numer. Methods Heat Fluid Flow, vol. 15, pp. 7–26, 2005.
   Web of Science ®Google Scholar
• M. Mital, Analytical Analysis of Heat Transfer and Pumping Power of Laminar Nanofluid Developing Flow in Micro-channels, Appl. Therm. Eng., vol. 50, pp. 429–436, 2013.
   Web of Science ®Google Scholar
• Y. P. Chen, C. B. Zhang, M. H. Shi, and J. F. Wu, Three-Dimensional Numerical Simulation of Heat and Fluid Flow in Noncircular Micro-Channel Heat Sinks, Int. Commun. Heat Mass Transfer, vol. 36, pp. 917–920, 2009.
   Web of Science ®Google Scholar
• H. A. Mohammed, P. Gunnasegaran, and N. H. Shuaib, Numerical Simulation of Heat Transfer Enhancement in Wavy Micro-Channel Heat Sink, Int. Commun. Heat Mass Transfer, vol. 38, pp. 63–68, 2011.
   Web of Science ®Google Scholar
• P. S. Lee, S. V. Garimella, and D. Liu, Investigation of Heat Transfer in Rectangular Micro-Channels, Int. J. Heat Mass Transfer, vol. 48, pp. 1688–1704, 2005.
   Web of Science ®Google Scholar
• P. S. Lee and S. V. Garimella, Thermally Developing Flow and Heat Transfer in Rectangular Micro-Channels, Int. J. Heat Mass Transfer, vol. 49, pp. 3060–3067, 2006.
   Web of Science ®Google Scholar
• X. F. Peng and G. P. Peterson, Convective Heat Transfer and Flow Friction for Water Flow in Micro-Channel Structures, Int. J. Heat Mass Transfer, vol. 39, pp. 2599–2608, 1996.
   Web of Science ®Google Scholar
• R. W. Knight, J. S. Gooding, and D. J. Hall, Optimal Thermal Design of Forced Convection Heat Sinks-Analytical, ASME J. Electron. Packag., vol. 113, pp. 1218–1221, 1991.
   Google Scholar
• R. J. Phillips, Forced Convection, Liquid cooled, micro-channel heat sinks, M.S. Thesis, Dept. of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, 1987.
   Google Scholar
• A. Weisberg, H. B. Haim, and J. N. Zemel, Analysis of Micro-Channels for Integrated Cooling, Int. J. Heat Mass Transfer, vol. 35, pp. 2465–2474, 1992.
   Web of Science ®Google Scholar
• A. G. Fedorov and R. Viskanta, Three-Dimensional Conjugate Heat Transfer in the Micro-Channel Heat Sink for Electronic Packaging, Int. J. Heat Mass Transfer, vol. 43, pp. 399–415, 2000.
   Web of Science ®Google Scholar
• S. G. Kandlikar and H. R. Upadhye, Extending the heat flux limit with enhanced micro-channels in direct single-phase cooling of computer chips, IEEE Semi-Therm 21, San Jose, USA, 2005.
   Google Scholar
• X. L. Xie, Z. J. Liu, Y. L. He and W. Q. Tao, Numerical Study of Laminar Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink, Appl. Therm. Eng., vol. 29, pp. 64–74, 2009.
   Web of Science ®Google Scholar
• X. L. Xie, W. Q. Tao, and Y. L. He, A Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in Water-Cooled Minichannel Heat Sink, ASME J. Electron. Packag., vol. 129, pp. 247–255, 2007.
   Web of Science ®Google Scholar
• G. N. Xie, Z. Y. Chen, B. Sunden, and W. H. Zhang, Numerical Predictions of the Flow and Thermal Performance of Water-Cooled Single-Layer and Double-Layer Wavy Micro-Channel Heat Sinks, Numer. Heat Transfer–Part A, vol. 63, pp. 201–225, 2013.
   Web of Science ®Google Scholar
• G. N. Xie, Z. Y. Chen, B. Sunden, and W. H. Zhang, Comparative Study of the Flow and Thermal Performance of Liquid-Cooling Parallel-Flow and Counter-Flow Double-Layer Wavy Micro-Channel Heat Sinks, Numer. Heat Transfer–Part A, vol. 64, pp. 30–55, 2013.
   Web of Science ®Google Scholar
• X. D. Wang, B. An, and J. L. Xu, Optimal Geometric Structure for Nanofluid-Cooled Microchannel Heat Sink Under Various Constraint Conditions, Energy Convers. Manage., vol. 65, pp. 528–538, 2013.
   Web of Science ®Google Scholar
• X. D. Wang, B. An, L. Lin, and D. J. Lee, Inverse Geometric Optimization for Geometry of Nanofluid-Cooled Microchannel Heat Sink, Appl. Therm. Eng., vol. 55, pp. 87–94, 2013.
   Web of Science ®Google Scholar
• A. Bejan, Shape and Structure, From Engineering to Nature, Cambridge University Press, Cambridge, UK, 2000.
   Google Scholar
• A. Bejan and M. R. Errera, Deterministic Tree Networks for Fluid Flow: Geometry for Minimal Flow Resistance Between a Volume and One Point, Fractals, vol. 5, pp. 685–695, 1997.
   Web of Science ®Google Scholar
• A. Bejan and M. R. Errera, Convective Trees of Fluid Channels for Volumetric Cooling, Int. J. Heat Mass Transfer, vol. 43, pp. 3105–3118, 2000.
   Web of Science ®Google Scholar
• L. Ghodoossi and N. Egrican, Exact Solution for Cooling of Electronics Using Constructal Theory, J. Appl. Phys., vol. 93, pp. 4922–4929, 2003.
   Web of Science ®Google Scholar
• Y. Chen and P. Cheng, Heat Transfer and Pressure Drop in Fractal Treelike Microchannel Nets, Int. J. Heat Mass Transfer, vol. 45, pp. 2643–2648, 2002.
   Web of Science ®Google Scholar
• G. N. Xie, F. L. Zhang, B. Sunden, and W. H. Zhang, Constructal Design and Thermal Analysis of Micro-Channel Heat Sinks with Multistage Bifurcations in Single-Phase Liquid Flow, Appl. Therm. Eng., vol. 62, pp. 791–802, 2014.
   Web of Science ®Google Scholar
• Y. L. Li, F. L. Zhang, B. Sunden, and G. N. Xie, Laminar Thermal Performance of Micro-Channel Heat Sinks with Constructal Vertical Y-Shaped Bifurcation Plates, Appl. Therm. Eng., vol. 73, pp. 183–193, 2014.
   Web of Science ®Google Scholar
• K. Vafai and L. Zhu, Analysis of Two-Layered Micro-Channel Heat Sink Concept in Electronic Cooling, Int. J. Heat Mass Transfer, vol. 42, pp. 2287–2297, 1999.
   Web of Science ®Google Scholar
• L. Lin, Y. Y. Chen, X. X. Zhang, and X. D. Wang, Optimization of Geometry and Flow Rate Distribution for Double-Layer Microchannel Heat Sink, Int. J. Therm. Sci., vol. 78, pp. 158–168, 2014.
   Web of Science ®Google Scholar
• Y. Peles, A. Kosar, C. Mishra, Chin-Jung Kuo, and B. Schneider, Forced Convective Heat Transfer Across a Pin Fin Micro Heat Sink, Int. J. Heat Mass Transfer, vol. 48, pp. 3615–3627, 2005.
   Web of Science ®Google Scholar
• H. Shafeie, O. Abouali, K. Jafarpur, and G. Ahmadi, Numerical Study of Heat Transfer Performance of Single-Phase Heat Sinks with Micro Pin-Fin Structures, Appl. Therm. Eng., vol. 58, pp. 68–76, 2013.
   Web of Science ®Google Scholar
• G. Joyce, H. M. Soliman, Analysis of the Transient Single-Phase Thermal Performance of Micro-Channel Heat Sinks, Heat Transfer Eng., vol. 30, pp. 1058–1067, 2009.
   Web of Science ®Google Scholar
• P. S. Lee, J. C. Ho, H. Xue, Experimental study on laminar heat transfer in microchannel heat sink, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 379–386, 2002.
   Google Scholar