Publication Cover
Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 69, 2016 - Issue 11
128
Views
2
CrossRef citations to date
0
Altmetric
Original Articles

Optimization of the cooling characteristics in high-voltage LEDs

, , , , &
Pages 1242-1252 | Received 12 Jul 2015, Accepted 31 Oct 2015, Published online: 02 May 2016

References

  • E. F. Schubert and J. K. Kim, Solid-State Light Sources Getting Smart, Science, vol. 308, pp. 1274–1278, 2005.
  • D. Gacio, J. M. Alonso, J. Garcia, M. S. Perdigão, E. S. Saraiva, and F. E. Bisogno, Effects of The Junction Temperature on the Dynamic Resistance of White LEDs, IEEE Trans. Ind. Appl., vol. 49, pp. 750–760, 2013.
  • S. Chhajed, Y. Xi, Y. L. Li, T. Gessmann, and E. F. Schubert, Influence of Junction Temperature on Chromaticity, and Color-Rendering Properties of Trichromatic White-Light Sources Based on Light-Emitting Diodes, Appl. Phys. Lett., vol. 97, pp. 054506-1–054506-8, 2005.
  • D.-W. Kim, E. Rahim, A. Bar-Cohen, and B. Han, Direct Submount Cooling of High-Power LEDs, IEEE Trans. Compon. Packag. Technol., vol. 33, pp. 698–712, 2010.
  • A. Chakraborty, L. Shen, H. Masui, S. P. DenBaars, and U. K. Mishra, Interdigitated Multi Pixel Arrays for the Fabrication of High-Power Light-Emitting Diodes with Very Low Series Resistances, Appl. Phys. Lett., vol. 88, pp. 181120-1–181120-3, 2006.
  • G. Comini, C. Nonino, and S. Savino, Modeling of Coupled Conduction and Convection in Moist Air Cooling, Numer. Heat Transfer A, vol. 51, pp. 23–37, 2007.
  • Y. G. Park, M. Y. Ha, and J. Park, Natural Convection in a Square Enclosure with Four Circular Cylinders Positioned at Different Rectangular Locations, Int. J. Heat Mass Transfer, vol. 81, pp. 490–551, 2015.
  • Z. Huang, W. Zhang, and G. Xi, Natural Convection in Square Enclosure Induced by Inner Circular Cylinder with Time-Periodic Pulsating Temperature, Int. J. Heat Mass Transfer, vol. 82, pp. 16–25, 2015.
  • G. Comini, C. Nonino, and S. Savino, Numerical Simulation of Laminar Forced Convection in an Air-Cooled Horizontal Printed Circuit Board Assembly, Numer. Heat Transfer A, vol. 37, pp. 373–393, 2000.
  • T. Wang, X. C. Li, and V. Pinninti, Simulation of Mist Transport for Gas Turbine Inlet Air Cooling, Numer. Heat Transfer A, vol. 53, pp. 1013–1036, 2008.
  • E. Bari, J. Y. Noel, G. Comini, and G. Cortella, Air-Cooled Condensing Systems for Home and Industrial Appliances, Appl. Therm. Energy, vol. 25, pp. 1466–1458, 2005.
  • A. Ghazy and D. J. Bergstrom, Numerical Simulation of Heat Transfer in Firefighters’ Protective Clothing with Multiple Air Gaps during Flash Fire Exposure, Numer. Heat Transfer A, vol. 61, pp. 569–593, 2012.
  • Y. Chen, M. Fiebig, and N. K. Mitra, Conjugate Heat Transfer of a Finned Oval Tube. Part A: Flow Patterns, Numer. Heat Transfer A, vol. 33, pp. 371–385, 1998.
  • M. Fiebig, A. Grosse-Gorgemann, Y. Chen, and N. K. Mitra, Conjugate Heat Transfer of a Finned Tube. Part A: Heat Transfer Behaviour and the Occurrence of Heat Transfer Reversal, Numer. Heat Transfer A, vol. 28, pp. 133–146, 1995.
  • A. J. Chamkha and M. A. Ismael, Conjugate Heat Transfer in a Porous Cavity Heated by a Triangular Thick Wall, Numer. Heat Transfer A, vol. 63, pp. 144–158, 2013.
  • M. B. Ben Hamida and K. Charrada, Natural Convection Heat Transfer in an Enclosure Filled with an Ethylene Glycol—Copper Nanofluid Under Magnetic Fields, Numer. Heat Transfer A, vol. 67, pp. 902–920, 2015.
  • Fatih Selimefendigil and Hakan F. Öztop, Soft Computing Methods for Thermo-Acoustic Simulation, Heat Transfer A, vol. 66, pp. 271–288, 2014.
  • T. M. Shih Numerical Heat Transfer, Springer-Verlag, New York, pp. 17–27, 1984.
  • B. G. Galerkin, Rods and Plates, Series in Some Problems of Elastic Equilibrium of Rods and Plates, Vestn. Inzh. Tekh, vol. 19, pp. 897–908, 1915.
  • J. H. Zhang, B. Q. Wu, T. M. Shih, Y. J. Lu, Y. L. Gao, R. R. G. Chang, and Z. Chen, Thermal Analyses of Alternating Current Light-Emitting Diodes, Appl. Phys. Lett., vol. 103, pp. 153505-1–153505-4, 2013.
  • Y. Xi and E. F. Schubert, Junction–Temperature Measurement in GaN Ultraviolet Light-Emitting Diodes Using Diode Forward Voltage Method, Appl. Phys. Lett., vol. 85, pp. 2163–2165, 2004.
  • S. Q. Lin, T. M. Shih, Y. J. Lu, Y. L. Gao, L. H. Zhu, G. L. Chen, B. Q. Wu, Z. Q. Guo, J. H. Zhang, X. G. Fan, R. R. G. Chang, and Z. Chen, Determining Junction Temperature in In GaN Light-Emitting Diodes Using Low Forward Currents, IEEE Trans. Electro Dev., vol. 60, pp. 3775–3779, 2013.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.