Publication Cover
Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 76, 2019 - Issue 11
303
Views
23
CrossRef citations to date
0
Altmetric
Original Articles

Thermal enhancement of microchannel heat sink using rib surface refinements

, , , &
Pages 851-870 | Received 17 Jun 2019, Accepted 23 Sep 2019, Published online: 07 Oct 2019

References

  • D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for VLSI,” IEEE Electron Device Lett., vol. 2, no. 5, pp. 126–129, 1981. DOI: 10.1109/EDL.1981.25367.
  • J. Hongqi, Z. Li, N. Yuxi, Z. Junjie, L. Suping, and M. Xiaoyu, “Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics,” J. Semiconductors, vol. 36, no. 10, pp. 102006, 2015.
  • A. Abdollahi, R. N. Sharma, H. A. Mohammed, and A. Vatani, “Heat transfer and flow analysis of Al2O3-Water nanofluids in interrupted microchannel heat sink with ellipse and diamond ribs in the transverse microchambers,” Heat Transfer Eng., vol. 39, no. 16, pp. 1461–1469, 2018. DOI: 10.1080/01457632.2017.1379344.
  • R. Chein and J. Chuang, “Experimental microchannel heat sink performance studies using nanofluids,” Int. J. Therm. Sci., vol. 46, no. 1, pp. 57–66, 2007. DOI: 10.1016/j.ijthermalsci.2006.03.009.
  • A. Kumar, S. Nath, and D. Bhanja, “Effect of nanofluid on thermo hydraulic performance of double layer tapered microchannel heat sink used for electronic chip cooling,” Numer. Heat Transfer A Appl., vol. 73, no. 7, pp. 429–445, 2018. DOI: 10.1080/10407782.2018.1448611.
  • C. J. Ho, L. Wei, and Z. Li, “An experimental investigation of forced convective cooling performance of a microchannel heat sink with Al2O3/water nanofluid,” Appl. Therm. Eng., vol. 30, no. 2–3, pp. 96–103, 2010. DOI: 10.1016/j.applthermaleng.2009.07.003.
  • W. Qu and I. Mudawar, “Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks,” IEEE Trans. Comp. Pack. Technol., vol. 26, no. 3, pp. 598–609, 2003.
  • A. G. Fedorov and R. Viskanta, “Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging,” Int. J. Heat Mass Transfer, vol. 43, no. 3, pp. 399–415, 2000. DOI: 10.1016/S0017-9310(99)00151-9.
  • H. Wang, Z. Chen, and J. Gao, “Influence of geometric parameters on flow and heat transfer performance of micro-channel heat sinks,” Appl. Therm. Eng., vol. 107, pp. 870–879, 2016. DOI: 10.1016/j.applthermaleng.2016.07.039.
  • A. Dewan and P. Srivastava, “A review of heat transfer enhancement through flow disruption in a microchannel,” J. Therm. Sci., vol. 24, no. 3, pp. 203–214, 2015. DOI: 10.1007/s11630-015-0775-1.
  • G. Xia, L. Chai, H. Wang, M. Zhou, and Z. Cui, “Optimum thermal design of microchannel heat sink with triangular reentrant cavities,” Appl. Therm. Eng., vol. 31, no. 6–7, pp. 1208–1219, 2011. DOI: 10.1016/j.applthermaleng.2010.12.022.
  • G. Wang, D. Niu, F. Xie, Y. Wang, X. Zhao, and G. Ding, “Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling,” Appl. Therm. Eng., vol. 85, pp. 61–70, 2015. DOI: 10.1016/j.applthermaleng.2015.04.009.
  • A. A. Khan, S. M. Kim, and K. Y. Kim, “Performance analysis of a microchannel heat sink with various rib configurations,” J. Thermophys. Heat Transfer, vol. 30, no. 4, pp. 782–790, 2016. DOI: 10.2514/1.T4663.
  • A. Abdoli, G. Jimenez, and G. S. Dulikravich, “Thermo-fluid analysis of micro pin-fin array cooling configurations for high heat fluxes with a hot spot,” Int. J. Therm. Sci., vol. 90, pp. 290–297, 2015. DOI: 10.1016/j.ijthermalsci.2014.12.021.
  • D. Ansari and K. Y. Kim, “Hotspot management using a hybrid heat sink with stepped pin-fins,” Numer. Heat Transfer A Appl., vol. 75, no. 6, pp. 359–380, 2019. DOI: 10.1080/10407782.2019.1599272.
  • L. Chai, G. D. Xia, and H. S. Wang, “Parametric study on thermal and hydraulic characteristics of laminar flow in microchannel heat sink with fan-shaped ribs on sidewalls – part 1: heat transfer,” Int. J. Heat Mass Transfer, vol. 97, pp. 1069–1080, 2016. DOI: 10.1016/j.ijheatmasstransfer.2016.02.077.
  • G. Xia, Y. Jia, Y. Li, D. Ma, and B. Cai, “Numerical simulation and multiobjective optimization of a microchannel heat sink with arc-shaped grooves and ribs,” Numer. Heat Transfer A Appl., vol. 70, no. 9, pp. 1041–1055, 2016. DOI: 10.1080/10407782.2016.1230394.
  • I. A. Ghani, N. Kamaruzaman, and N. A. C. Sidik, “Heat transfer augmentation in a microchannel heat sink with sinusoidal cavities and rectangular ribs,” Int. J. Heat Mass Transfer, vol. 108, pp. 1969–1981, 2017. DOI: 10.1016/j.ijheatmasstransfer.2017.01.046.
  • Y. Li, G. Xia, D. Ma, Y. Jia, and J. Wang, “Characteristics of laminar flow and heat transfer in microchannel heat sink with triangular cavities and rectangular ribs,” Int. J. Heat Mass Transfer, vol. 98, pp. 17–28, 2016. DOI: 10.1016/j.ijheatmasstransfer.2016.03.022.
  • Y. Zhai, G. Xia, X. Liu, and Y. Li, “Exergy analysis and performance evaluation of flow and heat transfer in different micro heat sinks with complex structure,” Int. J. Heat Mass Transfer, vol. 84, pp. 293–303, 2015. DOI: 10.1016/j.ijheatmasstransfer.2015.01.039.
  • Y. Zhai, G. Xia, X. Liu, and Y. Li, “Heat transfer in the microchannels with fan-shaped reentrant cavities and different ribs based on field synergy principle and entropy generation analysis,” Int. J. Heat Mass Transfer, vol. 68, pp. 224–233, 2014. DOI: 10.1016/j.ijheatmasstransfer.2013.08.086.
  • P. Li, Y. Luo, D. Zhang, and Y. Xie, “Flow and heat transfer characteristics and optimization study on the water-cooled microchannel heat sinks with dimple and pin-fin,” Int. J. Heat Mass Transfer, vol. 119, pp. 152–162, 2018. DOI: 10.1016/j.ijheatmasstransfer.2017.11.112.
  • Y. Li, G. Xia, Y. Jia, D. Ma, B. Cai, and J. Wang, “Effect of geometric configuration on the laminar flow and heat transfer in microchannel heat sinks with cavities and fins,” Numer. Heat Transfer A Appl., vol. 71, no. 5, pp. 528–546, 2017. DOI: 10.1080/10407782.2016.1277940.
  • M. B. Turgay and A. G. Yazıcıoğlu, “Numerical simulation of fluid flow and heat transfer in a trapezoidal microchannel with COMSOL multiphysics: a case study,” Numer. Heat Transfer A Appl., vol. 73, no. 5, pp. 332–346, 2018. DOI: 10.1080/10407782.2017.1420302.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.