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Numerical Heat Transfer, Part A: Applications
An International Journal of Computation and Methodology
Volume 81, 2022 - Issue 1-2
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Original Articles

Numerical analysis on nanoscale thermal cloak in three-dimensional silicon film with circular cavities

, , , &
Pages 1-14 | Received 14 Jul 2021, Accepted 29 Jul 2021, Published online: 30 Aug 2021

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