Effect of filling ratio, number of loops, and transverse distance on the performance of pulsating heat pipe in a microchannel heat sink

References

• M. Ahmadian-Elmi, E. Rasouli, K. Vafai, and S. S. Nourazar, “Parametric investigation of a rectangular microchannel utilizing the internal longitudinal fins to enhance its hydraulic and thermal characteristics,” Int. Commun. Heat Mass Transf., vol. 133, p. 105946, 2022. DOI: 10.1016/j.icheatmasstransfer.2022.105946.
   Web of Science ®Google Scholar
• M. Ahmadian-Elmi, M. Mohammadifar, K. Vafai, and S. S. Nourazar, “Investigation of the optimal configuration of a highly conductive material embedded in a triangular fin,” Numer. Heat Transf. A Appl., vol. 83, no. 8, pp. 919–934, 2023. DOI: 10.1080/10407782.2022.2157352.
   Web of Science ®Google Scholar
• A. Ghahremannezhad and K. Vafai, “Thermal and hydraulic performance enhancement of microchannel heat sinks utilizing porous substrates,” Int. J. Heat Mass Transf., vol. 122, pp. 1313–1326, 2018. DOI: 10.1016/j.ijheatmasstransfer.2018.02.024.
   Web of Science ®Google Scholar
• D. Deng, L. Zeng, and W. Sun, “A review on flow boiling enhancement and fabrication of enhanced microchannels of microchannel heat sinks,” Int. J. Heat Mass Transf., vol. 175, p. 121332, 2021. DOI: 10.1016/j.ijheatmasstransfer.2021.121332.
   Web of Science ®Google Scholar
• H. M. Ali, “Applications of combined/hybrid use of heat pipe and phase change materials in energy storage and cooling systems: a recent review,” J. Energy Storage, vol. 26, p. 100986, 2019. DOI: 10.1016/j.est.2019.100986.
   Web of Science ®Google Scholar
• D. B. Tuckerman and R. F. W. Pease, “High-performance heat sinking for VLSI,” IEEE Electron. Dev. Lett., vol. 2, no. 5, pp. 126–129, 1981. DOI: 10.1109/EDL.1981.25367.
   Web of Science ®Google Scholar
• S. Lu and K. Vafai, “A comparative analysis of innovative microchannel heat sinks for electronic cooling,” Int. Commun. Heat Mass Transf., vol. 76, pp. 271–284, 2016. DOI: 10.1016/j.icheatmasstransfer.2016.04.024.
   Web of Science ®Google Scholar
• A. Ghahremannezhad, H. Xu, M. Alhuyi Nazari, M. Hossein Ahmadi, and K. Vafai, “Effect of porous substrates on thermohydraulic performance enhancement of double layer microchannel heat sinks,” Int. J. Heat Mass Transf., vol. 131, pp. 52–63, 2019. DOI: 10.1016/j.ijheatmasstransfer.2018.11.040.
   Web of Science ®Google Scholar
• M. Lori and K. Vafai, “Thermal and hydraulic performance of rectangular microchannel heat sinks with trapezoidal porous configuration,” Numer. Heat Transf. A: Appl., vol. 81, no. 3-6, pp. 72–93, 2022. DOI: 10.1080/10407782.2022.2038969.
   Web of Science ®Google Scholar
• M. S. Lori and K. Vafai, “Heat transfer and fluid flow analysis of microchannel heat sinks with periodic vertical porous ribs,” Appl. Therm. Eng., vol. 205, p. 118059, 2022. DOI: 10.1016/j.applthermaleng.2022.118059.
   Web of Science ®Google Scholar
• D.-Y. Lee and K. Vafai, “Comparative analysis of jet impingement and microchannel cooling for high heat flux applications,” Int. J. Heat Mass Transf., vol. 42, no. 9, pp. 1555–1568, 1999. DOI: 10.1016/S0017-9310(98)00265-8.
   Web of Science ®Google Scholar
• K. Vafai and L. Zhu, “Analysis of two-layered micro-channel heat sink concept in electronic cooling,” Int. J. Heat Mass Transf., vol. 42, no. 12, pp. 2287–2297, 1999. DOI: 10.1016/S0017-9310(98)00017-9.
   Web of Science ®Google Scholar
• K. Vafai and A.-R. Khaled, “Analysis of flexible microchannel heat sink systems,” Int. J. Heat Mass Transf., vol. 48, no. 9, pp. 1739–1746, 2005. DOI: 10.1016/j.ijheatmasstransfer.2004.11.020.
   Web of Science ®Google Scholar
• A.-R. Khaled and K. Vafai, “Cooling augmentation using microchannels with rotatable separating plates,” Int. J. Heat Mass Transf., vol. 54, no. 15–16, pp. 3732–3739, 2011. DOI: 10.1016/j.ijheatmasstransfer.2011.02.054.
   Web of Science ®Google Scholar
• M. Pan, P. Huang, and K. Vafai, “Investigation of the blockage conditions in a laminated-sheet microchannel reactor,” Chem. Eng. Technol., vol. 40, no. 12, pp. 2283–2294, 2017. DOI: 10.1002/ceat.201700189.
   Web of Science ®Google Scholar
• S. Lu and K. Vafai, “Thermal performance optimization of the 3D ICs employing the integrated chip-size double-layer or multi-layer microchannels,” J. Heat Transf., vol. 145, p. 032501, 2022. DOI: 10.1115/1.4055245.
   Web of Science ®Google Scholar
• A. Rajalingam and S. Chakraborty, “Effect of micro-structures in a microchannel heat sink – a comprehensive study,” Int. J. Heat Mass Transf., vol. 154, p. 119617, 2020. DOI: 10.1016/j.ijheatmasstransfer.2020.119617.
   Web of Science ®Google Scholar
• M. Vajdi, F. Sadegh Moghanlou, E. Ranjbarpour Niari, M. Shahedi Asl, and M. Shokouhimehr, “Heat transfer and pressure drop in a ZrB2 microchannel heat sink: a numerical approach,” Ceram. Int., vol. 46, no. 2, pp. 1730–1735, 2020. DOI: 10.1016/j.ceramint.2019.09.146.
   Web of Science ®Google Scholar
• S. Y. Jung and H. Park, “Experimental investigation of heat transfer of Al2O3 nanofluid in a microchannel heat sink,” Int. J. Heat Mass Transf., vol. 179, p. 121729, 2021. DOI: 10.1016/j.ijheatmasstransfer.2021.121729.
   Web of Science ®Google Scholar
• A. Yildizeli and S. Cadirci, “Multi objective optimization of a micro-channel heat sink through genetic algorithm,” Int. J. Heat Mass Transf., vol. 146, p. 118847, 2020. DOI: 10.1016/j.ijheatmasstransfer.2019.118847.
   Web of Science ®Google Scholar
• P. Bhandari and Y. K. Prajapati, “Thermal performance of open microchannel heat sink with variable pin fin height,” Int. J. Therm. Sci., vol. 159, p. 106609, 2021. DOI: 10.1016/j.ijthermalsci.2020.106609.
   Web of Science ®Google Scholar
• Y. H. Pan, R. Zhao, X. H. Fan, Y. L. Nian, and W. L. Cheng, “Study on the effect of varying channel aspect ratio on heat transfer performance of manifold microchannel heat sink,” Int. J. Heat Mass Transf., vol. 163, p. 120461, 2020. DOI: 10.1016/j.ijheatmasstransfer.2020.120461.
   Web of Science ®Google Scholar
• W. Sanhan, K. Vafai, N. Kammuang-Lue, P. Terdtoon, and P. Sakulchangsatjatai, “Numerical simulation of flattened heat pipe with double heat sources for CPU and GPU cooling application in laptop computers,” J. Comput. Des. Eng., vol. 8, no. 2, pp. 524–535, 2021. DOI: 10.1093/jcde/qwaa091.
   Web of Science ®Google Scholar
• S. Maneemuang, K. Vafai, N. Kammuang-Lue, P. Terdtoon, and P. Sakulchangsatjatai, “Analysis of the optimum configuration for the capillary rise and the permeability of the fiber wick structure for heat removal in heat pipes,” Heat Mass Transf., vol. 57, no. 9, pp. 1513–1526, 2021. DOI: 10.1007/s00231-021-03025-w.
   Web of Science ®Google Scholar
• M. H. Zolfagharnasab, M. Z. Pedram, and K. Vafai, “A robust single-phase approach for the numerical simulation of heat pipe,” Int. Commun. Heat Mass Transf., vol. 132, p. 105894, 2022. DOI: 10.1016/j.icheatmasstransfer.2022.105894.
   Web of Science ®Google Scholar
• M. Siritan, K. Vafai, N. Kammuang-Lue, P. Terdtoon, and P. Sakulchangsatjatai, “An innovative design for a solar water heating system utilizing a flat-shaped heat pipe,” J. Sol. Energy Eng., vol. 145, no. 5, pp. 1–18, 2023. DOI: 10.1115/1.4056624.
   Web of Science ®Google Scholar
• S. Lu and K. Vafai, “Optimization of the thermal performance of three-dimensional integrated circuits utilizing rectangular-shaped and disk-shaped heat pipes,” J. Heat Transf., vol. 144, no. 6, p. 061901, 2022. DOI: 10.1115/1.4053803.
   Web of Science ®Google Scholar
• V. S. Nikolayev, “Physical principles and state-of-the-art of modeling of the pulsating heat pipe: a review,” Appl. Therm. Eng., vol. 195, p. 117111, 2021. DOI: 10.1016/j.applthermaleng.2021.117111.
   Web of Science ®Google Scholar
• H. Y. Noh and S. J. Kim, “Numerical simulation of pulsating heat pipes: Parametric investigation and thermal optimization,” Energy Convers. Manag., vol. 203, p. 112237, 2020. DOI: 10.1016/j.enconman.2019.112237.
   Web of Science ®Google Scholar
• Y. Xu, Y. Xue, H. Qi, and W. Cai, “Experimental study on heat transfer performance of pulsating heat pipes with hybrid working fluids,” Int. J. Heat Mass Transf., vol. 157, p. 119727, 2020. DOI: 10.1016/j.ijheatmasstransfer.2020.119727.
   Web of Science ®Google Scholar
• D. T. Vo, H. T. Kim, J. Ko, and K. H. Bang, “An experiment and three-dimensional numerical simulation of pulsating heat pipes,” Int. J. Heat Mass Transf., vol. 150, p. 119317, 2020. DOI: 10.1016/j.ijheatmasstransfer.2020.119317.
   Web of Science ®Google Scholar
• G. Rouaze, J. B. Marcinichen, F. Cataldo, P. Aubin, and J. R. Thome, “Simulation and experimental validation of pulsating heat pipes,” Appl. Therm. Eng., vol. 196, p. 117271, 2021. DOI: 10.1016/j.applthermaleng.2021.117271.
   Web of Science ®Google Scholar
• M. Zufar, P. Gunnasegaran, H. M. Kumar, and K. C. Ng, “Numerical and experimental investigations of hybrid nanofluids on pulsating heat pipe performance,” Int. J. Heat Mass Transf., vol. 146, p. 118887, 2020. DOI: 10.1016/j.ijheatmasstransfer.2019.118887.
   Web of Science ®Google Scholar
• Q. Li et al., “Study on the effect of the adiabatic section parameters on the performance of pulsating heat pipes,” Appl. Therm. Eng., vol. 180, p. 115813, 2020. DOI: 10.1016/j.applthermaleng.2020.115813.
   Web of Science ®Google Scholar
• B. Markal, A. C. Candere, M. Avci, and O. Aydin, “Effect of double cross sectional ratio on performance characteristics of pulsating heat pipes,” Int. Commun. Heat Mass Transf., vol. 127, p. 105583, 2021. DOI: 10.1016/j.icheatmasstransfer.2021.105583.
   Web of Science ®Google Scholar
• Z. Kang, D. Shou, and J. Fan, “Numerical study of a novel Single-loop pulsating heat pipe with separating walls within the flow channel,” Appl. Therm. Eng., vol. 196, p. 117246, 2021. DOI: 10.1016/j.applthermaleng.2021.117246.
   Web of Science ®Google Scholar
• M. Xing, R. Wang, and J. Yu, “The impact of gravity on the performance of pulsating heat pipe using surfactant solution,” Int. J. Heat Mass Transf., vol. 151, p. 119466, 2020. DOI: 10.1016/j.ijheatmasstransfer.2020.119466.
   Web of Science ®Google Scholar
• J. U. Brackbill, D. B. Kothe, and C. Zemach, “A continuum method for modeling surface tension,” J. Comput. Phys., vol. 100, no. 2, pp. 335–354, 1992. DOI: 10.1016/0021-9991(92)90240-Y.
   Web of Science ®Google Scholar
• N. Saha, P. K. Das, and P. K. Sharma, “Influence of process variables on the hydrodynamics and performance of a single loop pulsating heat pipe,” Int. J. Heat Mass Transf., vol. 74, pp. 238–250, 2014. DOI: 10.1016/j.ijheatmasstransfer.2014.02.067.
   Web of Science ®Google Scholar