References
- R. R. Tummala and M. Swaminathan, Introduction to System-on-Package, Miniaturization of the Entire System, pp. 605–659. New York: McGraw-Hill, 2008.
- Y. Shabany, Heat Transfer: Thermal Management of Electronics. New York: Taylor & Francis, pp. 281–283, 2009.
- J. P. Holman, Heat Transfer. New York: Tata Mcgraw Hill Education Private Limited, pp. 49–66., 2008,
- D. M. Pozar, Microwave Engineering. New York: Wiley, vol. 162, pp. 424–427, 1998.
- M. P. Gupta, A. K. Vallabhaneni and S. Kumar, “Self-consistent electrothermal modeling of passive and microchannel cooling in AlGaN/GaN HEMTs,” IEEE Trans. Compon., Packag. Manufact. Technol., vol. 7, no. 8, pp. 1305–1312, Aug. 2017. DOI: 10.1109/TCPMT.2017.2693399.
- B. M. Levin, “Reduction of a parabolic problem to a 2D problem and a phantom,” J. Commun. Technol. Electron., vol. 59, no. 7, pp. 697–703, 2014. DOI: 10.1134/S1064226914060126.
- A. M. Darwish, A. J. Bayba, and H. A. Hung, “Thermal resistance calculation of AlGaN-GaN devices,” IEEE Trans. Microwave Theory Techn, vol. 52, no. 11, pp. 2611–2620, Nov. 2004. DOI: 10.1109/TMTT.2004.837200.
- Y. S. Muzychka, K. R. Bagnall, and E. N. Wang, “Thermal spreading resistance and heat source temperature in compound orthotropic systems with interfacial resistance,” IEEE Trans. Compon., Packag. Manufact. Technol, vol. 3, no. 11, pp. 1826–1841, Nov. 2013. DOI: 10.1109/TCPMT.2013.2269273.
- K. R. Bagnall, Y. S. Muzychka, and E. N. Wang, “Application of the Kirchhoff transform to thermal spreading problems with convection boundary conditions,” IEEE Trans. Compon., Packag. Manufact. Technol., vol. 4, no. 3, pp. 408–420, Mar. 2014. DOI: 10.1109/TCPMT.2013.2292584.
- K. R. Bagnall, Y. S. Muzychka, and E. N. Wang, “Analytical solution for temperature rise in complex multilayer structures with discrete heat sources,” IEEE Trans. Compon., Packag. Manufact. Technol, vol. 4, no. 5, pp. 817–830, May 2014. DOI: 10.1109/TCPMT.2014.2299766.
- K. H. Kwok and V. d’Alessandro, “Fast analytical modeling of dynamic thermal behavior of semiconductor devices and circuits,” IEEE Trans. Electron Devices, vol. 61, no. 4, pp. 1031–1038, Apr. 2014. DOI: 10.1109/TED.2014.2305991.
- L. Chen, M. Tang, and J. Mao, “An analytical gradient model for the characterization of conductor surface roughness effects,” IEEE MTT-S Int. Microw. Symp. Dig, pp. 1036–1038, Jun. 2018. DOI: 10.1109/MWSYM.2018.8439434.
- Y. Zhang, et al., “Electrothermal simulation and thermal performance study of GaN vertical and lateral power transistors,” IEEE Trans. Electron Devices, vol. 60, no. 7, pp. 2224–2230, Jul. 2013. DOI: 10.1109/TED.2013.2261072.
- V. Sodan, et al., “Fast and distributed thermal model for thermal modeling of GaN power devices,” IEEE Trans. Compon., Packag. Manufact. Technol, vol. 8, no. 10, pp. 1747–1755, Oct. 2018. DOI: 10.1109/TCPMT.2018.2808680.
- Z.-H. Ma, W. C. Chew, and L. J. Jiang, “A novel fast solver for Poisson’s equation with neumann boundary condition,” PIER, vol. 136, pp. 195–209, 2013. DOI: 10.2528/PIER12112010.
- Z.-H. Ma, W. C. Chew, and L. J. Jiang, “A novel efficient numerical solution of Poisson’s equation for arbitrary shapes in two dimensions,” Commun. Comput. Phys., vol. 20, no. 5, pp. 1381–1404, 2016. DOI: 10.4208/cicp.230813.291113a.
- Z.-H. Ma, W. C. Chew, Y. M. Wu, and L. J. Jiang, “A new multilevel method for electrostatic problems through hierarchical loop basis,” Comput. Phys. Commun., vol. 189, pp. 99–105, 2015. DOI: 10.1016/j.cpc.2014.12.015.
- S. M. Rao, D. R. Wilton, and A. W. Glisson, “Electromagnetic scattering by surfaces of arbitrary shape,” IEEE Trans. Antennas Propag., vol. 30, no. 3, pp. 409–418, 1982. May DOI: 10.1109/TAP.1982.1142818.
- J.-S. Zhao and W. C. Chew, “Integral equation solution of maxwell's equations from zero frequency to microwave frequencies,” IEEE Trans. Antennas Propag., vol. 48, pp. 1635–1645, 2000.
- G. Xiao and Y. Hou, “Intuitive formulation of discontinuous galerkin surface integral equations for electromagnetic scattering problems,” IEEE Trans. Antennas Propag., vol. 65, no. 1, pp. 287–294, Jan. 2017. DOI: 10.1109/TAP.2016.2630501.
- W. C. Chew, M. S. Tong, and B. Hu, Integral Equation Methods for Electromagnetic and Elastic Waves, London: Morgan & Claypool, 2008.
- H. Späth, Two Dimensional Spline Interpolation Algorithms, Wellesley, MA: A K Peters, 1995,
- "FEKO", Suite 7.0 Altair Engineering Inc., 2015. [Online] Available: http://www.altairhyperworks.com/FEKO.
- COMSOL Multiphysics User’s Guide, COMSOL Multiphysics, Burlington, MA, USA, Sep. 2016.
- F. Fesharaki, T. Djerafi, M. Chaker and K. Wu, “Low-loss and low-dispersion transmission line over DC-to-THz spectrum,” IEEE Trans. THz Sci. Technol., vol. 6, no. 4, pp. 611–618, Jul. 2016. DOI: 10.1109/TTHZ.2016.2570009.