ANALYSIS/FINITE-ELEMENT COMBINED METHODOLOGY ON TEMPERATURE DISTRIBUTION OF A FINITE DOMAIN WITH VARIOUS HEAT SOURCES

References

• D. J. Dean , Thermal Design of Electronic Circuit Boards and Packages , Electrochemical Publications , pp. 233 - 290 , 1985 .
   Google Scholar
• Pinaldo Castello and Paolo Antogneti , Integrated-Circuit Thermal Modelling , IEEE J. Solid-State Circuits , vol. SC-13 , no. 3 , June 1978 .
   Web of Science ®Google Scholar
• G. N. Ellison , Thermal Computations for Electronic Equipment , Van Nostrand-Reinhold , New York , pp. 322 - 367 , 1984 .
   Google Scholar
• G. N. Ellison , The Thermal Design of an LSI Single Chip Package , IEEE Trans. Parts, Hybrid, and Packaging , vol. PHI-12 , doc. pp. 371 - 378 , 1976 .
   Google Scholar
• K. Nakabe , Y. Matsuoka , M. Taga , T. Yoskioka , K. Hurukubo , and Y. Ugai , On Temperature Distribution in Finite Domain with Various Heat Sources , J. Faculty Sci. Technot. Kinki Univ. , vol. 24 , p. 123 , 1988 .
   Google Scholar
• Mostafa Aghazadeh and Praveen Jain , Thermal Performance of Multi-Chip Packages , 7th Annual Int. Electronics Packaging Conf. , vol. 1 , pp. 259 - 271 , 1987 .
   Google Scholar
• Hsin-Chien Hung , Thermal Resistances of Multicip Modulus , 5th Natl. Conf. on Mechanical Engineering , CSME , Taipei , pp. 351 - 358 , Dec. 9 , 1988 .
   Google Scholar
• V. Kadambi and N. Abuaf , Axisymmetric and Three-Dimensional Chip-Spreader Calculations , AICHE Symp, Ser. , no. 79 , pp. 130 - 139 , 1983 .
   Google Scholar
• M. Bonnifait and M. Cadre , Thermal Simulations for Electronic Components Using Finite Elements and Nodal Networks , in Heat Transfer in Electronic Equipment , HTD-vol. 57 , 1986 . Package, IEE Trans. Parts, Hybrid, and Packaging, vol. PHI-12, doc. pp. 183-188,1976 .
   Google Scholar
• Cha-Hsiung Tan and Michael Pecht , A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation , Trans. ASME , vol. 112 , pp. 260 - 266 , Sept. 1990 .
   Google Scholar
• Fred T. Menthen , Computer-Aided Thermal Analysis of Power Semiconductor Devices , IEEE Trans. Electronic Devices , vol. ED-17 , no. 9 , pp. 765 - 770 , Sept. 1970 .
   Google Scholar
• E. J. Pinto and B. B. Mikic , Temperature Prediction on Substrates and Integrated Circuit Chips , in Heat Transfer in Electric Equipment , HTD-vol. 57 , pp. 199 - 207 , 1986 .
   Google Scholar
• J. D. Culham and M. M. Yovanorich , Non-Iterative Technique for Computing Temperature Distributions in Flat Plates with Distributed Heat Sources and Convective Cooling , Proc. ASME-JSME Thermal Joint Conf. , vol. 3 , pp. 403 - 409 , 1987 .
   Google Scholar
• L. M. Simeza and M. M. Yovanovich , Application of BIEM to Thermal Analysis of Multiple Sources on PCBS , in Heat Transfer in Electronic Equipment , HTD-vol. 57 , pp. 395 - 401 , 1986 .
   Google Scholar
• M. Necati Ozisik , Boundary Value Problems of Heat Conduction , International Texbook , pp. 101 - 106 , 1968 .
   Google Scholar
• Erwin Kreyszing , Advanced Engineering Mathematics, 6th ed. , Wiley , New York , pp. 644 - 717 , 1988 .
   Google Scholar
• S. S. Rao , Finite Element Method in Engineering , Pergamon Press , New York , pp. 418 - 450 , 1982 .
   Google Scholar
• J. V. Beck , K. D. Cole , A. Haji-Sheikh , and B. Litkouhi , Heat Conduction Using Functions , Hemisphere , Washington , D.C. , pp. 481 - 495 , 1992 .
   Google Scholar