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Numerical Heat Transfer, Part B: Fundamentals
An International Journal of Computation and Methodology
Volume 33, 1998 - Issue 2
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Original Articles

A NEW PARAMETER FOR ERROR ESTIMATION AND TIME-STEP CONTROL IN TLM DIFFUSION MODELING

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Pages 235-249 | Received 02 Jun 1997, Accepted 19 Sep 1997, Published online: 25 Apr 2007

REFERENCES

  • P. B. Johns , Solution of the Lossy Wave Equation by the TLM Method , in R. Vichnevetsky (ed.) , Proc. AICA Int. Symp. Advances in Computer Methods for Partial Differential Equations , pp. 247 – 250 , Bethlehem , PA , 1975 .
  • P. B. Johns , A Simple, Explicit and Unconditionally Stable Numerical Routine for the Solution of the Diffusion Equation , Int. I. Numer. Meth. Eng. , vol. 11 , pp. 1307 – 1328 , 1977 .
  • S. H. Pulko , A. Mallik , R. Allen , P. B. Johns , Automatic Timestepping in TLM Routines for the Modelling of Thermal Diffusion Processes , Int. J. Numer. Model. Electron. Netw. Devices Fields , vol. 3 , pp. 127 – 136 , 1990 .
  • X. Gui , P. W. Webb ,D. de Cogan, An Error Parameter in TLM Diffusion Modelling , Int. J. Numer. Model, Electron. Netw. Devices Fields , vol. 5 , pp. 129 – 137 , 1992 .
  • I. A. D. Russell and P. W. Webb , Automatic Time Step Control in TLM Diffusion Modelling for Problems with Time-Varying Load Conditions , Int. J. Numer. Model. Electron. Netw. Devices Fields , vol. 9 , pp. 417 – 428 , 1996 .
  • P. W. Webb and I. A. D. Russell , Application of the TLM Method to Transient Thermal Simulation of Microwave Power Transistors , IEEE Trans. Electron Devices , vol. ED-42 , pp. 624 – 631 , 1995 .
  • P. Enders D. de Cogan , The Efficiency of Transmission Line Matrix Modelling-A Rigorous Viewpoint , Int. J. Numer. Model. Electron. Netw. Devices Fields , vol. 6 , pp. 109 – 126 , 1993 .
  • B. Epstein and D. L. Hicks , Comparison between Two Error Estimation Procedures , in P. C. C. Wang (ed.) , Information Linkage between Applied Mathematics and Industry , pp. 293 – 298 , Academic Press , New York , 1979 .
  • D. C. Joyce , Survey of Extrapolation Processes in Numerical Analysis , SIAM Rev. , vol. 13 , pp. 435 – 490 , 1971 .
  • P. W. Webb and X. Gui , Implementation of Timestep Changes in Transmission-Line Matrix Diffusion Modelling , Int. J. Numer. Model. Electron. Netw. Devices Fields , vol. 5 , pp. 251 – 257 , 1992 .
  • D. de Cogan, M. Henini , and A. K. Shak , The Use of Variable Mesh Transmission Line Modelling in the Analysis of Heat Row in Power Semiconductors , in J. J. H. Miller (ed.) , Proc. 4th Int. Conf. Numerical Analysis of Semiconductor Devices & ICs (NASECODE IV) , pp. 255 – 260 , Dublin , Ireland , 1985 .
  • D. de Cogan and M. Henini , TLM Modelling of Thermal Behaviour of Conducting Films on Insulating Substrates , J. Phys. D. Appt. Phys. , vol. 20 , pp. 251 – 257 , 1987 .
  • X. Gui , P. W. Webb , and G. B. Gao , Use of the Three-Dimensional TLM Method in the Thermal Design and Simulation of Semiconductor Devices , IEEE Trans. Electron Devices , vol. ED-39 , pp. 1295 – 1302 , 1992 .
  • X. Gui and P. W. Webb , A Comparative Study of Two TLM Networks for the Modelling of Diffusion Processes , Int. J. Numer. Model. Electron. Netw. Devices Fields , vol. 6 , pp. 161 – 164 , 1993 .
  • Address correspondence to Dr. Xiang Gui, Department of Electrical and Computer Engineering, 2500 University Drive, NW, Calgary, Alberta T2N 1N4, Canada. E-mail: [email protected]

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