Metal Matrix Composites for Thermal Management: A Review

REFERENCES

• G. A. Slack, Nonmetallic crystals with high thermal conductivity, J. Phys. Chem. Solids 34, 321–335 (1973).
   Web of Science ®Google Scholar
• H. S. Lee, K. Y. Jeon, H. Y. Kim, and S. H. Hong, Fabrication process and the thermal properties of SiCAl metal matrix composites for electronic packaging applications, J. Mater. Sci. 35, 6231–6236 (2000).
   Web of Science ®Google Scholar
• M. A. Occhionero, R. A. Hay, R. W. Adams, and K. P. Fennessy, Cost-effective manufacturing of aluminum silicon carbide (AlSiC) electronic packages, IMAPS Advanced Packaging Materials Symposium, March 14–17, 1999.
   Google Scholar
• D. C. Packard, Kevlar epoxy substrate for interconnecting leadless chip carrier, Sampe J. 20, 6–14 (1984).
   Web of Science ®Google Scholar
• S. R. Bakshi, D. Lahiri, and A. Agarwal, Carbon nanotube reinforced metal matrix composites-a review, Int. Mater. Rev. 55, 41–64 (2010).
   Web of Science ®Google Scholar
• R. E. Hummel, Electronic Properties of Materials, Springer Science & Business Media, New York, USA (2011).
   Google Scholar
• C. Tatar and N. Ozdemir, Investigation of thermal conductivity and microstructure of the α- Al2O3 particulate reinforced aluminum composites (Al/Al2O3-MMC) by powder metallurgy method, Physica B 405, 896–899 (2010).
   Web of Science ®Google Scholar
• S. Yu, P. Hing, and X. Hu, Thermal conductivity of polystyrene- aluminum nitride composite, Compos. Part A Appl. Sci. Manufact. 33, 289–292 (2002).
   Web of Science ®Google Scholar
• B. Karthikeyan, S. Ramanathan, and V. Ramakrishnan, Thermo physical property measurement of metal matrix composites, Materials and design 31, (2010) 582–586.
   Web of Science ®Google Scholar
• V. Ramakrishnan, A. Ramasamy, P. P. Gupta, H. Narayananmurthy, S. Hegde, and M. K. Surappa, Thermal characterization of aluminum and magnesium MMCs by TMA, In Indian Society for Advancement of Material and Process Engineering National Conference, Thiruvananthapuram, India, May 2002, 320–325.
   Google Scholar
• T. Huber, H. P. Degischer, G. Lefranc, and T. Schmitt, Thermal expansion studies of alumnium-matrix composites with different reinforced architecture of SiC particles, Compos. Sci. Technol. 66, 2206–2217 (2006).
   Web of Science ®Google Scholar
• T. H. Nam, G. Requena, and P. Degischer, Thermal expansion behaviour of aluminum matrix composites with densely packed SiC particles, Compos. Part A 39, 856–865 (2008).
   Web of Science ®Google Scholar
• J. M. Molina, R. A. Saravanan, R. Arpon, C. Garcıa-Cordovilla, E. Louis, and J. Narciso, Pressure infiltration of liquid aluminium into packed SiC particulate with a bimodal size distribution, Acta Mater. 50, 247–257 (2002).
   Web of Science ®Google Scholar
• J. M. Molina, J. Narciso, L. Weber, A. Mortensen, and E. Louis, Thermal conductivity of Al–SiC composites with monomodal and bimodal particle size distribution, Mater. Sci. Eng. A 480, 483–488 (2008).
   Web of Science ®Google Scholar
• R. Arpon, J. M. Molina, R. A. Saravanan, C. Garcıa-Cordovilla, E. Louis, and J. Narciso, Thermal expansion behaviour of aluminium/SiC composites with bimodal particle distributions, Acta Materialia 51, 3145–3156 (2003).
   Web of Science ®Google Scholar
• Y. Xu, Y. Tanaka, M. Murata, K. Kamihira, Y. Isoda, and K. Yagi, Thermal conductivity of unidirectionally aligned SiC whisker reinforced Al alloy matrix composite with interfacial thermal resistance, Mater. Trans. 46, 148–151 (2005).
   Web of Science ®Google Scholar
• I. Mizoguchi, S. Yamaguchi, S. Yachi, and M. Yoshida, Influence of high temperature holding on tensile strength of pitch-based carbon fiber reinforced Al–Mg alloy composites fabricated by ultrasonic infiltration method, J. Japan Instit. Light Met. 60, 396–402 (2010).
   Google Scholar
• H. S. Lee, K.Y. Jeon, H.Y. Kim, and S. H. Hong, Fabrication process and the thermal properties of SiCAl metal matrix composites for electronic packaging applications, J. Mater. Sci. 35, 6231–6236 (2000).
   Web of Science ®Google Scholar
• S. Cem Okumus, S. Aslan, R. Karslioglu, D. Gultekin, and H. Akbulut, Thermal expansion and thermal conductivity behaviors of Al-Si/SiC/graphite hybrid metal matrix composites (MMCs), Material Sci. (Medziagotyra) 18, 341–346 (2012).
   Web of Science ®Google Scholar
• W. Yang, L. Zhou, K. P. J. Zhu, and L. Wan, Effect of tungsten addition on thermal conductivity of graphitecopper composites, Compos. Part B 55, 1–4 (2013).
   Web of Science ®Google Scholar
• R. Prieto, J. M. Molina, J. Narciso, and E. Louis, Fabrication and properties of graphite flakesmetal composites for thermal management application, Scripta Materialia 59, 11–14 (2008).
   Web of Science ®Google Scholar
• T. Schubert, B. Trindde, T. Weissgarber, and B. Kieback, Interfacial design of Cu- based composites prepared by powder metallurgy for heat sink applications, Mater. Sci. Eng. A 475, 39–44 (2008).
   Web of Science ®Google Scholar
• T. Etter, P. Schulz, M. Weber, J. Metz, M. Wimmler, J. F. Loffler, and P. Uggowitzer Aluminum carbide formation in interpenetrating graphite/aluminum composites, Mater. Sci. Eng. A 448, 1–6 (2007).
   Web of Science ®Google Scholar
• J. K. Chen and I. S. Huang, Thermal properties of aluminum-graphite composites by powder metallurgy, Compos. Part B 44, 698–703 (2013).
   Web of Science ®Google Scholar
• J. Maire and J. Mering, Graphitization of soft carbon, In Chemistry and Physics of Carbon, PL Walker Jr, Ed., Marcel Dekker, New York 6 (1970), pp. 125–190.
   Google Scholar
• H. Zhang, M. Chao, H. Zhang, A. Tang, B. Ren, and X. He, Microstructure and thermal properties of copper matrix composites reinforced by chromium-coated discontinuous fibers, Appl. Therm. Eng. 73, 737–742 (2014).
   Google Scholar
• E. A. Burgemeister, Thermal resistance at metaldiamond interfaces in relation to the mounting of microwave diodes, J. Appl. Phys. D Appl. Phys. 10, 1923–1930 (1977).
   Web of Science ®Google Scholar
• T. Schubert, L. Ciupinski, W. Zielinski, A. Michalski, T. Weibgarber, and B. Kieback, Interfacial characterization of Cudiamond composites prepared by powder metallurgy fot heat sink applications, Scripta Materialia 58, 263–266 (2008).
   Web of Science ®Google Scholar
• P. W. Ruch, O. Beffort, S. Kleiner, L. Weber, and P. J. Uggowitzer, Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity, Compos. Sci. Technol. 66, 2677–2685 (2006).
   Web of Science ®Google Scholar
• C. Xue, J. K. Yu, and X. M. Zhu, Thermal properties of diamond/SiC/Al composites with high volume fractions, Mater. Des. 32, 4225–4229 (2011).
   Web of Science ®Google Scholar
• Q. L. Che, X. K. Chen, Y. Q. Ji, Y. W. Li, L. X. Wang, S. Z. Cao, Y. G. Jiang, and Z. Wang, The influence of minor titanium addition on thermal properties of diamondcopper composites via in-situ reactive sintering, Mater. Sci. Semiconduct. Process. 30, 104–111 (2015).
   Web of Science ®Google Scholar
• Z. Yang, X. He, L. Wang, R. Liu, H. Hu, L. Wang, and X. Qu, Microstructure and thermal expansion behavior of diamond/SiC/(Si) composites fabricated by reactive vapor infiltration, J. Eur. Ceram. Soc. 34, 1139–1147 (2014).
   Web of Science ®Google Scholar
• Z. Tan, Z. Li, G. Fan, X. Kai, G. Ji, L. Zhang, and D. Zhang, Fabrication of diamond/aluminum composites by vacuum hot pressing: processoptimization and thermal properties, Compos. Part B 41, 173–180 (2013).
   Google Scholar
• S. Kleiner, F. A. Khalid, P. W. Ruch, S. Meier, and O. Beffort, Effect of diamond crystallographic orientation on dissolution and carbide formation in contact with liquid aluminum, Scripta Materialia 55, 291–294 (2006).
   Web of Science ®Google Scholar
• J. Flaquer, A. Rios, A. Martin-Meizoso, S. Nogales, and H. Bohm, Effect of diamond shapes and associated thermal boundary resistance on thermal conductivity of diamond-based composites, Computat. Mater. Sci. 41, 156–163 (2007).
   Web of Science ®Google Scholar
• R. G. Coltters, Thermodynamics of binary metallic carbides—a review, Mater. Sci. Eng. 76, 1–50 (1985).
   Google Scholar
• X. Liang, C. Jia, K. Chu, H. Chen, J. Nie, and W. Gao, Thermal conductivity and microstruture of Aldiamond composites with Ti-coated diamond particles consolidated by spark plasma sintering, J. Compos. Mater. 46, 1127–1136 (2011).
   Web of Science ®Google Scholar
• K. Chu, C. Jia, H. Guo, and W. Li, On the thermal conductivity of Cu-Zr/diamond composites, Mater. Des. 45, 36–42 (2013).
   Web of Science ®Google Scholar
• Y. Zhang, H. L. Zhang, J. H. Wu, and X. T. Wang, Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles, Scripta Materialia 65, 1097–1100 (2011).
   Web of Science ®Google Scholar
• K. Yoshida and H. Morigami, Thermal properties of diamond/copper composite material, Mictoelectron. Reliab. 44, 303–308 (2004).
   Web of Science ®Google Scholar
• J. He, X. Wang, Y. Zhang, Y. Zhao, and H. Zhang, Thermal conductivity of Cu–Zrdiamond composites produced by high temperature–high pressure method, Compos. Part B 68, 22–26 (2015).
   Web of Science ®Google Scholar
• J. Yin, D. Yao, Y. Xia, K. Zuo, and Y. Zeng, The effect of modified interfaces on the mechanical property of β-silicon nitride whiskers reinforced Cu matrix composites, J. Alloys Compnd. 615, 983–988 (2014).
   Web of Science ®Google Scholar
• K. Chu, C. Jia, H. Guo, and W. Li, Microstructure and thermal conductivity of Cu-Bdiamond composites, J. Compos. Mater. 47, 2945–2953 (2013).
   Web of Science ®Google Scholar
• M. Kida, L. Weber, C. Monachon, and A. Mortensen, Thermal conductivity and interfacial conductance of AlN particle reinforced metal matrix composites, J. Appl. Phys. 109, 064907 (2011).
   Web of Science ®Google Scholar
• D. P. H. Hasselman, Effect of thermal conductivity mismatch on the thermal stresses in a dispersed phase-continuous matrix composite material undergoing steady-state heat flow, J. Compos. Mater. 36, 1604–1613 (2002).
   Web of Science ®Google Scholar
• S. Timoshenko and J. N. Goodier, Theory of Elasticity, 2nd ed., McGraw-Hill, New York, USA (1951).
   Google Scholar
• C. Wang, G. Min, and S-b Kang, Thermal conducting property of SiC-reinforced copper matrix composites by hot pressing, J. Compos. Mater. 45, 1849–1852 (2011).
   Web of Science ®Google Scholar
• T. Takei, H. Hatta, and M. Taya, Thermal expansion behavior of particulate-filled composites II: multi-reinforcing phases (hybrid composites), Mater. Sci. Eng. A 131, 145–152 (1991).
   Web of Science ®Google Scholar
• H. Hatta, T. Takei, and M. Taya, Effects of dispersed mirovoids on the thermal expansion behavior of composite materials, Mater. Sci. Eng. 285, 99–110 (2000).
   Google Scholar
• J. N. Grima, V. Zammit, and R. Gatt, Negative thermal expansion, Xjenza 11, 17–29 (2006).
   Google Scholar
• K. Takenaka, Negative thermal expansion materials: technological key for control of thermal expansion, Sci. Tehnol. Adv. Mater. 13, 013001 (2012).
   PubMed Web of Science ®Google Scholar
• S. Das, S. Das, and K. Das, Synthesis and thermal behavior of Cu/Y2W3O12 composite, Ceram. Int. 40, 6465–6472 (2014).
   Web of Science ®Google Scholar
• A. Matsumoto, K. Kobayashi, T. Nishio, and K. Ozaki, Fabrication and thermal expansion of Al-ZrW2O8 composites by pulse current sintering process, Mater. Sci. Forum 426, 2279–2284 (2003).
   Google Scholar
• H. Holzer and D. Dunand, Processing, structure and thermal expansion of metal matrix composites containing zirconium tungstate, 4th International Conference on Composite Engineering, Hawaii (1997).
   Google Scholar
• C. Verdon and D. C. Dunand, High temperature reactivity ZrW2O8 -Cu system, Scripta Materialia 36, 075–1080 (1997).
   Web of Science ®Google Scholar
• D. K. Balch and D. C. Dunand, Copper-zirconium tungstate composites exhibiting low and negative thermal expansion influenced by reinforcement phase transformations, Metallurg. Mater. Trans. A 35, 1159–1165 (2004).
   Google Scholar
• L. Ding, C. Wang, Y. Na, L. Chu, and J. Yan, Preparation and near zero thermal expansion property of Mn3Cu0.5A0.5 N (A = Ni, Sn)/Cu composites, Scripta Materialia 6(2014)5, 687–690 (2011).
   Google Scholar
• M. Azuma, W-t Chen, H. Seki, M. Czapski, K. Oka, M. Mizumaki, T. Watanuki, N. Ishimatsu, N. Kawamura, S. Ishiwata, M.G. Tucker, Y. Shimakawa and J.P. Attfield, Colossal negative thermal expansion in BiNiO3 induced by intermetallic charge transfer, Nat. Commun. 2, 347 (2011).
   PubMed Web of Science ®Google Scholar
• M. Ma, Z. Liu, Y. Li, Y. Zeng, and D. Yao, Thermal conductivity of low-temperature sintered calcium aluminosilicate glass-silicon nitride whisker composites, Ceram. Int. 39, 4683–4687 (2013).
   Web of Science ®Google Scholar
• R. Bacon, Growth, structure, and properties of graphite whiskers, J. Appl. Phys. 31, 283–290 (1960).
   Web of Science ®Google Scholar
• S. Iijima, Helical microtubules of graphitic carbon, Nature, 354, 56–58 (1991).
   Web of Science ®Google Scholar
• H-W Liang, Q-F Guan, L-T S. Zhu-Zhu, H-B Yao, X. Lei, and S-H Yu, Highly conductive and stretchable conductors fabricated from bacterial cellulose, NPG Asia Mater. 4(6), e19 (2012).
   Web of Science ®Google Scholar
• S. I. Cha, K. T. Kim, S. N. Arshad, C. B. Mo, and S. H. Homg, Extraordinary strengthening effect of carbon nanotubes in metal-matrix nanocomposites processed by molecular-level mixing, Adv. Mater. 17, 1377–1381 (2005).
   PubMed Web of Science ®Google Scholar
• T. Laha, A. Agarwal, T. McKechnie, and S. Seal, Synthesis and characterization of plasma spray formed carbon nanotube reinforced aluminum composite, Mater. Sci. Eng. A 381, 249–258 (2004).
   Web of Science ®Google Scholar
• T. Noguchi, A. Magario, S. Fukazawa, S. Shimizu, J. Beppu, and M. Seki, Carbon nanotubealuminium composites with uniform dispersion, Mater. Trans. 45, 602–604 (2004).
   Web of Science ®Google Scholar
• H. Kwon, M. Estili, K. Takagi, T. Miyazaki, and A. Kawasaki, Combination of hot extrusion and spark plasma sintering for producing carbon nanotube reinforced aluminum matrix composites, Carbon 47, 570–577 (2009).
   Web of Science ®Google Scholar
• D. K. Lim, T. Shibayanagi, and A. P. Gerlich, Synthesis of multi-walled CNT reinforced aluminium alloy composite via friction stir processing, Mater. Sci. Eng. A 507, 194–199 (2009).
   Web of Science ®Google Scholar
• Shi-Ying Liu, Fei-Peng Gao, Qiong-Yuan Zhang, Xue Zhu, and Wen-Zhen Li, Fabrication of carbon nanotubes reinforced AZ91D composites by ultrasonic processing, Trans. Nonferrous Met. Soc. China 20, 1222–1227 (2010).
   Web of Science ®Google Scholar
• K. Chu, H. Guo, C. Jia, F. Yin, X. Zhang, X. Liang, and H. Chen, Thermal properties of carbon nanotube-copper composites for thermal management applications, Nanoscale Res. Lett. 5, 868–874 (2010).
   PubMed Web of Science ®Google Scholar
• Y. Wu, G-Y Kim, and A. M. Russell, Effect of mechanical alloying on an Al6061-CNT composite fabricated by semi-solid powder processing, Mater. Sci. Eng. A 538, 164–172 (2012).
   Web of Science ®Google Scholar
• K. Morsi, and A. Esawi, Effect of mechanical alloying time and carbon nanotube (CNT) content on the evolution of aluminum (Al)–CNT composite powders, J. Mater. Sci. 42, 4954–4959 (2007).
   Web of Science ®Google Scholar
• L. Wang, H. Choi, J-M Myoung, and W. Lee, Mechanical alloying of multi-walled carbon nanotubes and aluminium powders for the preparation of carbonmetal composites, Carbon 47, 3427–3433 (2009).
   Web of Science ®Google Scholar
• S. E. Salibekov, A. A. Zabolotskiy, V. A. Turchenkov, B. F. Trefilov, and N. P. Ignatov, Influence of nickel coating fibers, structure and properties of composite material (aluminum-carbon fiber), In Fibrous and Dispersively Reinforced Composite Materials, I.N. Fridlyander and V.I. Kostikov, Eds., Nauka Publishers, Moscow 33–7 (1976).
   Google Scholar
• Y. V. Naydich and G. A. Kolesnichenko, Interaction of Metal Melts with Diamond and Graphite Surfaces, Naukova Dumka, Kiev (1967).
   Google Scholar
• Z. Tao, Q. Guo, X. Gao, and L. Liu, Graphite fibercopper composites with near-zero thermal expansion, Mater. Des. 33, 372–375 (2012).
   Web of Science ®Google Scholar
• J. P. Fan, D. M. Zhuang, D. Q. Zhao, G. Zhang, M. S. Wu, F. Wei and Z. J. Fan, Toughening and reinforcing alumina matrix composite with single-wall carbon nanotubes, Appl. Phys. Lett. 89, 121910 (2006).
   Google Scholar
• G. Yamamoto, J. W. Suk, J. An, R. D. Piner, T. Hashida, Kagi Ta, and R. S. Ruoff, The influence of nanoscale defects on the fracture of multi-walled carbon nanotubes under tensile loading, Diamond Rel. Mater. 19, 748–751 (2010).
   Web of Science ®Google Scholar
• J. F. Silvain, C. Vincent, J. M. Heintz, and N. Chandra, Novel processing and characterization of CuCNF nanocomposite for high thermal conductivity applications, Composites science and Technol. 69, 2474–2484 (2009).
   Web of Science ®Google Scholar
• J. F Silvain and O. Fouassier, XPS investigation of Sn, Sn-d and Sn-dCu clusters produced by electroless deposition onto NiTi micronic particles formed by atomization, Surf. Interface Anal. 6, 769–772 (2004).
   Web of Science ®Google Scholar
• K. T. Kim, J. Eckert, G. Liu, J. Man Park, B. K. Lim, and S. H. Hong, Influence of embedded-carbon nanotubes on the thermal properties of copper matrix nanocomposites processed by molecular-level mixing, Scripta Materialia 64, 181–184 (2011).
   Web of Science ®Google Scholar
• L. Duan, W. Lin, J. Wang, and G. Yang, Thermal properties of W-Cu composites manufactures by copper infiltration into tungsten fiber matrix, Int. J. Refract. Met. Hard Mater. 46, 96–100 (2014).
   Web of Science ®Google Scholar
• R. J. McGlen, R. Jachuck, and S. Lin, Integrated thermal management techniques for high power electronic devices, Appl. Therm. Eng. 24, 1143–1156 (2004).
   Web of Science ®Google Scholar
• G. Chai, Y. Sun, J. Sun, and Q. Chen, Mechanical properties of carbon nanotube-copper nanocomposites, J. Micromechan. Micro Eng. 18, 035013 (2008).
   Web of Science ®Google Scholar
• G. Chai and Q. Chen, Characterization study of the thermal conductivity of carbon nanotube copper nano-composites, J. Compos. Mater. 44, 2863–2873 (2010).
   Web of Science ®Google Scholar
• S. R. Bakshi, R. R. Patel, and A. Agarwal, Thermal conductivity of carbon nanotube reinforced aluminum composites: a multi-scale study using object oriented finite element method, Computat. Mater. Sci. 50, 419–428 (2010).
   Web of Science ®Google Scholar
• S-m Zhou, X-b Zhang, Z-p Ding, C-y Min, G-l Xu, and W-m Zhu, Fabrication and tribological properties of carbon nanotubes reinforced Al composites prepared by pressureless infiltration technique, Compos. Part A Appl. Sci. Manufact. 38, 301–306 (2007).
   Web of Science ®Google Scholar
• S. R. Bakshi, V. Singh, S. Seal, and A. Agarwal, Alumnium composite reinforced with multi-walled carbon nanotubes from plasma spraying of spray dried powders, Surf. Coat. Technol. 203, 1544–1554 (2009).
   Web of Science ®Google Scholar
• Y. Tang, H. Cong, R. Zhong, and H-M Cheng, Thermal expansion of a composite of single-walled carbon nanotubes and nanocrystalline aluminum, Carbon, 42, 3260–3262 (2004).
   Web of Science ®Google Scholar
• C. F. Deng, Y. X. Ma, P. Zhang, X. X. Zhang, and D. Z. Wang, Thermal expansion behaviors of aluminum composite reinforced with carbon nanotubes, Mater. Lett. 62, 2301–2303 (2008).
   Web of Science ®Google Scholar
• A. A. Zabolotsky, Aluminum-carbon system composites, In Metal Matrix Composites (Vol. 3), J. N. Fridlyander and I. H. Marshall, Eds., Springer, London, UK (1995), pp. 347–348.
   Google Scholar
• P. G. Partridge, G. Lu, P. May, and J. W. Steeds, Potential high-strength high conductivity metal-matrix composites based on diamond fibers, Diamond Relat. Mater. 4, 848–851 (1995).
   Web of Science ®Google Scholar
• T. Liu, X. He, L. Zhang, Q. Liu, and X. Qu, Fabrication and thermal conductivity of short fiberAl composites by vacuum pressure in filtration, J. Compos. Mater. 48, 2207–2214 (2013).
   Web of Science ®Google Scholar
• C. Edtmaier, T. Steck, R. C. Hula, L. Pambaguian, and F. Hepp, Thermo-physical properties and TEM analysis of silver based MMCs utilizing metalizes multiwall-carbon nanotubes, Compos. Sci. Technol. 70, 783–788 (2010).
   Web of Science ®Google Scholar
• C. S. Goh, J. Wei, L. C. Lee, and M. Gupta, Development of novel carbon nanotube reinforced magnesium nanocomposites using the powder metallurgy technique, Nanotechnology 17, 7–12 (2006).
   Web of Science ®Google Scholar
• X. Yuan and S. Huang, Microstructural characterization of MWCNTs/magnesium alloy composites fabricated by powder compact laser sintering, J. Alloys Compnd. 620, 80–86 (2015).
   Web of Science ®Google Scholar
• S. K. Thakur, T. Kwee, and M. Gupta, Development and characterization of magnesium composites containing nano-sized silicon carbide and carbon nanotubes as hybrid reinforcements, J. Mater. Sci. 42, 10040–10046 (2007).
   Web of Science ®Google Scholar
• Y. L. Shen, A. Needleman, and S. Suresh, Coefficients of thermal expansion of metal-matrix composites for electronic packaging, Metallurg. Mater. Trans. 25, 839–850 (1994).
   Web of Science ®Google Scholar
• Y. S. Lee, M. N. Gungor, T. J. Batt, and P. K. Liaw, Semi-empirical investigation of thermal expansion behavior of components in a two-phase particle-reinforced metal matrix composite, Mater. Sci. Eng. A 145, 37–46 (1991).
   Web of Science ®Google Scholar
• K. B. Lee and H. Kwon, Strength of Al-Zn-Mg-Cu matrix composite reinforced with SiC particles, Metallurg. Mater. Trans. A 33, 455–465 (2002).
   Web of Science ®Google Scholar
• P. S. Turner, Thermal-expansion stresses in reinforced plastics, J. Res. Nat. Bur. Stand. 37, 239–250 (1946).
   Google Scholar
• E. H. Kerner, The elastic and thermo-elastic properties of composite media, Proc. Phys. Soc. London 69, 808–813 (1956).
   Google Scholar
• R. A Schapery, Thermal expansion coefficients of composite materials based on energy principles, J. Compos. Mater. 2, 380–404 (1968).
   Web of Science ®Google Scholar
• Z. Hashin and S. Shtrikman, A variational approach to the theory of the elastic behavior of multiphase materials, J. Mechan. Phys. Solids 11, 127–140 (1963).
   Web of Science ®Google Scholar
• J. D. Eshelby, The determination of the elastic field of an ellipsoidal inclusion, and related problems, Proc. Roy. Soc. A 241, 376–396 (1957).
   Web of Science ®Google Scholar
• J. D. Eshelby, The elastic field outside an ellipsoidal inclusion, Proc. Roy. Soc. A 252, 561–569 (1959).
   Google Scholar
• K. Wakashima, M. Otsuka, and S. Umekawa, Thermal expansions of heterogeneous solids containing aligned ellipsoidal inclusions, J. Compos. Mater. 8 (1974) 391–404 (1974).
   Google Scholar
• J. C. Maxwell, A Treatise on Electricity and Magnetism, 3rd ed., Oxford University Press, London, UK (1904).
   Google Scholar
• S. C. Cheng and R. I. Vachon, The prediction of the thermal conductivity of two and three phase solid heterogeneous mixtures, Int. J. Heat Mass Transf. 12, 249–264 (1969).
   Web of Science ®Google Scholar
• Y. Agari and T. Uno, Estimation on thermal conductivities of filled polymers, J. Appl. Polymer Sci. 32, 5705–5712 (1986).
   Web of Science ®Google Scholar
• T. Lewis and L. Nielsen, Dynamics mechanical properties of particulate-filled composites, J. Appl. Polymer Sci. 14, 1449–1471 (1970).
   Web of Science ®Google Scholar
• D. A. G. Bruggeman, The prediction of the thermal conductivity of heterogeneous mixtures, Ann. Phys. 416, 665–679 (1935).
   Google Scholar
• R. Tavangar, J. M. Molina, and L. Weber, assessing predictive schemes for thermal conductivity against diamond-reinforced silver matrix composites at intermediate phase contrast, Scripta Materialia 56, 357–360 (2007).
   Web of Science ®Google Scholar
• R. L. Hamilton and O. K. Crosser, Thermal conductivity of heterogeneous two-component system, Industr. Eng. Chem. Fund. 1, 187–191 (1962).
   Web of Science ®Google Scholar
• R. L. Kapitza, The study of heat transfer in helium II, J. Phys. USSR, 4, 177–181 (1941).
   Google Scholar
• D. P. H. Hasselman and L. F. Johnson, Effective thermal conductivity of composites with interfacial thermal barrier resistance, J. Compos. Mater. 21, 508–515 (1987).
   Web of Science ®Google Scholar
• J. R. Thomas and D. P. H. Hasselman, Effective thermal conductivity of continuous matrix–spherical dispersed phase composite with single-point interfacial thermal contact: Continuum regime gas conduction in the gap, J. Compos. Mater. 40, 1023–1034 (2006).
   Web of Science ®Google Scholar
• A. G. Every, The effect of particle size on the thermal conductivity of ZnS/diamond composites, Acta Metallurgica et Materialia 40, 123–129 (1992).
   Google Scholar
• E. T. Swartz and R. O. Pohl, Thermal boundary resistance, Rev. Mod. Phys. 61, 605–668 (1989).
   Web of Science ®Google Scholar
• K. Chu, C. Jia, X. Liang, H. Chen, and H. Guo, The thermal conductivity of pressure infiltrated SiC/Al composites with various size distributions: Experimental study and modeling, Mater. Des. 30, 3497–3503 (2009).
   Web of Science ®Google Scholar
• H. Hatta, M. Taya, F. A. Kulacki, and J. F. Harder, Thermal diffusivities of composites with various types of filler, J. Compos. Mater. 26, 612–625 (1992).
   Web of Science ®Google Scholar
• C. Nan, R. Birringer, D. R. Clarke, and H. Gleiter, Effective thermal conductivity of particulate composites with interfacial thermal resistance, J. Appl. Phys. 81, 6692–6699 (1997).
   Web of Science ®Google Scholar
• X. D. Liu, J. S. Zhang, X. M. Cao, and H. Zhang, Finite element simulation of the thermal properties of particulate and continuous network-reinforced metal-matrix composite, Proc. of the Institution of Mechanical Engineers, Part B J. Eng. Manuf. 219, 111–121 (2005).
   Web of Science ®Google Scholar
• Y. Hua and L. Gu, Prediction of the thermo-mechanical behavior of particle-reinforced metal matrix composites, Compos. Part B 45, 1464–1470 (2013).
   Web of Science ®Google Scholar
• M. Aadmi, M. Karki, L. Ibos, and M. E Hammouti, Effective thermal conductivity of random two-phase composites, J. Reinfor. Plastic Compos. 33, 69–80 (2014).
   Web of Science ®Google Scholar
• H. Zhang, Y. Zeng, H. Zhang, and F. Guo, Computational investigation of the effective thermal conductivity of interpenetrating network composites, J. Compos. Mater. 44, 1247–1260 (2010).
   Web of Science ®Google Scholar
• M. Wang, J. He, J. Yu, and N. Pan, Lattice Boltzmann modeling of the effective thermal conductivity for fibrous materials, Int. J. Therm. Sci. 46, 848–855 (2007).
   Web of Science ®Google Scholar
• M. Wang, Q. Kang, and N. Pan, Thermal conductivity enhancement of carbon fiber composites, Appl. Therm. Eng. 29, 418–421 (2009).
   Web of Science ®Google Scholar
• S. Ghosh, Z. Nowak, and K. Lee, Tessellation-based computational methods for the characterization and analysis of heterogeneous microstructure, Compos. Sci. Technol. 57, 1187–1210 (1997).
   Web of Science ®Google Scholar
• R. Pyrz, Quantitative description of the microstructure of composites: Morphology of unidirectional composite systems, Compos. Sci. Technol. 50, 197–208 (1994).
   Web of Science ®Google Scholar
• J. Turias, J. M. Gutierrez, and P. L. Galindo, Modelling the effective thermal conductivity of an unidirectional composite by the use of artificial neural networks, Compos. Sci. Technol. 65, 609–619 (2005).
   Web of Science ®Google Scholar
• D. Marcos-Gomez, J. Ching-Llyod, M. R. Elizalde, W. J. Clegg, and J. M. Molina-Aldareguia, Predicting the thermal conductivity of composite materials with imperfect interfaces, Compos. Sci. Technol. 70, 2276–2283 (2010).
   Web of Science ®Google Scholar