REFERENCES
- Kim, H.K.; Tu, K.N. Rate of consumption of Cu in soldering accompanied by ripening. Applied Physics Letter 1995, 67, 2002–2004.
- Di Maio, D.; Hunt, C.P. On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters. Soldering Surface Mount Technology 2009, 21 (4), 24–31.
- Zhang, L.; He, C.-W.; Guo, Y.-H.; Han, J.-G.; Zhang, Y.-W.; Wang, X.-Y. Development of SnAg-based lead free solders in electronics packaging. Microelectronics Reliability 2012, 52, 559–578.
- Suganuma, K. Advances in lead-free electronics soldering. Current Opinion in Solid State and Materials Science 2001, 5, 55–64.
- Alam, M.O.; Chan, Y.C.; Tu, K.N. Effect of 0.5 wt% Cu addition in Sn-3.5%Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics 2003, 94 (12), 7904–7909.
- Izuta, G.; Tanabe, T.; Suganuma, K. Simplified Measuring method of copper concentration in solder bath utilizing copper dissolution. IEEE Transactions on Electronics Packaging Manufacturing 2009, 32 (3), 138–143.
- Izuta, G.; Tanabe, T.; Suganuma, K. Dissolution of copper on Sn-Ag-Cu system lead-free solder. Soldering and Surface Mount Technology 2007, 19 (2), 4–11.
- Barbini, D.; Wang, P. Implementing lead-free wave soldering. INEMI – Printed Circuit Design and Manufacturing, May 2005.
- Shaefer, M.; Laub, W.; Sabee, J.M.; Fournelle, R.A. A numerical method for predicting intermetallic layer thickness developed during the formation of solder joints. Journal of Electronic Materials 1996, 25, 992–2003.
- Yang, M.; Cao, Y.; Joo, S.; Chen, H.; Ma, X.; Li, M. Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds. Journal of Alloys and Compounds 2014, 582, 688–695.
- Haseeb, A.S.M.A.; Arafat, M.M.; Mohd Rafie, Johan. Stability of molybdenum nanoparticles in Sn–3.8Ag–0.7Cu solder during multiple reflow and their influence on interfacial intermetallic compounds. Materials Characterization 2012, 64, 27–35.
- Alam, M.E.; Nai, S.M.L.; Gupta, M. Effect of amount of Cu on the intermetallic layer thickness between Sn-Cu solders and Cu substrates. Journal of Electronic Materials 2009, 38 (12), 2479–2488.
- Chada, S.; Laub, W.; Fournelle, R.A.; Shangguan, D. An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates. Journal of Electronic Materials 1999, 28, 1194–1202.