References
- Bharat Bhushan, Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices[J]. Microelectronic Engineering, 84, 387–412 (2007).
- J. I. Ma, Advanced MEMS-based technologies and displays[J]. Displays, 37, 2–10 (2015).
- J. Bryzek, Impact of MEMS technology on society[J]. Sensors and actuators, 56, 1–9 (1996).
- M. H. Bao, Future of micro-electromechanical systems[J]. Sensors and actuators, 54, 135–141 (1996).
- Chunlei Wang, Marc Madou, From MEMS to NEMS with carbon[J]. Biosensors and Bioelectronics, 20,2181–2187 (2005).
- A. R. Krauss, et al., Ultrananocrystalline diamond thin films for MEMS and moving mechanical assembly devices[J]. Diamond and Related Materials, 10, 1952–1961 (2001).
- Cong Liu, J. H. Wang, and L. W. Xiong, Study on the developments of dry eching graphical of CVD diamond film[J]. Diamond & Abrasives Engineering, 34(2), 35–39 (2014).
- X. D. Wang, G. D. Hong, J. Zhang, et al., Precise patterning of diamond films for MEMS application[J]. Journal of Materials Processing Technology, (127): 230–233 (2002).
- W. D. Mang, Peng Xie, Y. Q. Wu, Development of studying on patterning techniques of CVD diamond films[J]. Vacuum and Cryogenics, 14(2), 63–67 (2008).
- M. Boufnichel, P. Lefaucheux, S. Aachboun, et al., Origin, control and elimination of undercut in silicon deep plasma etching in the cryogenic process[J]. Microelectronic Engineering, 77, 327–336 (2005).
- M. Boufnichel, S. Aachboun, F. Grangeon, et al., Profile control of high aspect ratio trenches of silicon. I. Effect of process parameters on local bowing[J]. Journal of Vacuum Science & Technology B, 20(4), 1508–1512 (2002).
- M. Boufnichel, S. Aachboun, P. Lefaucheux, et al., Profile control of high aspect ratio trenches of silicon. II. Study of the mechanisms responsible for local bowing formation and elimination of this effect[J]. Journal of Vacuum Science& Technology B, 21(1), 267–274 (2003).