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Integrated Ferroelectrics
An International Journal
Volume 209, 2020 - Issue 1: Proceedings of the Eighteenth China International Nanoscience and Techology Symposium (CINSTS19), Part IV of V
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Articles

Effect of Molding Temperature on Shape Memory Performance of SMPC

Yuqin MaSchool of Mechano-Electronic Engineering, Xidian University, Xi’an, ChinaCorrespondence[email protected] [email protected]
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,
Jie WangSchool of Mechano-Electronic Engineering, Xidian University, Xi’an, ChinaCorrespondence[email protected] [email protected]
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,
Shuangshuang LiSchool of Mechano-Electronic Engineering, Xidian University, Xi’an, ChinaView further author information
,
Juan MaSchool of Mechano-Electronic Engineering, Xidian University, Xi’an, ChinaView further author information
,
Yatao ZhaoSchool of Mechano-Electronic Engineering, Xidian University, Xi’an, ChinaView further author information
&
Wei XuSchool of Mechano-Electronic Engineering, Xidian University, Xi’an, ChinaView further author information
Pages 30-39 | Received 05 Sep 2019, Accepted 03 Feb 2020, Published online: 01 Jul 2020

References

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