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Original Articles

Effects of compressive strain on the evolution of interfacial strength of steel/nickel solid-state bonding at low temperature

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Pages 344-350 | Received 06 Jul 2017, Accepted 01 Sep 2017, Published online: 25 Oct 2017

References

  • Derby B, Wallach ER. Theoretical model for diffusion bonding. Met Sci. 1982;16(1):49–56. doi: 10.1179/030634582790427028
  • Derby B, Wallach ER. Diffusion bonding: development of theoretical model. Met Sci. 1984;18(9):427–431. doi: 10.1179/030634584790419809
  • Takahashi Y, Inoue K. Recent void shrinkage models and their applicability to diffusion bonding. Mater Sci Technol. 1992;8(11):953–964. doi: 10.1179/mst.1992.8.11.953
  • Mohamed HA, Washburn J. Mechanism of solid state pressure welding. Weld J. 1975;54(9):302–310.
  • Johnson KI, Keller DV, Jr. Effect of contamination on the adhesion of metallic couples in ultra-high vacuum. J Appl Phys. 1967;38(4):1896–1904. doi: 10.1063/1.1709780
  • Deng YQ, Sheng GM, Huang ZH, et al. Microstructure and mechanical properties of diffusion bonded titanium/304 stainless steel joint with pure Ag interlayer. Sci Technol Welding Joining. 2013;18(2):143–146. doi: 10.1179/1362171812Y.0000000083
  • Muralimohan CH, Ashfaq M, Ashiri R, et al. Analysis and characterization of the role of Ni interlayer in the friction welding of titanium and 304 austenitic stainless steel. Metall Mater Trans A. 2016;47(1):347–359. doi: 10.1007/s11661-015-3210-z
  • Sabetghadam H, Hanzaki AZ, Araee A. Diffusion bonding of 410 stainless steel to copper using a nickel interlayer. Mater Charact. 2010;61(6):626–634. doi: 10.1016/j.matchar.2010.03.006
  • Manesh HD, Taheri AK. The effect of annealing treatment on mechanical properties of aluminum clad steel sheet. Mater Des. 2003;24(8):617–622. doi: 10.1016/S0261-3069(03)00135-3
  • Pongmorakot K, Nambu S, Shibuta Y, et al. Investigation on the mechanism of steel/steel solid-state bonding at low temperatures. Sci Technol Welding Joining. 2017;22(3):257–263. doi: 10.1080/13621718.2016.1222237
  • Akatsu T, Hosoda N, Suga T, et al. Atomic structure of Al/Al interface formed by surface activated bonding. J Mater Sci. 1999;34(17):4133–4139. doi: 10.1023/A:1004661610307
  • Suga T. Cu-Cu room temperature bonding-current Status of surface activated bonding (SAB). ECS Trans. 2006;3(6):155–163. doi: 10.1149/1.2357065
  • Evans AG, Hutchinson JW, Wei Y. Interface adhesion: effects of plasticity and segregation. Acta Mater. 1999;47(15):4093–4113. doi: 10.1016/S1359-6454(99)00269-4
  • Mukunthan K, Hawbolt EB. Modeling recovery and recrystallization kinetics in cold-rolled Ti-Nb stabilized interstitial-free steel. Metall Mater Trans A. 1996;27(11):3410–3423. doi: 10.1007/BF02595434

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