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Science and Technology of Advanced Materials Volume 18, 2017 - Issue 1
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Optical, magnetic and electronic device materials

Intermetallic compounds in 3D integrated circuits technology: a brief review

Syahira AnnuarCentre for advanced manufacturing and materials processing (AMMP), Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, MalaysiaORCID Iconhttp://orcid.org/0000-0001-9014-0653
ORCID Icon,
Reza MahmoodianCentre for advanced manufacturing and materials processing (AMMP), Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia;Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA, USA;Department of Research and Development, Azarin Kar IND. Co, Kerman, IranCorrespondence[email protected]
ORCID Iconhttp://orcid.org/0000-0001-5426-7665
ORCID Icon,
Mohd HamdiCentre for advanced manufacturing and materials processing (AMMP), Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur, Malaysia;Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA, USA
&
King-Ning TuDepartment of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA, USA;Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, People’s Republic of China
Pages 693-703 | Received 28 Nov 2016, Accepted 04 Aug 2017, Published online: 28 Sep 2017

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