Effects of electrolyte thickness, chloride ion concentration, and an external direct current electric field on corrosion behaviour of silver under a thin electrolyte layer

References

• Hienonem R, Lahtinen R. Corrosion and climatic effects in electronics. Vtt Publications. 2007;623:3–243.
   Google Scholar
• Minzari D, Jellesen MS, Møller P, et al. Electrochemical migration on electronic chip resistors in chloride environments. IEEE Trans Device Mater Reliab. 2009;9:392–402. doi: 10.1109/TDMR.2009.2022631
   Web of Science ®Google Scholar
• Minzari D, Møller P, Ambat R. 2010. Investigation of electronic corrosion mechanisms. Ph.D. Thesis, Technical University of Denmark, Lyngby, Demark.
   Google Scholar
• Schweigart H, Wack H. Humidity and pollution effects on Pb-free assemblies: a study of how metallization and operating voltage influence electrochemical migration. Mar Petrol Geol. 2009;11(6):590–591.
   Google Scholar
• Huang H, Dong Z, Chen Z, et al. The effects of Cl− ion concentration and relative humidity on atmospheric corrosion behaviour of PCB-Cu under adsorbed thin electrolyte layer. Corros Sci 2011;53:1230–1236. doi: 10.1016/j.corsci.2010.12.018
   Web of Science ®Google Scholar
• Huang H, Guo X, Zhang G, et al. The effects of temperature and electric field on atmospheric corrosion behaviour of PCB-Cu under absorbed thin electrolyte layer. Corros Sci 2011;53:1700–1707. doi: 10.1016/j.corsci.2011.01.031
   Web of Science ®Google Scholar
• Zhong X, Zhang G, Qiu Y, et al. The corrosion of tin under thin electrolyte layers containing chloride. Corros Sci 2013;66:14–25. doi: 10.1016/j.corsci.2012.08.040
   Web of Science ®Google Scholar
• Huang H, Pan Z, Qiu Y, et al. Electrochemical corrosion behaviour of copper under periodic wet–dry cycle condition. Microelectron Reliab 2013;53:1149–1158. doi: 10.1016/j.microrel.2013.05.002
   Web of Science ®Google Scholar
• Zou S, Li X, Dong C, et al. Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment. Electrochim Acta. 2013;114:363–371. doi: 10.1016/j.electacta.2013.10.051
   Web of Science ®Google Scholar
• Medgyes B, Illés B, Beréyi R, et al. In situ optical inspection of electrochemical migration during THB tests. J Mater Sci. 2011;22:694–700.
   Web of Science ®Google Scholar
• Verdingovas V, Jellesen MS, Ambat R. Influence of sodium chloride and weak organic acids (flux residues) on electrochemical migration of tin on surface mount chip components. Corros Eng Sci Technol. 2013;48:426–435. doi: 10.1179/1743278213Y.0000000078
   Web of Science ®Google Scholar
• Zhong X, Zhang G, Qiu Y, et al. In situ study the dependence of electrochemical migration of tin on chloride. Electrochem Commun. 2013;27:63–68. doi: 10.1016/j.elecom.2012.11.010
   Web of Science ®Google Scholar
• Zhong X, Zhang G, Qiu Y, et al. Electrochemical migration of tin in thin electrolyte layer containing chloride ions. Corros Sci. 2013;74:71–82. doi: 10.1016/j.corsci.2013.04.015
   Web of Science ®Google Scholar
• Zhong X, Zhang G, Guo X. The effect of electrolyte layer thickness on electrochemical migration of tin. Corros Sci. 2015;96:1–5. doi: 10.1016/j.corsci.2015.04.014
   Web of Science ®Google Scholar
• Zhong X, Guo X, Qiu Y, et al. In situ study the electrochemical migration of Tin under unipolar square wave electric field. J Electrochem Soc. 2013;160:D495–D500. doi: 10.1149/2.014311jes
   Web of Science ®Google Scholar
• Liao B, Chen Z, Qiu Q, et al. Inhibitory effect of cetyltrimethylammonium bromide on the electrochemical migration of tin in thin electrolyte layers containing chloride ions. Corros Sci. 2017;118:190–201. doi: 10.1016/j.corsci.2017.02.013
   Web of Science ®Google Scholar
• Liao B, Chen Z, Qiu Q, et al. Effect of citrate ions on the electrochemical migration of tin in thin electrolyte layer containing chloride ions. Corros Sci. 2016;112:393–401. doi: 10.1016/j.corsci.2016.08.003
   Web of Science ®Google Scholar
• Zhong X, Chen L, Hu J, et al. In situ study of the electrochemical migration of Tin under bipolar square wave voltage. J Electrochem Soc. 2017;164:D342–D347. doi: 10.1149/2.1491706jes
   Web of Science ®Google Scholar
• Huang H, Pan Z, Guo X, et al. Effect of an alternating electric field on the atmospheric corrosion behaviour of copper under a thin electrolyte layer. Corros Sci. 2013;75:100–105. doi: 10.1016/j.corsci.2013.05.019
   Web of Science ®Google Scholar
• Huang H, Guo X, Zhang G, et al. Effect of direct current electric field on atmospheric corrosion behavior of copper under thin electrolyte layer. Corros Sci. 2011;53:3446–3449. doi: 10.1016/j.corsci.2011.04.017
   Web of Science ®Google Scholar
• Huang H, Pan Z, Guo X, et al. Effects of direct current electric field on corrosion behaviour of copper, Cl− ion migration behaviour and dendrites growth under thin electrolyte layer. Trans Nonferrous Met Soc China. 2014;24:285–291. doi: 10.1016/S1003-6326(14)63059-4
   Web of Science ®Google Scholar
• Conseil-Gudla H, Jellesen MS, Ambat R. Printed circuit board surface finish and effects of chloride contamination, electric field, and humidity on corrosion reliability. J Electron Mater. 2017;46:817–825. doi: 10.1007/s11664-016-4974-7
   Web of Science ®Google Scholar
• Huang HL, Tian J, Zhang GA. Atmospheric corrosion behavior of Tin under an alternating current electric field. J Electron Mater. 2017;46:4359–4372. doi: 10.1007/s11664-017-5395-y
   Web of Science ®Google Scholar
• Huang H, Tian J. Effects of electric field and bias voltage on corrosion behavior of tin under a thin electrolyte layer. Microelectron Reliab. 2017;78:131–142. doi: 10.1016/j.microrel.2017.08.013
   Web of Science ®Google Scholar
• Huang HL, Bu FR, Tian J, et al. Influence of direct current electric field on corrosion behavior of Tin under a thin electrolyte layer. J Electron Mater. 2017;46:6936–6946. doi: 10.1007/s11664-017-5727-y
   Web of Science ®Google Scholar
• Arra M, Shangguan DK, Xie DJ, et al. Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications. J Electron Mater. 2004;33:977–990. doi: 10.1007/s11664-004-0025-x
   Web of Science ®Google Scholar
• Wang W, Choubey A, Azarian MH, et al. An assessment of immersion silver surface finish for lead-free electronics. J Electron Mater. 2009;38:815–827. doi: 10.1007/s11664-009-0761-z
   Web of Science ®Google Scholar
• Wiesinger R, Martina I, Kleber CH, et al. Influence of relative humidity and ozone on atmospheric silver corrosion. Corros Sci. 2013;77:69–76. doi: 10.1016/j.corsci.2013.07.028
   Web of Science ®Google Scholar
• Minzari D, Jellesen MS, Møller P, et al. Morphological study of silver corrosion in highly aggressive sulfur environments. Eng Fail Anal. 2011;18:2126–2136. doi: 10.1016/j.engfailanal.2011.07.003
   Web of Science ®Google Scholar
• Liang D, Allen HC, Frankel GS, et al. Effects of sodium chloride particles, ozone, UV, and relative humidity on atmospheric corrosion of silver. J Electrochem Soc. 2010;157:C146–C156. doi: 10.1149/1.3310812
   Web of Science ®Google Scholar
• Huo Y, Tan MY. Localised corrosion of cathodically protected pipeline steel under the effects of cyclic potential transients. Corros Eng Sci Technol. 2018;53:348–354. doi: 10.1080/1478422X.2018.1471250
   Web of Science ®Google Scholar
• Huo Y, Tan MY. Measuring and understanding the critical duration and amplitude of anodic transients. Corros Eng Sci Technol. 2018;53:65–72. doi: 10.1080/1478422X.2017.1386017
   Web of Science ®Google Scholar
• Tan Y, Liu T. Characterising localised corrosion inhibition by means of parameters measured by an electrochemically integrated multielectrode array. Corros Eng Sci Technol. 2014;49:23–31. doi: 10.1179/1743278213Y.0000000100
   Web of Science ®Google Scholar
• Huang H, Tian J, Zhang G, et al. The corrosion of X52 steel at an elbow of loop system based on array electrode technology. Mater Chem Phys. 2016;181:312–320. doi: 10.1016/j.matchemphys.2016.06.064
   Web of Science ®Google Scholar
• Tian J, Huang H, Pan Z, et al. Effect of flow velocity on corrosion behavior of AZ91D magnesium alloy at elbow of loop system. Trans Nonferrous Met Soc China. 2016;26:2857–2867. doi: 10.1016/S1003-6326(16)64414-X
   Web of Science ®Google Scholar
• Nishikata A, Ichihara Y, Tsuru T. An application of electrochemical impedance spectroscopy to atmospheric corrosion study. Corros Sci. 1995;37:897–911. doi: 10.1016/0010-938X(95)00002-2
   Web of Science ®Google Scholar
• Graedel TE. Corrosion mechanisms for silver exposed to the atmosphere. J Electrochem Soc. 1992;139:1963–1970. doi: 10.1149/1.2221162
   Web of Science ®Google Scholar
• Cheng YL, Zhang Z, Cao FH, et al. A study of the corrosion of aluminum alloy 2024-T3 under thin electrolyte layers. Corros Sci. 2004;46:1649–1667. doi: 10.1016/j.corsci.2003.10.005
   Web of Science ®Google Scholar
• Stratmann M, Streckel H, Kim KT, et al. On the atmospheric corrosion of metals which are covered with thin electrolyte layers – iii. The measurement of polarisation curves on metal surfaces which are covered by thin electrolyte layers. Corros Sci. 1990;30:715–734. doi: 10.1016/0010-938X(90)90034-3
   Web of Science ®Google Scholar