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Part A: Materials Science

Effect of bonding parameters on microstructure development during TGTLP bonding of Al7075 alloy

S. Salman S. AfghahiFaculty of Mechanical Engineering, K. N. Toosi University of Technology, 1999143344, Tehran, Iran

Aliakbar EkramiDepartment of Materials Science and Engineering, Sharif University of Technology, 11365-9466, Tehran, Iran

Saeed FarahanyFaculty of Mechanical Engineering, Department of Materials, Manufacturing and Industrial Engineering, University Teknologi Malaysia, Malaysia, Johor81310, MalaysiaCorrespondence[email protected]
[email protected]

Amirreza JahangiriFaculty of Mechanical Engineering, Department of Materials, Manufacturing and Industrial Engineering, University Teknologi Malaysia, Malaysia, Johor81310, Malaysia

Pages 1166-1176 | Received 01 Aug 2013, Accepted 19 Dec 2013, Published online: 21 Mar 2014

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https://doi.org/10.1080/14786435.2014.885132
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