References
- E.A. Starke and J.T. Staley, Application of modern aluminum alloys to aircraft, Prog. Aerosp. Sci. 32 (1996), pp. 131–172.
- Y. Liu, L. Li, M. Xu, X. Cai, Q. Chen, Y. Hu, and P.K. Chu, Effects of nitrogen ion implantation and implantation energy on surface properties and adhesion strength of TiN films deposited on aluminum by magnetron sputtering, Mater. Sci. Eng. A 415 (2006), pp. 140–144.
- J. Jagielskia, A. Piatkowska, P. Aubert, and C. Legrand-Buscema, Effects of high dose nitrogen implantation into aluminum, Vacuum 70 (2003), pp. 147–152.
- J. Chakraborty, S. Mukherjee, P.M. Raole, and P.I. John, Feasibility study of aluminum nitride formation by nitrogen plasma source ion implantation on aluminum, Mater. Sci. Eng. A 304 (2001), pp. 910–913.
- H.K. Sanghera, J.L. Sullivan, and S.O. Saied, A study of nitrogen implantation in aluminum a comparison of experimental results and computer simulation, Appl. Surf. Sci. 141 (1999), pp. 57–76.
- B.W. Karr, I. Petrov, D.G. Cahill, and J.E. Greene, Morphology of epitaxial TiN(001) grown by magnetron sputtering, Appl. Phys. Lett. 70 (1997), pp. 1703–1705.
- R. Gunzel, E. Wieser, and E. Richer, Plasma source ion-implantation of oxygen and nitrogen in aluminum, J. Vac. Sci. Technol. B 12 (1994), pp. 927–930.
- K.C. Walter, Nitrogen plasma source ion implantation of aluminum, J. Vac. Sci. Technol. B. 12 (1994), pp. 945–950.
- S. Lucas and J. Chevallier, Nano-hardness and transmission electron microscopy study of nitrogen-implanted aluminum, Surf. Coat. Technol. 65 (1994), pp. 128–132.
- Y. Jiang, H. Liu, R. Zhou, and B. Tang, Tribological behaviors and corrosion resistance of aluminum alloys by nitrogen plasma immersion ion implantation, Rev. Adv. Mater. Sci. 33 (2013), pp. 281–286.
- S. Thibault and E. Hug, Corrosion and wear mechanisms of aluminum alloys surface reinforced by multi-charged N-implantation, App. Surf. Sci 310 (2014), pp. 311–316.
- E. Richter, R. Günzel, S. Parasacandola, T. Telbizova, O. Kruse, and W. Moller, Nitriding of stainless steel and aluminum alloys by plasma immersion ion implantation, Surf. Coat. Technol. 128 (2000), pp. 21–27.
- L. Zhang, J.H. Booske, and J.L. Shohet, Anti-corrosive surface modification of 6061 aluminum using plasma source ion implantation, Mater. Lett. 22 (1995), pp. 29–33.
- E.M. Caffery, P.M. Natishan, and G.K. Hubler, Pitting behavior of aluminum ion implanted with nitrogen, Corrosion 53 (1997), pp. 556–561.
- G. Piazza, V. Cimalla, P. Muralt, R.H. Olsson, and R. Ruby, Piezoelectric aluminum nitride thin films for microelectromechanical systems, MRS Bull. 37 (2012), pp. 1051–1061.
- K. Tonisch, V. Cimalla, C. Foerster, H. Romanus, O. Ambacher, and D. Dontsov, Piezoelectric properties of polycrystalline AlN thin films for MEMS application, Sens. Actuators, A 132 (2006), pp. 658–663.
- H. Savaloni, M. Motmaen-Dadgar, M. Ghoranneviss, and M.R. Hantehzadeh, Temperature and N+ energy dependence on nano-structural modifications and characteristics of Mo surface, Appl. Surf. Sci. 253 (2006), pp. 2915–2923.
- H. Savaloni and F. Modiri, Surface nano-structural modifications and characteristics in nitrogen ion implanted W as a function of temperature and N+ energy, Appl. Surf. Sci. 253 (2006), pp. 1135–1142.
- H. Savaloni and S.B. Najmi, Characteristics of Cu and Zn films deposited on glass and stainless steel substrates at different substrate temperatures and angle of incidence, Vacuum 66 (2002), pp. 49–58.
- H. Savaloni, M. Gholipour-Shahraki, and M.A. Player, A comparison of different methods for x-ray diffraction line broadening analysis of Ti and Ag UHV deposited thin films: Nanostructural dependence on substrate temperature and film thickness, J. Phys. D: Appl. Phys. 39 (2006), pp. 2231–2247.
- Z. Shi and M.A. Player, Preferred orientations of evaporated Ni films on Mo and SiO2 substrates, Vacuum 49 (1998), pp. 257–263.
- H. Savaloni, A. Taherizadeh, and A. Zendehnam, Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness, Physica B 349 (2004), pp. 44–55.
- H. Savaloni, G.R. Moradi, and M.A. Player, Texture development and residual stress in UHV evaporated silver films on glass substrates as a function of substrate temperature, Vacuum 77 (2005), pp. 245–257.
- A.E. Curzon, A mass spectrometer study of the reaction of erbium with the residual gases in a vacuum coating unit and with heavy water, J. Less Common Met. 98 (1984), pp. 149–157.
- D.M. Holloway and W.E. Swartz, The interaction of water vapor with erbium and erbium dideuteride films, Appl. Spectrosc. 31 (1977), pp. 167–168.
- H. Savaloni, M.A. Player, and G.V. Marr, Influence of substrate temperature, deposition rate, surface texture and material on the structure of uhv deposited erbium films, Vacuum 43 (1992), pp. 965–980.
- J.I. Langford and A.J. Wilson, Scherrer after sixty years: A survey and some new results in the determination of crystallite size, J. Appl. Cryst. 11 (1978), pp. 102–113.
- H. Klung and L. Alexander, X ray diffraction procedure, Wiley, New York, 1954.