Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu(Ni)–Sn system

References

• V.A. Baheti, S. Islam, P. Kumar, R. Ravi, R. Narayanan, D. Hongqun, V. Vuorinen, T. Laurila, and A. Paul, Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system, Phil. Mag. 96 (2016), pp. 15–30.10.1080/14786435.2015.1119905
   Google Scholar
• V. Vuorinen, T. Laurila, T. Mattila, E. Heikinheimo, and J.K. Kivilahti, Solid-state reactions between Cu(Ni) alloys and Sn, J. Electron. Mater. 36 (2007), pp. 1355–1362.10.1007/s11664-007-0251-0
   Web of Science ®Google Scholar
• V. Vuorinen, H. Yu, T. Laurila, and J.K. Kivilahti, Formation of intermetallic compounds between liquid Sn and various CuNix metallizations, J. Electron. Mater. 37 (2008), pp. 792–805.10.1007/s11664-008-0411-x
   Web of Science ®Google Scholar
• A. Paul, The Kirkendall effect in solid state diffusion, PhD thesis, Eindhoven University of Technology, 2004. Available at www.alexandria.tue.nl/extra2/200412361.pdf.
   Google Scholar
• V.A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay, and A. Paul, Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system, Acta Mater. 131 (2017), pp. 260–270.
   Google Scholar
• A. Paul, S.V. Divinski, Handbook of solid state diffusion: practice and applications, Elsevier, The Netherlands, 2017. Estimated publication time.
   Google Scholar
• W. Burkhardt and K. Schubert, Über messingartige Phasen mit A3-verwandter Struktur [About brass-like phases with A3-related structure], Zeitschrift Fur Metallkunde 50 (1959), pp. 442–452.
   Google Scholar
• R.J. Fields, S.R. Low, and G.K. Lucey, in The Metal Science of Joining, M.J. Cieslak, J.H. Perepezko, S. Kang and M.E. Glicksman eds., TMS-AIME, Warrendale, PA, 1992, pp. 165–173.
   Google Scholar
• A. Gangulee, G.C. Das, and M.B. Bever, An X-ray diffraction and calorimetric investigation of the compound Cu6Sn5, Metall. Trans. 4 (1973), pp. 2063–2066.10.1007/BF02643268
   Web of Science ®Google Scholar
• K. Nogita, Stabilisation of Cu6Sn5 by Ni in Sn–0.7Cu–0.05Ni lead-free solder alloys, Intermetallics 18 (2010), pp. 145–149.10.1016/j.intermet.2009.07.005
   Web of Science ®Google Scholar
• X. Sang, K. Du, and H. Ye, An ordered structure of Cu3Sn in Cu–Sn alloy investigated by transmission electron microscopy, J. Alloys Compd. 469 (2009), pp. 129–136.10.1016/j.jallcom.2008.01.107
   Web of Science ®Google Scholar
• Y.Q. Wu, J.C. Barry, T. Yamamoto, Q.F. Gu, S.D. McDonald, S. Matsumura, H. Huang, and K. Nogita, A new phase in stoichiometric Cu6Sn5, Acta Mater. 60 (2012), pp. 6581–6591.10.1016/j.actamat.2012.08.024
   Web of Science ®Google Scholar
• C. Ghosh and A. Paul, A physico–chemical approach in binary solid-state interdiffusion, Acta Mater. 55 (2007), pp. 1927–1939.10.1016/j.actamat.2006.10.051
   Web of Science ®Google Scholar
• A. Paul, T. Laurila, V. Vuorinen, and S.V. Divinski, Thermodynamics, diffusion and the Kirkendall effect in solids, 1st ed., Springer, Switzerland, 2014.10.1007/978-3-319-07461-0
   Google Scholar
• M. Onishi and H. Fujibuchi, Reaction-diffusion in the Cu–Sn system, Trans. Jpn. Inst. Met. 16 (1975), pp. 539–547.10.2320/matertrans1960.16.539
   Google Scholar
• Y. Yuan, Y. Guan, D. Li, and N. Moelans, Investigation of diffusion behavior in Cu–Sn solid state diffusion couples, J. Alloys Compd. 661 (2016), pp. 282–293.10.1016/j.jallcom.2015.11.214
   Web of Science ®Google Scholar
• C. Wagner, The evaluation of data obtained with diffusion couples of binary single-phase and multiphase systems, Acta Metall. 17 (1969), pp. 99–107.10.1016/0001-6160(69)90131-X
   Google Scholar
• A. Paul, C. Ghosh, and W.J. Boettinger, Diffusion parameters and growth mechanism of phases in the Cu–Sn system, Metall. Mater. Trans. A 42 (2011), pp. 952–963.10.1007/s11661-010-0592-9
   Web of Science ®Google Scholar
• F.J.J. van Loo, Multiphase diffusion in binary and ternary solid-state systems, Prog. Solid State Chem. 20 (1990), pp. 47–99.10.1016/0079-6786(90)90007-3
   Web of Science ®Google Scholar
• J.R. Manning, Diffusion and the Kirkendall shift in binary alloys, Acta Metall. 15 (1967), pp. 817–826.10.1016/0001-6160(67)90363-X
   Google Scholar
• T. Laurila, V. Vuorinen, A. Kumar, and A. Paul, Diffusion and growth mechanism of Nb3Sn superconductor grown by bronze technique, Appl. Phys. Lett. 96 (2010), pp. 2319101–2319103.
   Web of Science ®Google Scholar
• P. Kiruthika, S.K. Makineni, C. Srivastava, K. Chattopadhyay, and A. Paul, Growth mechanism of the interdiffusion zone between platinum modified bond coats and single crystal superalloys, Acta Mater. 105 (2016), pp. 438–448.10.1016/j.actamat.2015.12.014
   Web of Science ®Google Scholar
• P. Kiruthika, S.K. Makineni, C. Srivastava, K. Chattopadhyay, A. Paul, Corrigendum to “growth mechanism of the interdiffusion zone between platinum modified bond coats and single crystal superalloys” [Acta Mater. 105, (2016) 438–448], Acta Mater 122(2017) , p. 152.10.1016/j.actamat.2015.12.014
   Web of Science ®Google Scholar
• S. Santra, S.K. Makineni, S. Suwas, K. Chattopadhyay, and A. Paul, Role of Ti on growth, morphology and microtexture evolution of A15-based V3 Ga superconductor by bronze technique, Mater. Des. 110 (2016), pp. 404–413.10.1016/j.matdes.2016.07.143
   Web of Science ®Google Scholar
• N. Saunders and A.P. Miodownik, The Cu–Sn (copper–tin) system, Bull. Alloy Phase Diagr. 11 (1990), pp. 278–287.10.1007/BF03029299
   Google Scholar
• X.Y. Zhang, W. Sprengel, K. Blaurock, A.A. Rempel, K.J. Reichle, K. Reimann, H. Inui, and H.E. Schaefer, Vacancies selectively induced and specifically detected on the two sublattices of the intermetallic compound MoSi2, Phys. Rev. B. 66 (2002), pp. 1441051–1441055.
   Web of Science ®Google Scholar
• S. Roy, S. Prasad, S.V. Divinski, and A. Paul, Diffusion pattern in MSi2 and M5Si3 silicides in group VB (M = V, Nb, Ta) and VIB (M = Mo, W) refractory metal-silicon systems, Philos. Mag. 94 (2014), pp. 1508–1528.10.1080/14786435.2014.888103
   Web of Science ®Google Scholar
• P. Kiruthika and A. Paul, A pseudo-binary interdiffusion study in the β–Ni(Pt)Al phase, Philos. Mag. Lett. 95 (2015), pp. 138–144.10.1080/09500839.2015.1020904
   Web of Science ®Google Scholar
• D. Mu, H. Huang, S.D. McDonald, J. Read, and K. Nogita, Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu, Ni)6Sn5 on diverse crystal planes, Mater. Sci. Eng. A 566 (2013), pp. 126–133.10.1016/j.msea.2012.12.057
   Web of Science ®Google Scholar