525
Views
0
CrossRef citations to date
0
Altmetric
Part A: Materials Science

Solid–state diffusion–controlled growth of the phases in the Au–Sn system

, , , &
Pages 20-36 | Received 06 May 2017, Accepted 25 Sep 2017, Published online: 06 Nov 2017

References

  • T. Laurila, V. Vuorinen, and J.K. Kivilahti, Interfacial reactions between lead-free solders and common base materials, Mater. Sci. Eng.: R: Rep. 49 (2005), pp. 1–60.10.1016/j.mser.2005.03.001
  • C.E. Ho, S.C. Yang, and C.R. Kao, Interfacial reaction issues for lead-free electronic solders, J. Mater. Sci.: Mater. Electron. 18 (2007), pp. 155–174.
  • C. Chen, D. Yu, and K.N. Chen, Vertical interconnects of microbumps in 3D integration, MRS Bull. 40 (2015), pp. 257–263.
  • T. Zhou, T. Bobal, M. Oud, and J. Songliang, Au/Sn solder alloy and its applications in electronics packaging, Internal Report of Coining, Inc. (1999), pp. 1–7. Available at http://www.ametek-ecp.com/-/media/ametek-ecp/files/cwtechnicalpapers/coining_english_gold_tin_paper.pdf.
  • S. Anhock, H. Oppermann, C. Kallmayer, R. Aschenbrenner, L. Thomas, and H. Reichl, Investigations of Au/Sn alloys on different end-metallizations for high temperature applications, 22nd IEEE/CPMT International Electronics Manufacturing Technology Symposium, Berlin, Germany, 1998.
  • L. Buene, H. Falkenberg-Arell, and J. Taftø, A study of evaporated gold-tin films using transmission electron microscopy, Thin Solid Films 65 (1980), pp. 247–257.10.1016/0040-6090(80)90258-8
  • Ž. Marinković and V. Simić, Conditions for compound formation in Au/metal couples at room temperature, J. Less Common Metals 115 (1986), pp. 225–234.10.1016/0022-5088(86)90144-X
  • H. Xu, V. Vuorinen, H. Dong, and M. Paulasto-Kröckel, Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures, J. Alloys Compd. 619 (2015), pp. 325–331.10.1016/j.jallcom.2014.08.245
  • W.M. Tang, A.Q. He, Q. Liu, and D.G. Ivey, Room temperature interfacial reactions in electrodeposited Au/Sn couples, Acta Mater. 56 (2008), pp. 5818–5827.10.1016/j.actamat.2008.08.002
  • A. Paul, Comments on “Room temperature interfacial reactions in electrodeposited Au/Sn couples”, Scr. Mater. 61 (2009), pp. 561–563.10.1016/j.scriptamat.2009.05.016
  • A. Paul, Growth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zone, J. Mater. Sci.: Mater. Electron. 22 (2011), pp. 833–837.
  • A. Paul, The Kirkendall effect in solid state diffusion, Ph.D. thesis, Eindhoven University of Technology, 2004. Available at www.alexandria.tue.nl/extra2/200412361.pdf.
  • A. Paul, A.A. Kodentsov, and F.J.J. van Loo, Intermetallic growth and Kirkendall effect manifestations in Cu/Sn and Au/Sn diffusion couples, Z. Metallkd 95 (2004), pp. 913–920.10.3139/146.018032
  • T. Yamada, K. Miura, M. Kajihara, N. Kurokawa, and K. Sakamoto, Formation of intermetallic compound layers in Sn/Au/Sn diffusion couple during annealing at 433 K, J. Mater. Sci. 39 (2004), pp. 2327–2334.10.1023/B:JMSC.0000019993.32079.c2
  • T. Yamada, K. Miura, M. Kajihara, N. Kurokawa, and K. Sakamoto, Kinetics of reactive diffusion between Au and Sn during annealing at solid-state temperatures, Mater. Sci. Eng. A 390 (2005), pp. 118–126.10.1016/j.msea.2004.08.053
  • V.A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay, and A. Paul, Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems, J. Alloys Compd. 727 (2017), pp. 832–840.
  • H. Zaka, S.S. Shenouda, S.S. Fouad, M. Medhat, G.L. Katona, A. Csik, G.A. Langer, and D.L. Beke, Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature, Microelectron. Reliability 56 (2016), pp. 85–92.10.1016/j.microrel.2015.10.018
  • N. Samy, S. Shenouda, M. Fadel, H. Talaat, G. Katona, G. Langer, A. Csik, and D. Beke, Investigation of solid-state reaction in Ag/Sn nanostructured thin films at room temperature, Philos. Mag. 95 (2015), pp. 2990–3001.10.1080/14786435.2015.1083135
  • G.Y. Molnár, G.L. Katona, G.A. Langer, A. Csík, Y.C. Chen, and D.L. Beke, Low temperature homogenization in nanocrystalline PdCu thin film system, Mater. Res. Express 2 (2015), p. 105012.10.1088/2053-1591/2/10/105012
  • A. Paul and S.V. Divinski (eds.), Handbook of Solid State Diffusion: Practice and Applications, Elsevier, The Netherlands, 2017.
  • Growel Technical Data Sheet for Sn plating. Available online as PDF at www.growel.com/tds/479.pdf.
  • H. Dong, X.M. Tao, T. Laurila, V. Vuorinen, and M. Paulasto-Kröckel, Thermodynamic modeling of Au–Ce–Sn ternary system, Calphad 42 (2013), pp. 38–50.10.1016/j.calphad.2013.07.013
  • S. Roy, S. Prasad, S.V. Divinski, and A. Paul, Diffusion pattern in MSi2 and M5Si3 silicides in group VB (M = V, Nb, Ta) and VIB (M = Mo, W) refractory metal-silicon systems, Philos. Mag. 94 (2014), pp. 1508–1528.10.1080/14786435.2014.888103
  • A. Paul, T. Laurila, V. Vuorinen, and S.V. Divinski, Thermodynamics, Diffusion and the Kirkendall Effect in Solids, 1st ed., Springer, Switzerland, 2014.10.1007/978-3-319-07461-0
  • V.A. Baheti, S. Islam, P. Kumar, R. Ravi, R. Narayanan, H. Dong, V. Vuorinen, T. Laurila, and A. Paul, Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)–Sn system, Philos. Mag. 96 (2016), pp. 15–30.10.1080/14786435.2015.1119905
  • V.A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay, and A. Paul, Bifurcation of the Kirkendall marker plane and the role of Ni and other impurities on the growth of Kirkendall voids in the Cu–Sn system, Acta Mater. 131 (2017), pp. 260–270.10.1016/j.actamat.2017.03.068
  • V.A. Baheti, S. Kashyap, P. Kumar, K. Chattopadhyay, and A. Paul, Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu(Ni)–Sn system, Philos. Mag. 97 (2017), pp. 1782–1802.10.1080/14786435.2017.1313466
  • P. Villars and L.D. Calvert, Pearson’s Handbook of Crystallographic Data for Intermetallic Phases, 2nd ed., Vol. 1, ASM International, Materials Park, OH, 1991.
  • C. Wagner, The evaluation of data obtained with diffusion couples of binary single-phase and multiphase systems, Acta Metall. 17 (1969), pp. 99–107.10.1016/0001-6160(69)90131-X
  • F.J.J. van Loo, Multiphase diffusion in binary and ternary solid-state systems, Prog. Solid State Chem. 20 (1990), pp. 47–99.10.1016/0079-6786(90)90007-3
  • P. Kiruthika and A. Paul, A pseudo-binary interdiffusion study in the β–Ni(Pt)Al phase, Philos. Mag. Lett. 95 (2015), pp. 138–144.10.1080/09500839.2015.1020904

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.