Influence of substrate type on deformation specificity of soft film/hard substrate coated systems under nanomicroindentation

References

• A.A. Volinsky and W.W. Gerberich, Microelectronic Eng. 69 (2003), pp. 519–527. doi:10.1016/S0167-9317(03)00341-1.
   Web of Science ®Google Scholar
• T. David Read and A.A. Volinsky, Thin films for microelectronics and photonics : physics, mechanics, characterization, and reliability. Handbook 50201 (2007), pp. 135–180.
   Google Scholar
• T.Y. Tsui, W.C. Oliver and G.M. Pharr, Nanoindentation of soft films on hard substrates:The importance of pile-Up. MRS Proceedings 436 (1996), pp. 207–212.
   Google Scholar
• S. Chen, L. Liu and T. Wang, Investigation of the mechanical properties of thin films by nanoindentation, considering the effects of thickness and different coating–substrate combinations. Surf. Coat. Technol. 191 (2005), pp. 25–32. doi:10.1016/j.surfcoat.2004.03.037.
   Web of Science ®Google Scholar
• A.A. Pelegri and X. Huang, Nanoindentation on soft film/hard substrate and hard film/soft substrate material systems with finite element analysis. Compos. Sci. Technol. 68(1) (2008), pp. 147–155. doi:10.1016/j.compscitech.2007.05.033.
   Web of Science ®Google Scholar
• J. Lamovec, V. Jovic, I. Mladenovic, D. Stojanivic, A. Kojovic and V. Radojevic, Indentation behaviour of 'soft film on hard substrate' composite system type. Zastita Materijala 56(3) (2015), pp. 269–277. doi:10.5937/ZasMat1503269L.
   Google Scholar
• J. Yang, Y. Huang and K. Xu, Effect of substrate on surface morphology evolution of Cu thin films deposited by magnetron sputtering. Surf. Coat. Technol. 201 (2007), pp. 5574–5577. doi:10.1016/j.surfcoat.2006.07.227.
   Web of Science ®Google Scholar
• T.Y. Tsui, C.A. Ross and G.M. Pharr. Nanoindentation hardness of soft films on hard substrates: effects of the substrate. Symposium J- Materials Reliability in Microelectronics VII, (1997), 57. http://doi.org/10.1557/PROC-473-57.
   Google Scholar
• T.Y. Tsui, C.A. Ross and G.M. Pharr, A method for making substrate-independent hardness measurements of soft metallic films on hard substrates by nanoindentation. J. Mater. Res. 18(6) (2003), pp. 1383–1391. doi:https://doi.org/10.1557/JMR.2003.0190.
   Web of Science ®Google Scholar
• S. Suresh, T.-G. Nieh and B.W. Choi, Nanoindentation of copper thin films on silicon substrates. Scr. Mater. 41(9) (1999), pp. 951–957.
   Web of Science ®Google Scholar
• Y. Zhou, et al., Measurement of young's modulus and residual stress of copper film electroplated on silicon wafer. Thin Solid Films 460(1) (2004), pp. 175–180.
   Web of Science ®Google Scholar
• Y.I. Golovin, Nanoindentation as a means of comprehensive assessment of the physical and mechanical properties of materials in submicrovolumes. Factory Laboratory. Mater. Diagnostics 75(1) (2009), pp. 45–59. (in Rus.).
   Google Scholar
• A.M. Korsunsky, et al., On the hardness of coated systems. Surf. Coat. Technol. 99 (1998), pp. 171–183.
   Web of Science ®Google Scholar
• A.M. Korsunsky and A. Constantinescu, Work of indentation approach to the analysis of hardness and modulus of thin coatings. MSE A 423 (2006), pp. 28–35.
   Google Scholar
• A.R. Shugurov, A.V. Panin and K.V. Oskomov, Specific features of the determination of the mechanical characteristics of thin films by the nanoindentation technique. Phys. Solid State 50(6) (2008), pp. 1050–1055.
   Web of Science ®Google Scholar
• T.Y. Tsui and G.M. Pharr, Substrate effects on nanoindentation mechanical property measurement of soft films on hard substrates. J. Mater. Res. 14(1) (1999), pp. 292–301.
   Web of Science ®Google Scholar
• D. Beegan and M.T. Laugier, Application of composite hardness models to copper thin film hardness measurement. Surf. Coat. Technol. 199(1) (2005), pp. 32–37.
   Web of Science ®Google Scholar
• R. Saha and W.D. Nix, Effects of the substrate on the determination of thin film mechanical properties by nanoindentation. Acta Mater. 50 (2002), pp. 23–38.
   Web of Science ®Google Scholar
• A.S. Kaygorodov and A.S. Mamaev, Substrate influence on the mechanical properties of TiC/a-C coatings. Materials Phys. And Mechanics 30 (2017), pp. 35–39.
   Google Scholar
• M. Gonzalez, K. Vanstreels and A. Urbanowicz. Modeling the substrate effects on nanoindentation mechanical property measurement. EuroSimE (2009), Book of 10 Int. Conference. doi:10.1109/ESIME.2009.4938456.
   Google Scholar
• G.M. Pharr, A. Bolshakov, T.Y. Tsui and J.C. Hay, Nanoindentation of soft films On hard substrates: experiments And finite element simulations. MRS Proceedings 505 (1997), pp. 109). doi:https://doi.org/10.1557/PROC-505-109.
   Google Scholar
• J. Chen, J. Shi, Z. Chen, M. Zhang, W. Peng and L. Fang, Mechanical properties and deformation behaviors of surface-modified silicon: a molecular dynamics study. J. Mat. Sci. 54(4) (2019), pp. 3096–3110.
   Google Scholar
• J. Chen, J. Shi, Y. Wang, J. Sun, J. Han, K. Sun and L. Fang, Nanoindentation and deformation behaviors of silicon covered with amorphous SiO2: a molecular dynamic study. RSC 8 (2018), pp. 12597–12607. doi:10.1039/c7ral.3638b.
   PubMed Web of Science ®Google Scholar
• J.T.M. De Hosson, W.A. Soer, A.M. Minor, Z. Shan, E.A. Stach, S.A.S.A.S. Asif and O.L. Warren, In situ TEM nanoindentation and dislocation-grain boundary interactions: a tribute to david brandon. J. Mater. Sci. 41 (2006), pp. 7704–7719. doi:10.1007/s10853-006-0472-2.
   Web of Science ®Google Scholar
• W.W. Gerberich, D.E. Kramer, N.I. Tymiak, A.A. Volinsky, D.F. Bahr and M.D. Kriese, Nanoindentation-induced defect-interface interactions: phenomena, methods and limitations. Acta Mater. 47(15) (1999), pp. 4115–4123. doi:10.1016/S1359-6454(99)00270-0.
   Web of Science ®Google Scholar
• D.Z. Grabko and K.M. Pyrtsak. Response of the Cu/LiF structure to the introduction of a Vickers indenter. Proc. of the 48th Intern. Conference “Actual Problems of Strength”, Tolyatti, Russia, (2009), 195-197. (in Rus.).
   Google Scholar
• D.Z. Grabko, K.M. Pyrtsak and O.A. Shikimaka, Response of the crystal-substrate of the Cu/MgO composite structure to the action of local loads. Deformation Destruction Mater. 2 (2011), pp. 40–46. (in Rus.).
   Google Scholar
• D.Z. Grabco, C.M. Pyrtsac, L.Z. Ghimpu and G.F. Volodina, Mechanical properties of the coating/substrate composite system: nanostructured copper films on a LiF substrate. Surf. Eng. Appl. Electrochem. 52(4) (2016), pp. 319–333. doi:10.3103/S1068375516040074.
   Google Scholar
• D. Grabco, Dislocation-disclination mechanism of deformation under microindentation. Mold. J. Phys. Sci 3 (2002), pp. 94–103.
   Google Scholar
• D. Grabco, O. Shikimaka and E. Harea, Translation–rotation plasticity as basic mechanism of plastic deformation in macro-, micro- and nanoindentation processes. J. Phys. D Appl. Phys 41 (2008), pp. 074016 (9pp). doi:10.1088/0022-3727/41/7/074016.
   Web of Science ®Google Scholar
• I. Zarudi, J. Zou and L.C. Zhang, Microstructures of phases in indented silicon: A high resolution characterization. Appl. Phys. Lett. 82(6) (2003), pp. 874–876.
   Web of Science ®Google Scholar
• J.-i. Jang, M.J. Lance, S. Wen, T.Y. Tsui and G.M. Pharr, Indentation-induced phase transformations in silicon: influences of load, rate and indenter angle on the transformation behavior. Acta Mater. 53 (2005), pp. 1759–1770. doi:10.1016/j.actamat.2004.12.025.
   Web of Science ®Google Scholar
• E. Harea. Deformation of planar structures of TCO / Si type under the action of concentrated load. Doctoral thesis in physical and mathematical sciences. Chisinau, 2011, 127 p. (in Rom.).
   Google Scholar
• Y.S. Boyarskaya, D.Z. Grabko and M.S. Kats. Physics of microindentation processes. Chisinau, “Shtiintsa”, 1986, 294 с. (in Rus.).
   Google Scholar
• V.I. Alshits and V.L. Indenbom, Dynamic deceleration of dislocations. In the book “Dynamics of dislocations”, Naukova Dumka, Kyiv, 1975, pp. 232–275. (in Rus.).
   Google Scholar
• W.C. Oliver and G.M. Pharr, An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Res. 7(6) (1992), pp. 1564–1583. doi:10.1557/JMR.1992.1564.
   Web of Science ®Google Scholar
• D. Beegan, S. Chowdhury and M.T. Laugier, The nanoindentation behaviour of hard and soft films on silicon substrates. Thin Solid Films 466 (2004), pp. 167–174.
   Web of Science ®Google Scholar
• Y.I. Golovin, Introduction to Nanotechnology, Mashinostroenie, Moscow, 2007. 496 p. (in Rus.).
   Google Scholar
• Y.I. Golovin, V.M. Vasyukov, V.V. Korenkov, R.A. Stolyarov, A.V. Shuklinov and L.E. Polyakov, Size effects in the hardness of fcc metals in the micro- and nanoscale region. J. Tech. Phys. 81(5) (2011), pp. с55–с58. (in Rus).
   Google Scholar
• D. Grabco, O. Shikimaka, C. Pyrtsac, Z. Barbos, M. Popa, A. Prisacaru, D. Vilotic, M. Vilotic and S. Alexandrov, Nano- and micromechanical parameters of AISI 316L steel. Surf. Eng. Appl. Electr. 56(6) (2020), pp. 719–726. doi:10.3103/S1068375520060071.
   Web of Science ®Google Scholar
• D.M. Hausmann and R.G. Gordon, Surface morphology and crystallinity control in the atomic layer deposition (ALD) of hafnium and zirconium oxide thin films. J. Crystal Growth 249 (2003), pp. 251–261.
   Web of Science ®Google Scholar
• J.A. Venables and G.D.T. Spiller, Nucleation and growth of thin films, in Surface Mobilities on Solid Materials, V.T. Binh, New York, 1983. pp. 341–404.
   Google Scholar
• J.A. Venables, G.D.T. Spiller and M. Hanbucken, Nucleation and growth of thin films. Rep. Prog. Phys. 47 (1984), pp. 399–459.
   Web of Science ®Google Scholar
• A.M. Ovrutsky, A.S. Prokhoda and M.S. Rasshchupkyna, The surface processes during Crystallization. Comput. Mater. Sci. (2014), pp. 187–243.
   Google Scholar
• Y. Champion, C. Langlois, S. Guerin-Mailly, F. Langlois, J.-L. Bonnentien and M. Hytch, Near-perfect elastoplasticity in pure nanocrystalline copper. Science 300 (2003), pp. 310–311. doi:10.1126/science.1081042.
   PubMed Web of Science ®Google Scholar
• R.Z. Valiev, Nanostructuring of metals by severe plastic deformation for advanced properties. Nature Mater. 3(8) (2004), pp. 511–516. doi:10.1038/nmat1180.
   PubMed Web of Science ®Google Scholar
• T.N. Xu, N. Hirosaki, R.J. Xie, Y. Yamamoto Y and H. Tanaka, Superplastic deformation of nano-size S3N4 ceramics with different amounts of sintering additives. Scripta Mater. 55 (2006), pp. 215–217. doi:10.1016/j.scriptamat.2006.04.020.
   Web of Science ®Google Scholar
• I.A. Ovid'ko and A.G. Sheinerman, Special strain hardening mechanism and nanocrack generation in nanocrystalline materials. Appl. Phys. Lett. 90 (2007), pp. 171927. doi:10.1063/1.2734393.
   Web of Science ®Google Scholar
• I.A. Ovid'ko and A.G. Sheinerman, Interaction of intergrain sliding, lattice slip and grain boundary diffusion in nanocrystalline ceramics and metals. Mater. Phys. Mech. 14(1) (2012), pp. 87–100.
   Google Scholar
• W.A. Soer, J.T.M. De Hosson, A.M. Minor, J.W. Morris Jr and E.A. Stach, Effects of solute Mg on grain boundary and dislocation dynamics during nanoindentation of Al–Mg thin films. Acta Mater. 52 (2004), pp. 5783–5790. doi:10.1016/j.actamat.2004.08.032.
   Web of Science ®Google Scholar
• D. Grabco, B. Pushcash, M. Dyntu and O. Shikimaka, Thermal evolution of deformation zones around microindentations in different types of crystal. Phil. Mag. A 82(10) (2002), pp. 2207–2215. doi:10.1080/01418610208235731.
   Google Scholar
• H. Saka, A. Shimatani, M. Suganuma, et al., Transmission electron microscopy of amorphization and phase transformation beneath indents in Si. Phil. Mag. A 82(10) (2002), pp. 1971–1981.
   Google Scholar
• A.B. Mann, D. Van Heerden, J.B. Pethica, et al., Contact resistance and phase transformations during nanoindentation of silicon. Phil. Mag. A 82(10) (2002), pp. 1921–1929.
   Google Scholar
• Y.B. Xu, Z.C. Li and Y.Q. Wu, Deformation structure induced by indentation in GaAs and Si single crystals. J. Metallurgical Eng. 3(1) (2014), pp. 13–28. doi:10.14355/me.2014.0301.03.
   Google Scholar