169
Views
0
CrossRef citations to date
0
Altmetric
Research Article

Sustainable energy conservation of reflow oven process on PCB manufacturing using AHP techniques

&
Article: 2372567 | Received 19 Feb 2024, Accepted 12 Jun 2024, Published online: 09 Jul 2024

References

  • Cai, C., K. Pan, J. Yang, and S. Park. 2020. “Comparative Analysis of Package Warpage Using Confocal Method and Digital Image Correlation.” Inter Society Conference on Thermal and Thermo Mechanical Phenomena in Electronic Systems 945–949. https://doi.org/10.1109/ITherm45881.2020.9190235.
  • Castell, A., C. Solé, M. Medrano, J. Roca, L. F. Cabeza, and D. Garcia. 2008. “Natural Convection Heat Transfer Coefficients in Phase Change Material (PCM) Modules with External Vertical Fins.” Applied Thermal Engineering 28 (13): 1676–1686. https://doi.org/10.1016/j.applthermaleng.2007.11.004.
  • Cengel, Y. A., and A. J. Ghajar. 2020. “Fundamentals of Convection.” 6th ed. Heat and mass transfer fundamentals and applications-Mcgraw-Hill Education, 391–393.
  • Cheng, Z.H., W. F. Xu, and K. Meng. 2016. “The Application of PIP in Lead-Free Process of OSP Surface Treatment PCB.” Electronic Qualitative 7:48–54.
  • Ding, Y., S. Q. Kong, Z. J. Jin, and Z. Rongyue. 2010. “Molecular Dynamics Simulation of Ultrasonic Wire Welding Mechanism in Electronic Packages.” China Mechanical Engineering 21:2496–2500.
  • Esfandyari, A., S. K. Aarief, T. Javied, and J. Franke. 2014. “Energy Efficiency Investigation on High-Pressure Convection Reflow Soldering in Electronics Production.”Applied Mechanics and Materials 655:95–100. https://doi.org/10.4028/www.scientific.net/AMM.655.95.
  • Gao, Y., S. Tse, and H. Mak. 2003. “An Active Coolant Cooling System for Applications in Surface Grinding.” Applied Thermal Engineering 23 (5): 523–537. https://doi.org/10.1016/S1359-4311(02)00214-4.
  • Gao, J., Y. Wu, and H. Ding. 2007. “Optimization of a Reflow Soldering Process Based on The Heating Factor.” Soldering & Surface Mount Technology 19 (1): 28–33. https://doi.org/10.1108/09540910710748131.
  • Gong, Y., Q. Li, and D. Yang. 2006. “The Optimization of Reflow Soldering Temperature Profile Based on Simulation.” Proceedings of the 2006 7th International Conference on Electronic Packaging Technology, pp. 1–4, Shanghai, China. https://doi.org/10.1109/ICEPT.2006.359831.
  • Goosey, M., and R. Kellner. 2010. “Energy Conservation and Related Best Practices in Printed Circuit Board (PCB) Manufacturing.” Circuit World 36 (1): 38–42. https://doi.org/10.1108/03056121011015086.
  • Ha, J., K. Pan, H. Wang, D. H. Won, and S. B. Park. 2020. “The Effect of Misaligned Passive Component on Fatigue Life of Solder Joints and Solder Shape.” Inter Society Conference on Thermal and Thermo Mechanical Phenomena in Electronic Systems, 1029–1034. https://doi.org/10.1109/ITherm45881.2020.9190328.
  • Illés, B. 2010. “Distribution of The Heat Transfer Coefficient in Convection Reflow Oven.” Applied Thermal Engineering 30 (13): 1523–1530. https://doi.org/10.1016/j.applthermaleng.2010.02.016.
  • Illés, B., and I. Bakó. 2014. “Numerical Study of The Gas Flow Velocity Space in Convection Reflow Oven.” International Journal of Heat and Mass Transfer 70:185–191. https://doi.org/10.1016/j.ijheatmasstransfer.2013.10.075.
  • Illés, B., and G. Harsányi. 2009a. “Heating Characteristics of Convention Reflow Ovens.” Applied Thermal Engineering 29 (11-12): 2166–2171. https://doi.org/10.1016/j.applthermaleng.2008.10.014.
  • Illés, B., and G. Harsányi. 2009b. “Investigating Direction Characteristics of The Heat Transfer Coefficient in Forced Convection Reflow Oven.” Experimental Thermal and Fluid Science 33 (4): 642–650. https://doi.org/10.1016/j.expthermflusci.2009.01.001.
  • Jeswiet, J., and S. Kara. 2008. “Carbon Emissions and CES™ in Manufacturing.” CIRP Annals 57:17–20. https://doi.org/10.1016/j.cirp.2008.03.117.
  • Lai, Y., K. Pan, Y. Cen, J. Yang, C. Cai, P. Yin, and S. Park. 2022. “An Intelligent System for Reflow Oven Temperature Settings Based on Hybrid Physics-Machine Learning Model.” Soldering & Surface Mount Technology, https://doi.org/10.1108/SSMT-10-2021-0063.
  • Liow, J. L. 2009. “Mechanical Micromachining: A Sustainable Microdevice Manufacturing Approach.” Journal of Cleaner Production 17 (7): 662–667. https://doi.org/10.1016/j.jclepro.2008.11.012.
  • Luo, Z., K. Cheng, R. Holt and Z. Liu. 2005. “ Modeling Flank Wear of Carbide Tool Insert in Metal Cutting.” Wear 259 (7–12), 1235–1240. https://doi.org/10.1016/j.wear.2005.02.044.
  • Ma, G., X. Huang, and S. Liu. 2021. “Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering.” IEEE Accesss 9:141876–141889. https://doi.org/10.1109/ACCESS.2021.3120496.
  • Pan, K., J. H. Ha, H. Y. Wang, V. Veeraraghavan, and S. B. Park. 2019. “The Effect of Solder Paste Volume on Surface Mount Assembly Self-Alignment.” Procedia Manufacturing 38:1381–1393. https://doi.org/10.1016/j.promfg.2020.01.150.
  • Pan, E. S., Y. Jin, H. Xu, and W. Z. Liao. 2010. “Forecasting and Parameters Optimization of Reflow Soldering Profile Based on BPNN and GA.” Advanced Materials Research 139-141:990–995. https://doi.org/10.4028/www.scientific.net/AMR.139-141.990.
  • Park, Y. J., and G. B. Lee. 2013. “Analysis of Energy Efficiency and Productivity in Dry Process in PCB Manufacturing.” International Journal of Precision Engineering and Manufacturing 14 (7): 1213–1221. https://doi.org/10.1007/s12541-013-0165-0.
  • Pusavec, F., P. Krajnik, and J. Kopac. 2010. “Transitioning to Sustainable Production – Part I: Application on Machining Technologies.” Journal of Cleaner Production 18 (2): 174–184. https://doi.org/10.1016/j.jclepro.2009.08.010.
  • Rajemi, M. F., P. T. Mativenga, and A. Aramcharoen. 2010. “Sustainable Machining: Selection of Optimum Turning Conditions Based on Minimum Energy Considerations.” Journal of Cleaner Production 18:1059–1065. https://doi.org/10.1016/j.jclepro.2010.01.025.
  • Saaty, T. L. 1980. The Analytic Hierarchy Process. New York: Mc Grow-Hill.
  • Saaty, T. L. 1990. “How to Make a Decision: The Analytic Hierarchy Process.” European Journal of Operational Research 48 (1): 9–26. https://doi.org/10.1016/0377-2217(90)90057-I.
  • Saaty, T. L. 2012. Model, Method. Concepts and Application of the Analytic Hierarchy Process, 2nd ed. New York: Mc Grow-Hill.
  • Tanner, K. 2018. Research Methods Experimental Research, 337–356. https://doi.org/10.1016/B978-0-08-102220-7.00014-5.
  • Tsai, T. N. 2012. “Termal Parameters Optimization of a Reflow Soldering Profile in Printed Circuit Board Assembly: A Comparative Study.” Applied Soft Computing 12 (8): 2601–2613. https://doi.org/10.1016/j.asoc.2012.03.066.
  • Veselỳ, P., E. Horynová, J. Starỳ, D. Bušek, K. Dušek, V. Zahradník, et al. 2018. “Solder Joint Quality Evaluation Based on Heating Factor.” Circuit World 44 (1): 37–44. https://doi.org/10.1108/CW-10-2017-0059.
  • Wang, Y., Z. Cui, and B. Wang. 2010. “Test and Assessment of The Heating System of Reflow Ovens.” Proceedings, 11th International Conference on Electronic Packaging Technology and High Density Packaging, 798–804. https://doi.org/10.1109/ICEPT.2010.5582693.
  • Wang, M. Q., X. R. Zhou, and B. W. Li. 2021. “Furnace Temperature Curve Regulation Model Based on Thermodynamic Principle.” Science, Technology and Innovation 1:1–3.
  • Whalley, D. C. 2004. “A Simplified Reflow Soldering Process Model.” Journal of Materials Processing Technology 150:134–144. https://doi.org/10.1016/j.jmatprotec.2004.01.029.
  • Wunderle, B., and B. Michel. 2006. “Progress in Reliability Research in the Micro and Nano Region.” Microelectronics Reliability 46 (9-11): 1685–1694. https://doi.org/10.1016/j.microrel.2006.08.005.
  • Xu, J., C. Cai, V. Pham, K. Pan, H. Wang, and S. Park. 2020. “A Comprehensive Study of Electromigration in Leadfree Solder Joint.” Proceedings – Electronic Components and Technology Conference, 284–289. https://doi.org/10.1109/ECTC32862.2020.00054.
  • Xu, Y., Y. Liu, and L. Zhang. 2021. “Effects of The Solder Phase Transformation on The Optimization of Reflow Soldering Parameters and Temperature Profiles.”.” Discrete Dynamics in Nature and Society 2021:1–19. https://doi.org/10.1155/2021/9955967.
  • Zhang, Y., Q. Xue, and Y.F. Wang. 2016. “Development History and New Trends of Microelectronic Packaging.” Mechanical and Automation Engineering 1 (2): 215–216. https://doi.org/10.1177/0954407015583599.