References
- Watanabe , I. 2001 . Proc. Asia Display/IDW , : 553
- Nishida , H. , Sakamoto , K. , Ogawa , H. and Ogawa , H. 1998 . IBM Journal of Research and Development , 42 ( 3 ) : 517
- Liu , J. , Tolvgard , A. , Malmodin , J. , Lai , Z. and IEEE Trans Comp Packag Manuf Technol. 1999 . 22 ( 2 ) : 186
- Clot , P. , Zeberli , J.-F. , Chenuz , J.-M. , Ferrando , F. and Styblo , D. 1999 . Electronics Manufacturing Technology Symposium, Twenty-Fourth IEEE/CPMT. 36
- Varley , R. J. , Hodgkin , J. H. and Simon , G. P. 2000 . J. Appl. Polym. Sci. , 77 ( 2 ) : 237
- Hsieh , Y. T. 2002 . Proceedings of the 4th international symposium 157
- Yim , M. J. , Jeon , Y. D. and Paik , K. W. 2000 . IEEE Trans. Electron. Packag. Manufact. , 23 : 171
- Parlevliet , P. P. , Bersee , H. E. N. and Beukers , A. 2007 . Composites: Part A. , 38 ( 6 ) : 1581
- Hwang , J. S. 2008 . Microelectronics Reliability , 48 ( 4 ) : 645
- Hwang , J. S. 2010 . “ Molecular Crystals and Liquid Crystals ” . accepted
- Kwon , W.-S. and Paik , K.-W. 2004 . Int. J. Adhesion Adhesives , 24 ( 2 ) : 135
- Shan , L. , Verghese , K. N. E. , Robertson , C. G. and Reifsnider , K. L. 1999 . J. Polym. Sci., Part B: Polym. Phys. , 37 ( 19 ) : 2815