References
- K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, and H. Hosono, Nature. 488, 432 (2004).
- J.S. Park, W.-J. Maeng, H.-S. Kim, and J.-S. Park, Thin Solid Films. 520 (6), 1679–1693 (2012). doi: 10.1016/j.tsf.2011.07.018
- P. Barquinha, L. Pereira, G. Gonçalves, R. Martins, and E. Fortunato, J. Electrochem. Soc. 156, H161 (2009). doi: 10.1149/1.3049819
- M. Nag, A. Chasin, M. Rockele, S. Steudel, K. Myny, A. Bhoolokam, A. Tripathi, B. van der Putten, A. Kumar, J.-L. van der Steen, J. Genoe, F. Li, J. Maas, E. van Veenendaal, G. Gelinck, and P. Heremans, J. Soc. Inf. Display. 21, 129 (2013). doi: 10.1002/jsid.155
- M. Nag, M. Rockele, S. Steudel, A. Chasin, K. Myny, A. Bhoolokam, M. Willegems, S. Smout, P. Vicca, M. Ameys, T.H. Ke, S. Schols, J. Genoe, P.J. van der Steen, G. Groeseneken, and P. Heremans, J. Soc. Inf. Display. 21, 369–375 (2013). doi: 10.1002/jsid.189
- M. Nag, S. Steudel, A. Bhoolokam, A. Chasin, M. Rockele, K. Myny, J. Maas, T. Fritz, J. Trube, G. Groeseneken, and P. Heremans, J. Soc. Inf. Display. 22, 23–28 (2014). doi: 10.1002/jsid.212
- Z. Ye, L. Lu, and M. Wong, IEEE Trans. Electron Dev. 59, 393–399 (2012). doi: 10.1109/TED.2011.2175398
- R. Chen, W. Zhou, M. Zhang, M. Wong, and H.-S. Kwok, IEEE Electr. Device Lett. 33, 1150–1152 (2012). doi: 10.1109/LED.2012.2201444
- R. Chen, W. Zhou, M. Zhang, M. Wong, and H.S. Kwok, Electr. Device Lett. 34, 60–62 (2013). doi: 10.1109/LED.2012.2223192
- A.D. Mourey, D.A. Zhao, and T.N. Jackson, IEEE Electr. Device Lett. 31, 326–328 (2010). doi: 10.1109/LED.2010.2041424
- S. Kim, J. Park, C. Kim, I. Song, S. Kim, S. Park, H. Yin, H.-I. Lee, E. Lee, and Y. Park, IEEE Electr. Device Lett. 30, 374–376 (2009). doi: 10.1109/LED.2009.2024440
- B.D. Ahn, H.S. Shin, H.J. Kim, J.S. Park, and J.K. Jeong, Appl. Phys. Lett. 93, 203 (2008).
- M. Nag, K. Obata, Y. Fukui, K. Myny, S. Schols, P. Vicca, T.H. Ke, S. Smout, M. Willegems, M. Ameys, A. Bhoolokam, R. Muller, B. Cobb, A. Kumar, J.-L. van der Steen, T. Ellis, G. Gelinck, J. Genoe, P. Heremans, and S. Steudel, SID Int. Symp. Dig. Tec. 45, 248–251 (2014). doi: 10.1002/j.2168-0159.2014.tb00068.x
- N. Morosawa, M. Nishiyama, Y. Ohshima, A. Sato, Y. Terai, K. Tokunaga, J. Iwasaki, K. Akamatsu, Y. Kanitani, S. Tanaka, T. Arai, and K. Nomoto, SID Int. Symp. Dig. Tec. 44, 85–88 (2013). doi: 10.1002/j.2168-0159.2013.tb06147.x
- N. Morosawa, Y. Ohshima, M. Morooka, T. Arai, and T. Sasaoka, SID Int. Symp. Dig. Tec. 42, 479–482 (2011). doi: 10.1889/1.3621360
- R. Muller, Patent No. WO2013167374 A1 and TW201403 828 (A).
- F.M. Li, S. Unnikrishnan, P. van de Weijer, F. van Assche, J. Shen, T. Ellis, W. Manders, H. Akkerman, P. Bouten, and T. van Mol, SID Int. Symp. Dig. Tec. 44, 199–202 (2013). doi: 10.1002/j.2168-0159.2013.tb06178.x