References
- S.C. Kim, C.H. Kim, G.H. Yang, T.H. Yang, B.K. Han, S.C. Kang, and D.S. Kwon, IEEE, 69–74 (2009).
- D. Cheng, Y. Wang, H. Hua, and J. Sasian, Opt. Lett. 36 (11), 2098–2100 (2011).
- P.E. Burrows, V. Bulovic, S.R. Forrest, L.S. Sapochak, D.M. McCarty, and M.E. Thompson, Appl. Phys. Lett. 65 (23), 2922–2924 (1994).
- S. Chung, J.H. Lee, J. Jeong, J.J. Kim, and Y. Hong, Appl. Phys. Lett. 94 (25), 168 (2009).
- C.C. Johnson, and A.W. Guy, Proc. IEEE 60 (6), 692–718 (1972).
- J.C. Lin, IEEE Microwave Mag. 17 (6), 32–36 (2016).
- C.M. Belcastro, In Proceedings of the 1999 IEEE International Conference on Control Applications 2, 1531–1537 (1999).
- K. Murakawa, N. Hirasawa, H. Ito, and Y. Ogura, In 2014 International Symposium on Electromagnetic Compatibility, 581–584 (2014).
- L. Zou, C. Lan, S. Zhang, X. Zheng, Z. Xu, C. Li, L. Yang, F. Ruan, and S.C. Tan, Nano-Micro Lett. 13, 1–16 (2021).
- L.C. Jia, C.G. Zhou, W.J. Sun, L. Xu, D.X. Yan, and Z.M. Li, Chem. Eng. J. 384, 123368 (2020).
- M. Wang, X.H. Tang, J.H. Cai, H. Wu, J.B. Shen, and S.Y. Guo, Carbon 177, 377–402 (2021).
- D. Wanasinghe, F. Aslani, G. Ma, and D. Habibi, Nanomaterials 10 (3), 541 (2020).
- A.A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweldebrhan, F. Miao, and C.N. Lau, Nano Lett. 8 (3), 902–907 (2008).
- S. Chen, Q. Wu, C. Mishra, J. Kang, H. Zhang, K. Cho, W. Cai, A.A. Balandin, and R.S. Ruoff, Nat. Mater. 11 (3), 203–207 (2012).
- S.L. Chung, and J.S. Lin, Molecules 21 (5), 670 (2016).
- H. Shen, J. Guo, H. Wang, N. Zhao, and J. Xu, ACS Appl. Mater. Interfaces 7 (10), 5701–5708 (2015).
- Y.P. Mamunya, V.V. Davydenko, P. Pissis, and E.V. Lebedev, Eur. Polym. J. 38 (9), 1887–1897 (2002).
- S.P. Yuan, and P.X. Jiang, Int. J. Thermophys 27, 581–595 (2006).
- C.P. Wong, and R.S. Bollampally, J. Appl. Polym. Sci. 74 (14), 3396–3403 (1999).
- B.L. Zhu, J. Ma, J. Wu, K.C. Yung, and C.S. Xie, J. Appl. Polym. Sci. 118 (5), 2754–2764 (2010).
- D. Qi, K. Zhang, G. Tian, B. Jiang, and Y. Huang, Adv. Mater. 33 (6), 2003155 (2021).
- Z. Yang, W. Wang, L. Bi, L. Chen, G. Wang, G. Chen, C. Ye, and J. Pan, Nanoscale 12 (31), 16562–16569 (2020).
- M.H. Al-Saleh, and U. Sundararaj, Carbon 47 (7), 1738–1746 (2009).
- H. Wang, S. Li, M. Liu, J. Li, and X. Zhou, Macromol. Mater. Eng. 306 (6), 2100032 (2021).
- M.S. Bae, C. Park, D. Shin, S.M. Lee, and I. Yun, Solid-State Electron 133, 1–5 (2017).
- H.C. Cheng, W.H. Xu, W.H. Chen, P.H. Wang, K.F. Chen, and C.C. Chang, Adv. Mater. Sci. Eng. (2015).
- S. Panda, and B. Acharya, J. Mater. Sci.: Mater. Electron. 32 (12), 16215–16229 (2021).
- J. Wei, M. Liao, A. Ma, Y. Chen, Z. Duan, X. Hou, M. Li, N. Jiang, and J. Yu, Compos. Commun. 17, 141–146 (2020).
- G. Das, and S. Biswas, IOP Conf. Ser.: Mater. Sci. Eng. 115 (1), 012012 (2016).
- M. Sayer, Compos. Part B Eng. 59, 12–20 (2014).
- J.H. Byeon, and J.W. Kim, Thin Solid Films 520 (3), 1048–1052 (2011).
- M. Wang, X. You, C. Liao, X. Ren, F. Xiu, J. Yang, and S. Dong, Mater. Chem. Front. 6 (16), 2256–2265 (2022).
- C. Liang, Z. Wang, L. Wu, X. Zhang, H. Wang, and Z. Wang, ACS Appl. Mater. Interfaces 9 (35), 29950–29957 (2017).
- P. Wilson, S. Vijayan, and K. Prabhakaran, J Ind. Eng. Chem. 80, 401–410 (2019).