A flow-rate-controlled double-nozzles approach for electrochemical additive manufacturing

References

• Abdolmaleki, H., P. Kidmose, and S. Agarwala. 2021. “Droplet-Based Techniques for Printing of Functional Inks for Flexible Physical Sensors.” Advanced Materials 2006792 33 (20): 29.
   Web of Science ®Google Scholar
• Agarwala, S., G. L. Goh, and W. Y. Yeong. 2018. Aerosol jet printed pH sensor based on carbon nanotubes for flexible electronics. Proceedings of the 3rd International Conference on Progress in Additive Manufacturing (PRO-AM), Singapore, 88-94.
   Google Scholar
• Ali, M. A., C. Hu, S. Jahan, B. Yuan, M. S. Saleh, E. Ju, S. J. Gao, and R. Panat. 2021. “Sensing of COVID-19 Antibodies in Seconds via Aerosol Jet Nanoprinted Reduced-Graphene-Oxide-Coated 3D Electrodes.” Advanced Materials 33 (7): 2006647.
   PubMed Web of Science ®Google Scholar
• Ambrosi, A., and M. Pumera. 2016. “3D-printing Technologies for Electrochemical Applications.” Chemical Society Reviews 45 (10): 2740–2755.
   PubMed Web of Science ®Google Scholar
• Ambrosi, A., R. D. Webster, and M. Pumera. 2020. “Electrochemically Driven Multi-Material 3D-Printing.” Applied Materials Today 18: 100530.
   Web of Science ®Google Scholar
• Beedasy, V., and P. J. Smith. 2020. “Printed Electronics as Prepared by Inkjet Printing.” Materials 13 (3): 704.
   PubMed Web of Science ®Google Scholar
• Behroozfar, A., S. Daryadel, S. R. Morsali, S. Moreno, M. Baniasadi, R. A. Bernal, and M. Minary-Jolandan. 2018. “Microscale 3D Printing of Nanotwinned Copper.” Advanced Materials 30 (4): 1705107.
   Web of Science ®Google Scholar
• Brady, R. M., and R. C. Ball. 1984. “Fractal Growth of Copper Electrodeposits.” Nature 309 (5965): 225–229.
   Web of Science ®Google Scholar
• Brant, A., and M. Sundaram. 2021. “Electrochemical Additive Manufacturing of Graded NiCoFeCu Structures for Electromagnetic Applications.” Manufacturing Letters (In Press).
   Google Scholar
• Chen, X., X. Liu, P. Childs, N. Brandon, and B. Wu. 2017. “A low Cost Desktop Electrochemical Metal 3D Printer.” Advanced Materials Technologies 2 (10): 1700148.
   Web of Science ®Google Scholar
• Chen, X., X. Liu, M. Ouyang, J. Chen, O. Taiwo, Y. Xia, P. R. Childs, N. P. Brandon, and B. Wu. 2019. “Multi-metal 4D Printing with a Desktop Electrochemical 3D Printer.” Scientific Reports 9 (1): 1–9.
   PubMedGoogle Scholar
• Chen, M., Z. Xu, J. H. Kim, S. K. Seol, and J. T. Kim. 2018. “Meniscus-on-demand Parallel 3D Nanoprinting.” ACS Nano 12 (5): 4172–4177.
   PubMed Web of Science ®Google Scholar
• Choong, Y. Y., H. W. Tan, D. C. Patel, W. T. Choong, C. H. Chen, H. Y. Low, M. J. Tan, C. D. Patel, and C. K. Chua. 2020. “The Global Rise of 3D Printing During the COVID-19 Pandemic.” Nature Reviews Materials 5 (9): 637–639.
   PubMed Web of Science ®Google Scholar
• Chua, C. K., W. Y. Yeong, H. Y. Low, T. Tran, and H. W. Tan. 2021. 3D Printing and Additive Manufacturing of Electronics: Principles and Applications. Singapore: World Scientific.
   Google Scholar
• Daryadel, S., A. Behroozfar, and M. Minary-Jolandan. 2019. “Toward Control of Microstructure in Microscale Additive Manufacturing of Copper Using Localized Electrodeposition.” Advanced Engineering Materials 21 (1): 1800946.
   Web of Science ®Google Scholar
• Daryadel, S., A. Behroozfar, S. R. Morsali, S. Moreno, M. Baniasadi, J. Bykova, R. A. Bernal, and M. Minary-Jolandan. 2018. “Localized Pulsed Electrodeposition Process for Three-Dimensional Printing of Nanotwinned Metallic Nanostructures.” Nano Letters 18 (1): 208–214.
   PubMed Web of Science ®Google Scholar
• Dewangan, S. K., S. K. Senapati, and V. Deshmukh. 2020. “CFD Prediction of oil-Water two-Phase Stratified Flow in a Horizontal Channel: Coupled Level set-VOF Approach.” Sigma: Journal of Engineering & Natural Sciences/Mühendislik ve Fen Bilimleri Dergisi 38 (1): 1–19.
   Web of Science ®Google Scholar
• Ding, H., Y. Jiang, H. Wu, and J. Wang. 2015. “Two Phase Flow Simulation of Water Ring Vacuum Pump Using VOF Model.” American Society of Mechanical Engineers. InFluids Engineering Division Summer Meeting 57212: V001T33A019.
   Google Scholar
• Falola, B. D., and I. I. Suni. 2015. “Low Temperature Electrochemical Deposition of Highly Active Elements.” Current Opinion in Solid State and Materials Science 19 (2): 77–84.
   Web of Science ®Google Scholar
• Goh, G. L., S. Agarwala, and W. Y. Yeong. 2019. “Directed and on-Demand Alignment of Carbon Nanotube: a Review Toward 3D Printing of Electronics.” Advanced Materials Interfaces 6 (4): 1801318.
   Web of Science ®Google Scholar
• Goh, G. L., H. Zhang, T. H. Chong, and W. Y. Yeong. 2021. “3D Printing of Multilayered and Multimaterial Electronics: A Review.” Advanced Electronic Materials 7: 2100445.
   Web of Science ®Google Scholar
• Gu, C., and T. Y. Zhang. 2008. “Electrochemical Synthesis of Silver Polyhedrons and Dendritic Films with Superhydrophobic Surfaces.” Langmuir 24 (20): 12010–12016.
   PubMed Web of Science ®Google Scholar
• Han, J., E. Khoo, P. Bai, and M. Z. Bazant. 2014. “Over-limiting Current and Control of Dendritic Growth by Surface Conduction in Nanopores.” Scientific Reports 4 (1): 1–8.
   Google Scholar
• Hirt, L., S. Ihle, Z. Pan, L. Dorwling-Carter, A. Reiser, J. M. Wheeler, R. Spolenak, J. Vörös, and T. Zambelli. 2016. “Template-Free 3D Microprinting of Metals Using a Force-Controlled Nanopipette for Layer-by-Layer Electrodeposition.” Advanced Materials 28 (12): 2311–2315.
   PubMed Web of Science ®Google Scholar
• Hirt, L., A. Reiser, R. Spolenak, and T. Zambelli. 2017. “Additive Manufacturing of Metal Structures at the Micrometer Scale.” Advanced Materials 29 (17): 1604211.
   Web of Science ®Google Scholar
• Hu, J., and M. F. Yu. 2010. “Meniscus-confined Three-Dimensional Electrodeposition for Direct Writing of Wire Bonds.” Science 329 (5989): 313–316.
   PubMed Web of Science ®Google Scholar
• Je, J. H., J. M. Kim, and J. Jaworski. 2017. “Progression in the Fountain pen Approach: From 2D Writing to 3D Free-Form Micro/Nanofabrication.” Small 13 (2): 1600137.
   Web of Science ®Google Scholar
• Kee, S., P. Zhang, and J. Travas-Sejdic. 2020. “Direct Writing of 3D Conjugated Polymer Micro/Nanostructures for Organic Electronics and Bioelectronics.” Polymer Chemistry 11 (28): 4530–4541.
   Web of Science ®Google Scholar
• Kim, K. H., C. Ke, N. Moldovan, and H. D. Espinosa. 2003. “Massively Parallel Multi-Tip Nanoscale Writer With Fluidic Capabilities-Fountain Pen Nanolithography (FPN).” InProc. 4th Int. Symp. on MEMS and Nanotechnology (Vol. 235).
   Google Scholar
• Kim, H., J. G. Kim, J. W. Park, and C. N. Chu. 2018. “Selective Copper Metallization of Nonconductive Materials Using jet-Circulating Electrodeposition.” Precision Engineering 51: 153–159.
   Web of Science ®Google Scholar
• Kim, K. H., N. Moldovan, and H. D. Espinosa. 2005. “A Nanofountain Probe with sub-100 nm Molecular Writing Resolution.” Small 1 (6): 632–635.
   PubMed Web of Science ®Google Scholar
• Kim, J. T., S. K. Seol, J. Pyo, J. S. Lee, J. H. Je, and G. Margaritondo. 2011. “Three-Dimensional Writing of Conducting Polymer Nanowire Arrays by Meniscus-Guided Polymerization.” Advanced Materials 23 (17): 1968–1970.
   PubMed Web of Science ®Google Scholar
• Koo, J. W., J. S. Ho, J. An, Y. Zhang, C. K. Chua, and T. H. Chong. 2020. “A Review on Spacers and Membranes: Conventional or Hybrid Additive Manufacturing?” Water Research 188 (23): 0043–1354.
   Google Scholar
• Laslau, C., D. E. Williams, B. Kannan, and J. Travas-Sejdic. 2011. “Scanned Pipette Techniques for the Highly Localized Electrochemical Fabrication and Characterization of Conducting Polymer Thin Films, Microspots, Microribbons, and Nanowires.” Advanced Functional Materials 21 (24): 4607–4616.
   Web of Science ®Google Scholar
• Lee, Y. K., S. H. Lee, Y. J. Kim, and H. Kim. 2006. “Flow Control of Nano Fountain Pen Using Active Membrane Pumping.” In 2006 IEEE Conference on Robotics, Automation and Mechatronics Jun 1 (pp. 1-6). IEEE.
   Google Scholar
• Lee, A. Y., A. Zhou, J. An, C. K. Chua, and Y. Zhang. 2020. “Contactless Reversible 4D-Printing for 3D-to-3D Shape Morphing.” Virtual and Physical Prototyping 15 (4): 481–495.
   Web of Science ®Google Scholar
• Lei, Y., X. Zhang, D. Xu, M. Yu, Z. Yi, Z. Li, A. Sun, G. Xu, P. Cui, and J. Guo. 2018. “Dynamic “Scanning-Mode” Meniscus Confined Electrodepositing and Micropatterning of Individually Addressable Ultraconductive Copper Line Arrays.” The Journal of Physical Chemistry Letters 9 (9): 2380–2387.
   PubMed Web of Science ®Google Scholar
• Li, Y., K. Zhou, P. Tan, S. B. Tor, C. K. Chua, and K. F. Leong. 2018. “Modeling Temperature and Residual Stress Fields in Selective Laser Melting.” International Journal of Mechanical Sciences 136: 24–35.
   Web of Science ®Google Scholar
• Liu, P., Y. Guo, Y. Wu, J. Chen, and Y. Yang. 2020. “A low-Cost Electrochemical Metal 3d Printer Based on a Microfluidic System for Printing Mesoscale Objects.” Crystals 10 (4): 257.
   Web of Science ®Google Scholar
• Meister, A., S. Jeney, M. Liley, T. Akiyama, U. Staufer, N. F. De Rooij, and H. Heinzelmann. 2003. “Nanoscale Dispensing of Liquids Through Cantilevered Probes.” Microelectronic Engineering 67: 644–650.
   Web of Science ®Google Scholar
• Mohanty, U. S., B. C. Tripathy, S. C. Das, P. Singh, and V. N. Misra. 2009. “Effect of Sodium Lauryl Sulphate (SLS) on Nickel Electrowinning from Acidic Sulphate Solutions.” Hydrometallurgy 100 (1-2): 60–64.
   Web of Science ®Google Scholar
• Ng, W. L., A. Chan, Y. S. Ong, and C. K. Chua. 2020. “Deep Learning for Fabrication and Maturation of 3D Bioprinted Tissues and Organs.” Virtual and Physical Prototyping 15 (3): 340–358.
   Web of Science ®Google Scholar
• Oh, S., E. A. Kwak, S. Jeon, S. Ahn, J. M. Kim, and J. Jaworski. 2014. “Responsive 3D Microstructures from Virus Building Blocks.” Advanced Materials 26 (30): 5217–5222.
   PubMed Web of Science ®Google Scholar
• Panda, A. 2003. “Electrodeposition of Nickel-Copper Alloys and Nickel-Copper-Alumina Nanocomposites into Deep Recesses for MEMS.” Ph. D. Thesis, Louisiana State University and Agricultural and Mechanical College, Baton Rouge, Louisiana, USA.
   Google Scholar
• Pandiella, S. S., L. A. Garcia, M. Diaz, and C. Webb. 1999. “Simulation of a two Phase Flow by CFD: Analysis of the Computational Method.” Chemical Engineering Communications 173 (1): 197–214.
   Web of Science ®Google Scholar
• Pant, A., A. Y. Lee, R. Karyappa, C. P. Lee, J. An, M. Hashimoto, U. X. Tan, G. Wong, C. K. Chua, and Y. Zhang. 2021. “3D Food Printing of Fresh Vegetables Using Food Hydrocolloids for Dysphagic Patients.” Food Hydrocolloids 114: 106546.
   Web of Science ®Google Scholar
• Popov, K. I., and N. D. Nikolić. 2012. “General Theory of Disperse Metal Electrodeposits Formation.” In Electrochemical Production of Metal Powders. Boston, MA: Springer.
   Google Scholar
• Reiser, A., L. Koch, K. A. Dunn, T. Matsuura, F. Iwata, O. Fogel, Z. Kotler, et al. 2020. “Metals by Micro-Scale Additive Manufacturing: Comparison of Microstructure and Mechanical Properties.” Advanced Functional Materials 30 (28): 1910491.
   PubMed Web of Science ®Google Scholar
• Reiser, A., M. Lindén, P. Rohner, A. Marchand, H. Galinski, A. S. Sologubenko, J. M. Wheeler, R. Zenobi, D. Poulikakos, and R. Spolenak. 2019. “Multi-metal Electrohydrodynamic Redox 3D Printing at the Submicron Scale.” Nature Communications 10 (1): 1–8.
   PubMedGoogle Scholar
• Sekar, R. 2017. “Synergistic Effect of Additives on Electrodeposition of Copper from Cyanide-Free Electrolytes and its Structural and Morphological Characteristics.” Transactions of Nonferrous Metals Society of China 27 (7): 1665–1676.
   Web of Science ®Google Scholar
• Seol, S. K., D. Kim, S. Lee, J. H. Kim, W. S. Chang, and J. T. Kim. 2015. “Electrodeposition-Based 3D Printing of Metallic Microarchitectures with Controlled Internal Structures.” Small 11 (32): 3896–3902.
   PubMed Web of Science ®Google Scholar
• Suryavanshi, A. P., J. Hu, and M. F. Yu. 2008. “Meniscus-Controlled Continuous Fabrication of Arrays and Rolls of Extremely Long Micro-and Nano-Fibers.” Advanced Materials 20 (4): 793–796.
   Web of Science ®Google Scholar
• Suryavanshi, A. P., and M. F. Yu. 2007. “Electrochemical Fountain pen Nanofabrication of Vertically Grown Platinum Nanowires.” Nanotechnology 18 (10): 105305.
   Web of Science ®Google Scholar
• Tan, H. W., J. An, C. K. Chua, and T. Tran. 2019. “Metallic Nanoparticle Inks for 3D Printing of Electronics.” Advanced Electronic Materials 5 (5): 1800831.
   Web of Science ®Google Scholar
• Tan, H. W., N. Saengchairat, G. L. Goh, J. An, C. K. Chua, and T. Tran. 2020. “Induction Sintering of Silver Nanoparticle Inks on Polyimide Substrates.” Advanced Materials Technologies 5 (1): 1900897.
   Web of Science ®Google Scholar
• Tan, H. W., T. Tran, and C. K. Chua. 2016. “A Review of Printed Passive Electronic Components Through Fully Additive Manufacturing Methods.” Virtual and Physical Prototyping 11 (4): 271–288.
   Web of Science ®Google Scholar
• Tang, K., H. Ma, Y. Tian, Z. Liu, H. Jin, S. Hou, K. Zhou, and X. Tian. 2020. “3D Printed Hybrid-Dimensional Electrodes for Flexible Micro-Supercapacitors with Superior Electrochemical Behaviours.” Virtual and Physical Prototyping 15 (sup1): 511–519.
   Google Scholar
• Umrani, A. 2015. Fabrication of Micro Pillar Arrays via Aerosol Jet Printing. Rochester Institute of Technology.
   Google Scholar
• Yeung, J., and L. C. Keong. 2014. “Hardness Measurement of Copper Bonding Wire.” Procedia Engineering 75: 134–139.
   Google Scholar
• Zhang, X., Y. Zhang, Y. Li, Y. Lei, Z. Li, A. Sun, G. Xu, M. F. Yu, and J. Guo. 2019. “Bipolar Electrochemistry Regulation for Dynamic Meniscus Confined Electrodeposition of Copper Micro-Structures by a Double-Anode System.” Journal of The Electrochemical Society 166 (13): D676.
   Web of Science ®Google Scholar