REFERENCES
- Deepak and Gaur , A. 2001 . Role of Temperature Gradients in Blanket Tungsten for Microelectronic Contacts . Semicond. Sci. Technol. , 16 : 665 – 675 .
- Yang , D. , Kristof , J.J. , Jonnalagadda , R. , Rogers , B.R. , Hillman , J.T. , Foster , R.F. and Cale , T.S. 2000 . Programmed Rate Chemical Vapour Deposition Protocols . J. Electrochem. Soc. , 147 ( 2 ) : 723 – 730 .
- Kim , B. , Akiyama , Y. , Imaishi , N. and Park , H.-C. 1999 . Modeling of Tungsten Thermal Chemical Vapor Deposition . Jpn. J. Appl. Phys. Part 1 , 38 ( 5A ) : 2881 – 2887 .
- Hasper , A. , Holleman , J. , Middelhoek , J. , Kleijn , C.R. and Hoogendoorn , C.J. 1991 . Modeling and Optimization of the Step Coverage of Tungsten LPCVD in Trenches and Contact Holes . J. Electrochem. Soc. , 138 ( 6 ) : 1728 – 1738 .
- Chatterjee , S. and McConia , C.M. 1990 . Prediction of Step Coverage During Blanket CVD Tungsten Deposition in Cylindrical Pores . J. Electrochem. Soc. , 137 ( 1 ) : 328 – 335 .
- Gaur , A. IIT, Kanpur