References
- Tummala , R. R. , Rymaszewski , E. J. and Klopfenstein , A. G. , eds. 1997 . Microelectronics Packaging Handbook , New York , NY : Chapman & Hall .
- Nakano , F. , Soga , T. and Amagi , S. 1987 . Proceedings of the International Society of Hybrid Microelectronics Conference 536
- Suryanarayana , D. , Hsiao , R. , Gall , T. P. and McCreary , J. M. 1990 . Proc. IEEE 40th Electronic Components and Technology Conference 338
- Han , S. and Wang , K. K. 1997 . IEEE Trans. Components, Packaging,Manufact. Technol.,Part B , 20 ( 4 ) : 424
- Wong , C. P. and Shi , S. H. US Patent No. 6,180,696 . 2001 .
- Shi , S. H. , Yamashita , T. and Wong , C. P. 1999 . IEEE Trans. Components, Packaging, Manufact. Technol., Part C , 22 ( 4 ) : 274
- Qi , J. , Kulkarni , P. , Yala , N. , Danvir , J. , Chason , M. , Johnson , R. W. , Zhao , R. , Crane , L. , Konarski , M. , Yaeger , E. , Torres , A. , Tishkoff , R. and Krug , P. 2002 . Proceedingsof the APEX S18-3-1 – S18-3-7 .
- Tong , Q. , Ma , B. , Zhang , E. , Savoca , A. , Nguyen , L. , Quentin , C. , Lou , S. , Li , H. , Fan , L. and Wong , C. P. 2000 . Proc. IEEE 50th Electronic Components and Technology Conference 101 – 106 .
- Charles , S. , Kropp , M. , Kinney , R. , Hackett , S. , Zenner , R. , Li , F. B. , Mader , R. , Hogerton , P. , Chaudhuri , A. , Stepniak , F. and Walsh , M. 2001 . Proc. IMAPS International Symposium on Microelectronics 178 – 183 .
- Zhang , Z. and Wong , C. P. 2002 . Proc. IEEE 52nd Electronic Components and Technology Conference 432 – 438 .
- Flory , P. J. 1953 . Principles of Polymer Chemistry , Ithaca , NY : Cornell University Press . Chapter IX
- Zhang , Z. , Beatty , E. and Wong , C. P. 2003 . Macromol. Mater. Eng. , 288 : 365 – 371 .