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Journal of Adhesion Science and Technology Volume 22, 2008 - Issue 14: Electrically Conductive Adhesives Part II
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Articles

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I: Durability of Anisotropically Conductive Adhesive Interconnects

J. Haase CALCE, Mechanical Engineering Dept., University of Maryland, College Park, MD 20742, USA
,
D. Farley CALCE, Mechanical Engineering Dept., University of Maryland, College Park, MD 20742, USA
,
P. Iyer CALCE, Mechanical Engineering Dept., University of Maryland, College Park, MD 20742, USA
,
P. Baumgartner CALCE, Mechanical Engineering Dept., University of Maryland, College Park, MD 20742, USA
,
A. Dasgupta CALCE, Mechanical Engineering Dept., University of Maryland, College Park, MD 20742, USA;, Email: [email protected]
&
J. F. J. Caers Philips Applied Technologies, Electronic Packaging & Thin Film, High Tech Campus 7, WDX-3A 0.262, 5656 AE Eindhoven, The Netherlands
Pages 1733-1756 | Published online: 02 Apr 2012

References

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