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Journal of Adhesion Science and Technology Volume 8, 1994 - Issue 12
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Articles

Effects of the imidization temperature of poly(imide-siloxane) on the adhesion strength of epoxy resin/poly(imide-siloxane) joints

H.K. Yun Department of Chemical Engineering, Pohang University of Science and Technology and Organic Materials Division, Research Institute of Industrial Science and Technology, Pohang, 790-784, Korea
,
K. Cho Department of Chemical Engineering, Pohang University of Science and Technology and Organic Materials Division, Research Institute of Industrial Science and Technology, Pohang, 790-784, Korea
,
J.H. An Department of Chemical Engineering, Pohang University of Science and Technology and Organic Materials Division, Research Institute of Industrial Science and Technology, Pohang, 790-784, Korea
,
C.E. Park Department of Chemical Engineering, Pohang University of Science and Technology and Organic Materials Division, Research Institute of Industrial Science and Technology, Pohang, 790-784, Korea
,
S.M. Sim Packaging Development Team, Memory Division, Semiconductor Business, Samsung Electronics, PO Box 107, Suwon, 440-600, Korea
&
J.M. Park Packaging Development Team, Memory Division, Semiconductor Business, Samsung Electronics, PO Box 107, Suwon, 440-600, Korea
Pages 1395-1411 | Published online: 02 Apr 2012

References

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