References
- Fan , J. , Ren , Y. Chen , J. 1999 . RF isolation using power islands in DC power bus design . Proc. IEEE Int. Symp. Electromagnetic Compatibility , 2 : 838 – 843 .
- Miller , J. R. 2001 . “ The impact of split power planes on package performance ” . In Proc. IEEE Electronic Components Technology Conf 1117 – 1121 .
- Liaw , H.-J. and Merkelo , H. 1996 . “ Signal integrity issues at split ground and power planes ” . In Proc. IEEE Electronic Components Technology Conf 752 – 755 .
- Shim , H.-Y. , Kim , J. and Yook , J.-G. 2003 . Modeling of ESD and EMI problems in split multi-layer power distribution network . Proc. IEEE Int. Symp. Electromagnetic Compatibility , 1 Aug. : 48 – 51 .
- Cui , W. , Fan , J. , Ren , Y. , Shi , H. , Drewniak , J. L. and DuBroff , R. E. 2003 . DC power-bus noise isolation with powerplane segmentation . IEEE Trans. Electromagnetic Compatibility , 45 ( No. 2 ) May : 436 – 443 .
- Ko , Y. , Ito , K. , Kudo , J. and Sudo , T. 1999 . “ Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane ” . In Proc. IEEE Int. Symp. Electromagnetic Compatibility 576 – 579 .
- Kim , J. , Lee , H. S. and Kim , J. 2005 . Effects on signal integrity and radiated emission by splitreference plane on high-speed multi layer PCB . IEEE Trans. Advanced Packaging , 28 Nov. : 724 – 735 .
- Kim , J. , Kim , H. , Jeong , Y. and Kim , J. 2002 . “ Tapered slot shape on slotted reference plane of multi-layer PCB for reduction of crosstalk and radiated emission ” . In Proc. Electrical Performance of Electronic Packaging 275 – 278 .
- Moran , T. E. , Virga , K. L. , Aguirre , G. and Prince , J. L. 2002 . Method to reduce radiation from split ground plane in RF and mixed signal packaging structures . IEEE Trans. Advanced Packaging , 25 ( No. 3 ) Aug. : 409 – 416 .
- Xiao , F. , Nakada , Y. , Murano , K. and Kami , Y. 2006 . Crosstalk analysis model for traces crossing split ground plane and its reduction by stitching capacitor . Electronics and Communications in Japan , 90 ( No. 8 ) Nov. : 26 – 34 . Part 2
- Sabri , M. M. , Rashed-Mohassel , J. and Masoumi , N. 2008 . Application of FDTD-based macromodeling for signal integrity analysis in practical Pcbs . Progress In Electromagnetics Research Letters , 5 : 45 – 55 .
- Chang , C.-S. , Houng , M.-P. , Lin , D.-B. , Hung , K.-C. and Hong , R.-F. 2008 . Analysis and suppression on simultaneous switching noise coupling between multi-cavities for multilayer PCBs . Progress In Electromagnetics Research Letters , 5 : 167 – 174 .
- Cheldavi , A. and Arshadi , A. 2006 . A simple model for the orthogonal coupled strip lines in multilayer PCB: (Quasi-TEM approach) . Progress In Electromagnetics Research , PIER 59 : 39 – 50 .
- Hashemi-Nasab , M. and Cheldavi , A. 2006 . Coupling model for the two orthogonal microstrip lines in two layer PCB board (quasi-TEM approach) . Progress In Electromagnetics Research , PIER 60 : 153 – 163 .