References
- Heinen , K. , Schroen , W. , Edwards , D. , Wilson , A. , Stierman , R. and Lamson , M. 1989 . Multichip assembly with flipped integrated circuits . IEEE Trans. on Components, Hybrids, and Manufacturing Technology , 12 ( No. 4 ) : 650 – 657 .
- Becker , W. D. and Mittra , R. 1994 . FDTD modeling of noise in computer packages . IEEE Trans. on Components, Packaging, and Manufacturing Technology , 17 ( No. 3 ) Aug : 240 – 247 . Part B
- Yook , J. G. , Dib , N. and Katehi , L. P. B. 1994 . Characterization of high frequency interconnects using finite difference time domain and finite element methods . IEEE Trans. on Microwave Theory and Tech. , 42 ( No. 9 ) Sep : 1727 – 1736 .
- Ghouz , H. and El-Sharawy , E. 1996 . Finite-difference time-domain analysis of flip-chip interconnects with staggered bumps . IEEE Trans. on Microwave Theory and Tech. , 44 ( No. 6 ) June : 960 – 963 .
- Ghouz , H. and El-Sharawy , E. 1996 . An accurate equivalent circuit model of flip-chip and via interconnects . IEEE Trans. on Microwave Theory and Tech. , 44 ( No. 12 ) Dec : 2543 – 2554 .
- El-Sharawy , E. private communications
- Zhang , X. and Mei , K. 1988 . Time-domain finite-difference approach to the calculation of frequency-dependent characteristics of microstrip discontinuities . IEEE Trans. on Microwave Theory and Tech. , 36 ( No. 12 ) Dec : 1775 – 1787 .
- Elsherbeni A. Z. , Rodriguez-Pereyra V. , and Smith C. E. , “ Enhanced design of the coplanar waveguide flip chip geometry using the FDTD technique ,” submitted to the 4th IEEE International Conference on Electronics, Circuits, and Systems ( ICECS '97 ), Cairo , Egypt.
- Taflove , A. 1995 . Computational Electrodynamics: The Finite-Difference Time-Domain Method , Boston , Massachusetts : Artech House, Inc. .
- Ramahi , O. M. , Elsherbeni , A. Z. and Smith , C. E. March 1996 . “ Dynamic analysis of V transmission lines ” . In The 12th Annual Review of Progress in Applied Computational Electromagnetics , March , 1260 – 1266 . Monterey , CA : ACES '96 .