References
- Schlesinger M and Paunovic M (eds.): ‘Modern electroplating’, 5th edn, 513–526; 2010, Hoboken, NJ, Wiley.
- Cotell CM, Sprague JA and Smidt FA: ‘Surface engineering, Vol. 5, ASM handbook’, 185–187; 1994, Materials Park, OH, ASM International.
- Chandrasekhar MS and Pushpavanam M: ‘Pulse and pulse reverse plating – conceptual, advantages and applications’, Electrochim. Acta, 2008, 53, 3313–3322.
- Larson C and Farr JPG: ‘Current research and potential applications for pulsed current electrodeposition – a review’, Trans. IMF, 2012, 90, 20–29.
- Lorimer P and Mason TJ: ‘The applications of ultrasound in electroplating’, Electrochemistry, 1999, 67, 924–930.
- Cobley AJ, Mason TJ and Saez V: ‘Review of effect of ultrasound on electroless plating processes’, Trans. IMF, 2011, 89, 303–309.
- Malaviya P and Singh A: ‘Physicochemical technologies for remediation of chromium-containing waters and wastewaters’, Crit. Rev. Env. Sci. Technol., 2011, 41, 1111–1172.
- Babu BR, Bhanu SU and Meera KS: ‘Waste minimization in electroplating industries: a review’, J. Environ. Sci. Health. C, 2009, 27, 155–177.
- Dukovic JO: ‘Computation of current distribution in electrodeposition, a review’, IBM J. Res. Dev., 1990, 34, 693–705.
- Bortels L, Deconinck J and Van Den Bossche B: ‘The multi-dimensional upwinding method as a new simulation tool for the analysis of multi-ion electrolytes controlled by diffusion, convection and migration.1. Steady state analysis of a parallel plane flow channel’, J. Electroanal. Chem., 1996, 404, 15–26.
- Van Den Bossche B, Bortels L, Deconinck J, Vandeputte S and Hubin A: ‘Numerical steady state analysis of current density distributions in axisymmetrical systems for multi-ion electrolytes: application to the rotating disc electrode’, J. Electroanal. Chem., 1996, 411, 129–143.
- Dan C, Van den Bossche B, Bortels L, Nelissen G and Deconinck J: ‘Numerical simulation of transient current responses in diluted electrochemical ionic systems’, J. Electroanal. Chem., 2001, 505, 12–23.
- Nelissen G, Van Theemsche A, Dan C, Van den Bossche B and Deconinck J: ‘Multi-ion transport and reaction simulations in turbulent parallel plate flow’, J. Electroanal. Chem., 2004, 563, 213–220.
- Purcar M, Van den Bossche B, Bortels L, Deconinck J and Nelissen G: ‘Three-dimensional current density distribution simulations for a resistive patterned wafer’, J. Electrochem. Soc., 2004, 151, D78–D86.
- Bortels L, Purcar M, Van den Bossche B and Deconinck J: ‘A user-friendly simulation software tool for 3D ECM’, J. Mater. Process. Technol., 2004, 149, 486–492.
- Nelissen G, Van den Bossche B, Purcar M, Deconinck J and Bortels L: ‘Computer aided design (CAD) based optimisation of chromium plating processes for complex parts’, Trans. IMF, 2004, 82, 133–136.
- Pantleon K, Van den Bossche B, Purcar M, Bariani P and Floridor G: ‘Simulation and experimental determination of the macro-scale layer thickness distribution of electrodeposited Cu-line patterns on a wafer substrate’, J. Appl. Electrochem., 2005, 35, 589–598.
- Purcar M, Dorochenko A, Bortels L, Deconinck J and Van den Bossche B: ‘Advanced CAD integrated approach for 3D electrochemical machining simulations’, J. Mater. Process. Technol., 2008, 203, 58–71.
- Dudek DA and Fedkiw PS: ‘Electrodeposition of copper from cuprous cyanide electrolyte I. Current distribution on a stationary disk’, J. Electroanal. Chem., 1999, 474, 16–30.
- Druesne F, Paumelle P and Villon P: ‘Application of the BEM to chromium electroplating simulation and to identification of experimental polarisation laws’, Eng. Anal. Bound. Elem., 2000, 24, 615–622.
- Druesne F, Afzali M and Mouton R: ‘A new 3D electroplating simulation & design tool’, Plat. Surf. Finish., 2002, 89, 20–24.
- Mandin P, Cense JM, Fabian C, Gbado C and Lincot D: ‘Electrodeposition process modeling using continuous and discrete scales’, Comput. Chem. Eng., 2007, 31, 980–992.
- Tong LZ: ‘Simulation study of tertiary current distributions on rotating electrodes’, Trans. IMF, 2012, 90, 120–124.
- Nelissen G, Weyns G, Maciel P, Deconinck J, Vande Vyver O and Deconinck H: ‘Numerical study of the influence of the anode position and the electrolyte flow on the deposition of copper on a wire’, Electrochim. Acta, 2007, 52, 6584–6591.
- Tong LZ, Ohara K, Asa F and Sugiura Y: ‘CFD analysis of eductor agitation in electroplating tank’, Trans. IMF, 2010, 88, 185–190.
- Purcar M, Topa V, Munteanu C, Avram A, Grindei L and Chereches R: ‘Optimization of the current density distribution in electrochemical cells based on the level set method and genetic algorithm’, Eur. Phys. J. Appl. Phys., 2011, 56, 11302.
- ECHA (European Chemicals Agency): ‘ECHA/PR/11/27’, ECHA Press release, Helsinki, 2011.
- Schlesinger M and Paunovic (eds.) M: ‘Modern electroplating’, 5th edn, 205–241; 2010, Hoboken, NJ, Wiley.
- Lide D R (ed.): ‘CRC handbook of chemistry and physics’, 86th edn, 5–76; 2005, Boca Raton, FL, CRC Press.
- Song YB and Chin DT: ‘Current efficiency and polarization behavior of trivalent chromium electrodeposition process’, Electrochim. Acta, 2002, 48, 349–356.
- Lide D R (ed.): ‘CRC handbook of chemistry and physics’, 86th edn, 8-52–8-77; 2005, Boca Raton, FL, CRC Press.