35
Views
4
CrossRef citations to date
0
Altmetric
Articles

Thermal expansion coefficient and wear performance of aluminium/SiC composites with bimodal particle distributions

Pages 491-496 | Published online: 19 Jul 2013

References

  • K. NIWA, E. HORIKOSHI and Y. IMANAKA: in ‘Ceramics transactions 97, multilayer electronic ceramic cevices’, (ed. J. H. Jean et al), 171; 1999, Ohio, American Ceramic Society.
  • G. S. RAO, T. A. GEGG, C. A. PRICE, C. L. RAO and S. J. REPKA: IBM J. Res. Dev., 1997, 41, 397.
  • Y. IMANKA and M. R. NOTIS: MRS Bull., 2001, 26, 471.
  • M. OSADA, Y. AMANO, N. OSAGA and A. OHTSUKA: US. Patent No. 5,086,333,4 February 1992.
  • H. L. DAVISON, N. J. COLELA, J. A. KERNS and D. MAKOWIECKI: in Proc. Conf. ‘Electronic components and technology’, New York, 1995, Institute of Electrical and Electronics Engineers, 538.
  • G. LEFRANC, H. P. DEGISCHER, K. H. SOMMER and G. MITIC: in 12th Int. Conf. on ‘Composite materials’, ICCM -12, (ed. T. Massard et al), Paris, France, July 1999, SF2M, electronic support.
  • D. R. FREAR: J. Met., 1999, 51, 22.
  • S. ELOMARI, M. D. SKIBO, A. SUNDARRAJAN and H. RICHARDS: Campos. Sci. Technol, 1998, 58, 369.
  • J. L. SEPULVEDA and D. E. JECH: in ‘Tungsten refractory metals and alloys 4’, (ed. A. Bose et al), 393; 1998, Princeton, NJ, Metal Powder Industries Federation.
  • D. E. JECH and J. L. SEPULVEDA: in 1997 IMAPS Int. Symp. on Microelectronics, International Microelectronic and Packaging Society, Philadelphia, PA, 1997, 90.
  • S. Q. WU, Z. S. WEI and. C. TJONG: Campos. Sci. Technol, 2000, 60, 2873.
  • K. TANIHATA and K. SUGANUMA: Key Eng. Mater, 1999, 161-163, 259.
  • M. HOFFMAN, S. SKIRL, W. POMPE and J. RODEL: Acta Mater., 1999, 47, 565.
  • D. BIDEAU, J. P. TROADEC, J. LEMAITRE and L. OGER: in ‘Physics of finely divided matter’, (ed. N. Boccara et al.), 76; 1985, Berlin, Springer.
  • J. H. LEE, W. J. LACKEY ancb. F. BENZEL: J. Mater. Res, 1996,11,2804.
  • N. STANDISH and A. B. YU: Powder Technol., 1987, 53, 69.
  • C. GARCIA-CORDOVILLA, E. LOUIS and J. NARCISO: Acta Mater., 1999, 47, 4461.
  • R. ASTHANA, P. K. ROHATGI and S. N. TEWARI: Process. Adv. Mater., 1992, 2, 1.
  • A. MORTENSEN and I. JIN: Int. Mater. Rev., 1992, 37, 101.
  • A. ALONSO, A. PAMIES, J. NARCISO, C. GARCIA-CORDOVILLA and E. LOUIS: Metall. Trans. A, 1993, 24A, 1423.
  • J. NARCISO, A. ALONSO, A. PAMIES, C. GARCIA-CORDOVILLA and E. LOUIS: Metall. Trans A, 1995, 26A, 983.
  • J. M. MOLINA, R. A. SARAVANAN, R. ARPON, C. GARCIA-CORDOVILLA, E. LOUIS and J. NARCISO: Acta Mater., 2002, 50, 247. and Proc. HTC2000, Kurashiki, Japan 2000
  • H. J. FRASER: J. Geol., 1935, 43, 910.
  • R. K. MCGEARY: J. Am. Ceram. Soc., 1961,44, 513.
  • R. A. SCHAPERY: J. Comp. Mater, 1968, 2, 380.
  • A. B. YU and N. STANDISH: Powder Technol., 1988, 55, 171.
  • C. GARCIA-CORDOVILLA, J. NARCISO and E. LOUIS: Wear, 1996, 192, 170.
  • M. A. MARTINEZ, A. MARTIN and J. LLORCA: Scr. Metall. Mater., 1993, 28, 207.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.