39
Views
11
CrossRef citations to date
0
Altmetric
Short communication

Effect of preparation conditions on relative elongation of nickel foam

Pages 669-672 | Published online: 19 Jul 2013

References

  • J. R. BRANNAN, S. B. ANDREW and J. ANTHONY: Pat. 5098544, US Patent Office, Washington, DC, 1992.
  • H. TAKAJO, K. KUSHIHASHI and T. KAZUTA: JP 248492A, Japanese Patent Office, Tokyo, 1994.
  • Y. MAEDA and T. KAWAKOE: JP 109597A, Japanese Patent Office, Tokyo, 1995.
  • P. S. Liu and K. M. LIANG: Mater. ScL TechnoL, 2000,16, 575–578.
  • G. J. DAVIES and z. KILT: J. Mater. ScL, 1983, 18, 1899–1911.
  • K. SABURO, S. TAMOTSU, T. KOUHEI and T. KAZUMICHI: Electrochem. Ind. Phys. Chem., 1997, 65, (1), 57–59.
  • U. ATSUSHI, M. TAKUEI and F. NAGAKAZU: Electrochem Ind. Phys. Chem., 1998, 66, 194–199.
  • P. S. uu and K. M. LIANG: J. Mater. ScL, 2001, 36, 5059–5072.
  • P. S. LIU, H. CHEN, K. M. LIANG, S. R. GU, Q. YU, T. F. LI and C. FU: J. AppL Electrochem., 2000, 30, 1183–1186.
  • P. S. LIU, K. M. LIANG, S. W. TU, S. R. GU, Q. YU, T. F. LI and C. FU: Mater. Sci. TechnoL, 2001, 17, 1069–1072.
  • J. BABJAK, V. A. ETTLE and V. PASERIN: EP 0 402 738 A2, European Patent Office, Brussels, 1990.
  • P. S. LIU, T. F. u and c. FU: Acta Metall. Sinica, 1999,35, 357-361 (in Chinese).
  • P. S. LIU, C. FU and T. F. LI: Trans Nonferrous Met. Soc. China, 1999, 9, 546–552.
  • H. Y. ZHOU, P. S. LIU, K. M. LIANG and S. R. GU: J. Adv. Mater, 2002, 34, (3), 27–31.

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.