41
Views
3
CrossRef citations to date
0
Altmetric
Articles

Phase and microstructure evolution in Cu-In-Cr alloys

, , , &
Pages 653-657 | Published online: 19 Jul 2013

References

  • Z. Li and Y. ZHANG: Electrical Alloy, 1998, 1, 14-18 (in Chinese).
  • X. HUANG: Electrical Alloy, 1998, 3, 26-32 (in Chinese).
  • L. CHENG: High-voltage Electrical Apparatus, 1993, 3, 33-40 (in Chinese).
  • T. NAKANO, T. SUZUKI, N. OHNUKI and S. BABA: Thin Solid Films, 1998, 334, 192–195.
  • T. YAMANE et al.: Z. Metallkde., 1991, 82, 957–960.
  • E. DICHI and B. LEGENDRE: Z. Metallkd., 2000, 91, 47–50.
  • J. JIA, J. ZHAO and J. GUO et al.: ‘Immiscibility alloys and their manufacturing technique’; 2002, Harbin, Harbin Institute of Technology Press (in Chinese).
  • P. LIU, B. KANG and X. CAO et al.: Chin. J. Nonferrous Metals, 1999,9, 677–682.
  • S. SPAIC, M. KOMAC and A. FETAHAGIC: Mater. Scl Technol., 1989,5, 1069–1073.
  • S. LIANG, Z. FAN and R. HU et al.: Powder Metall. Technol. (China), 2000, 18, 196–199.
  • Y.-C. CHEN and C. C. LEE: Thin Solid Films, 1996, 283, 243–246.
  • H. Hu: ‘Principles of metal solidification’; 2000, Beijing, Mechanical Industry Press (in Chinese).

Reprints and Corporate Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

To request a reprint or corporate permissions for this article, please click on the relevant link below:

Academic Permissions

Please note: Selecting permissions does not provide access to the full text of the article, please see our help page How do I view content?

Obtain permissions instantly via Rightslink by clicking on the button below:

If you are unable to obtain permissions via Rightslink, please complete and submit this Permissions form. For more information, please visit our Permissions help page.