Reliability of Pb-free solders for harsh environment electronic assemblies

References

• ‘Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment’, Official Journal of the European Union L 37, 13·2·2003, 19.
   Google Scholar
• ‘World electronic industries 2008–2013’, Executive summary, Decision Etudes Conseil, Paris, France, 2009.
   Google Scholar
• Arra M, Xie DJ, Shangguan D: ‘Performance of Pb-free solder joints under dynamic mechanical loading’, Proc. IEEE 52nd ECTC, May 2002, San Diego, CA, USA, IEEE, 1256–1562.
   Google Scholar
• Chong DYR, Che FX, Pang JHL, Ng K, Tan JYN, Low TH: Microelectron. Reliab., 2006, 46, 1160–1171.
   Web of Science ®Google Scholar
• Wong EH, Rajoo R, Mai YW, Seah SKW, Tsai KT, Yap LM: ‘Drop impact: fundamentals and impact characterisation of solder joints’, Proc. IEEE 55th ECTC, June 2005, Lake Buena Vista, FL, USA, IEEE, 1202–1209.
   Google Scholar
• Syed A, Lin W, Sohn E.-S, Cha S.-W: ‘Plastic deformation and life prediction of solder joints for mechanical shock and drop/impact loading conditions’, Proc. IEEE 57th ECTC, June 2007, Reno, NV, USA, IEEE, 507–514.
   Google Scholar
• ‘Directive 20002/96/EC of the European Parliament and the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE)’, Official Journal of the European Union L 37, 13·2·2003, 24.
   Google Scholar
• Harris PG, Whitmore MA: ‘Alternative solders for electronic assemblies’, Project no. IED2/1/3094, UK Department of Trade and Industry, London, UK, 1993.
   Google Scholar
• ‘NCMS lead-free solder project final report’, Report no. 0401RE96, National Centre for Manufacturing Sciences, Ann Arbor, MI, USA, 1997.
   Google Scholar
• ‘JEIDA report on research and development on lead-free soldering’, Japan Electronic Industry Development Association, Tokyo, Japan, 2000.
   Google Scholar
• Harrison MR, Vincent JH: ‘Improved design life and environmentally aware manufacturing of electronics assemblies by lead-free soldering’, Proc. 12th Microelectronics and Packaging Conf., June 1999, IMAPS Europe, Cambridge, 98-104.
   Google Scholar
• Gayle FW, Becka G, Badgett J, Whitten G, Pan T.-Y, Grusd A, Bauer B, Lathrop R, Slattery J, Anderson I, Foley J, Gickler A, Napp D, Mather J, Olson C: JOM, 2001, 53, 17–21.
   Web of Science ®Google Scholar
• ‘Lead-free assembly project’, Final report, iNEMI, Herndon, VA, USA, December 2003.
   Google Scholar
• ‘Low temperature lead-free soldering’, Report, Japan Institute of Electronics Packaging, Tokyo, Japan, 2002.
   Google Scholar
• ‘Lead free electronics Manhattan project phase 2 report’, ACI Technologies Inc., Philadelphia, PA, USA, 2010.
   Google Scholar
• Brown S: ‘Development of a fatigue resistant alloy for high performance automotive applications, Internal report, Cookson Electronics, Providence, RI, USA, 2009.
   Google Scholar
• ‘Challenges and efforts toward commercialization of lead-free solder-road map 2000 for commercialization of lead-free solder’, Version 1·3, JEIDA, Tokyo, Japan, July 2000.
   Google Scholar
• Bath J, Handweker C, Bradley E: Circ. Assemb., 2000, 11, 30–40.
   Google Scholar
• ‘Round robin testing and analysis of lead free solder pastes with alloys of tin, silver and copper’, Final report II, IPC Solder Product Value Council, Bannockburn, IL, USA, 2003.
   Google Scholar
• McCormick H, Snugovsky P, Hamilton C, Bagheri Z, Bagheri S: ‘The great SAC debate: comparing the reliability of SAC305 and SAC405 solders in a variety of applications’, Proc. PanPac Symposium, January 2007, 333-341.
   Google Scholar
• ‘European lead-free technology roadmap’, Version 1, Soldertec, St Albans, UK, February 2002, 8.
   Google Scholar
• Kim KS, Huh SH, Suganuma K: Microelectron. Reliab., 2003, 43, 259–267.
   Web of Science ®Google Scholar
• Wang YW, Lin YW, Tu CT, Kao CR: J. Alloys Compd, 2009, 478, 121–127.
   Web of Science ®Google Scholar
• Xiao WM, Shi YW, Xu GC, Ren R, Guo F, Xia ZD, Lei YP: J. Alloys Compd, 2009, 472, 198–202.
   Web of Science ®Google Scholar
• Xie HX, Chawla N, Shen Y.-L: Microelectron. Reliab., 2011, 51, 1142–1147.
   Web of Science ®Google Scholar
• Ghosh M, Gunjan MK, Das SK, Kar A, Ghosh RN, Ray AK: Mater. Sci. Technol., 2010, 26, 610–614.
   Web of Science ®Google Scholar
• Plumbridge WJ: J. Mater. Sci., 1996, 31, 2501–2514.
   Web of Science ®Google Scholar
• Barry N, Jones IP, Hirst T, Fox IM, Robins J: Solder. Surf. Mount Technol., 2007, 19, 29–38.
   Web of Science ®Google Scholar
• Lin YT, Peng CT, Chiang KN: ASME Trans. J. Electron. Packag., 2002, 124, 1–6.
   Web of Science ®Google Scholar
• Lau JH: IEEE Trans. Electron. Packag. Manuf., 2002, 25, 42–50.
   Web of Science ®Google Scholar
• Frear DR, Jang JW, Lin JK, Zhang C: JOM, 2001, 53, 28–33.
   Web of Science ®Google Scholar
• Osterman M, Dasgupta A: J. Mater. Sci., 2007, 18, 229–236.
   Web of Science ®Google Scholar
• ‘NIST Pb-free database’, Solder data sheet, NIST, Hamilton, Ont., Canada (as reported in Tables 1·13 and 1·14 of NIST Pb-free database,www.boulder.nist.gov/div853/lead_free/solders.html).
   Google Scholar
• ‘Room temperature tensile properties of lead-free solder alloys’, Technical reports for the Lead Free Solder Project: Properties Reports, National Center for Manufacturing Sciences, Ann Arbor, MI, USA, 1998, 33-38
   Google Scholar
• Madeni J, Liu S, Siewert T: ‘Casting of lead-free solder specimens with various solidification rates’, Proc. ASM Int. Conf., November 2001, Indianapolis, IN, USA, ASM.
   Google Scholar
• Sigelko J, Subramanian KN: ‘Overview of lead-free solders’, Adv. Mater. Proc., Mar. 2000, 47–48.
   Web of Science ®Google Scholar
• Hernandez C, Vianco P, Rejent J: ‘Effect of interface microstructure on the mechanical properties of Pb-free hybrid microcircuit solder joints’, Proc. IPC/SMTA Electronics Assembly Expo., October 1998, Providence, Rl, USA, IPC/SMTA, S19-2-1.
   Google Scholar
• Shang JK, Zeng QL, Zhang L, Zhu QS: J. Mater. Sci., 2007, 18, 211–227.
   Google Scholar
• National Institute of Standards and Technology: www.metallurgy.nist.gov/phase/solder/solder.html
   Google Scholar
• Ma H, Suhling JC, Lall P, Bozack MJ: ‘Effects of aging on the stress–strain and creep behaviors of lead free solders’, Proc. IEEE 56th ECTC, May–June 2006, San Diego, CA, USA, IEEE, 961.
   Google Scholar
• Glazer J: Int. Mater. Rev., 1995, 40, 65–90.
   Web of Science ®Google Scholar
• Reid M, Punch J, Collins M, Ryan C: Solder. Surf. Mount Technol., 2008, 20, 3–8.
   Web of Science ®Google Scholar
• Kim H, Zhang M, Kumar CM, Suh D, Liu P, Kim D, Xie M, Wang Z: ‘Improved drop reliability performance with lead free solders of low Ag content and their failure modes’, Proc. IEEE 57th ECTC, May–June 2007, Reno, NV, USA, IEEE, 962–967.
   Google Scholar
• Zeng Q.-L, Wang Z.-G, Xian A.-P, Shang JK: J. Electron. Mater., 2005, 34, 62–67.
   Web of Science ®Google Scholar
• Kanchanomai C, Miyashita Y, Mutoh Y, Mannan SL: Mater. Sci. Eng. A, 2003, A345, 90–98.
   Web of Science ®Google Scholar
• Schueller R, Blattau N, Arnold J, Hillman C: SMTA J., 2010, 23, 18–26.
   Google Scholar
• Terashima S, Kariya Y, Hosoi T, Tanaka M: J. Electron. Mater., 2003, 32, 1527–1533.
   Web of Science ®Google Scholar
• Henderson DW, Gosselin T, Sarkhel A, Kang SK, Choi WK, Shih DY, Goldsmith C, Puttlitz K: J. Mater. Res., 2002, 17, 2775–2778.
   Web of Science ®Google Scholar
• Kerr M, Chawla N: Acta Mater., 2004, 52, 4527–4535.
   Web of Science ®Google Scholar
• Lee T.-K, Liu K.-C, Bieler TR: J. Electron. Mater., 2009, 12, 2685.
   Web of Science ®Google Scholar
• Darveaux R, Reichman C, Islam N: ‘Interface failure in lead free solder joints’, Proc. IEEE 56th ECTC, May–June 2006, San Diego, CA, USA, IEEE, 906–917.
   Google Scholar
• Mattila TT, Vuorinen V, Kivilahti JK: J. Mater. Res., 2004, 33, 3214–3223.
   Web of Science ®Google Scholar
• Amin KE, Mukherjee AK, Dorn JE: J. Mech. Phys. Solids, 1970, 18, 413–426.
   Google Scholar
• Vnuk F: J. Cryst. Growth, 1980, 48, 486–488.
   Web of Science ®Google Scholar
• Blake N, Smith RW: J. Mater. Sci. Lett., 1986, 5, 103–104.
   Google Scholar
• Plumbridge WJ: J. Electron. Mater., 2008, 37, 218–223.
   Web of Science ®Google Scholar
• Plumbridge WJ: J. Mater. Sci, 2007, 18, 307–318.
   Web of Science ®Google Scholar
• Vnuk F, de Monte A, Smith RW: J. Appl. Phys., 1984, 55, 4171–4176.
   Web of Science ®Google Scholar
• Matvienko AA, Sidelnikov AA: J. Alloy Compd, 1997, 252, 172.
   Web of Science ®Google Scholar
• Rogers RR, Fydell JF: J. Electrochem. Soc., 1953, 100, 383–387.
   Web of Science ®Google Scholar
• Joo Y.-J, Takemoto T: Mater. Lett., 2002, 56, 793–796
   Web of Science ®Google Scholar
• ‘Performance test methods and qualification requirements for surface mount attachments’, IPC-9701, IPC, Bannockburn, IL, USA, January 2002.
   Google Scholar
• Britton SC: Trans. Inst. Met. Finish., 1974, 52, 95–102.
   Google Scholar
• Brusse JA, Ewell G, Siplon JP: Proc. 22nd Symp. on ‘Capacitor and resistor technology’, March 2002, New Orleans, LA, USA, Electronic Components, Assemblies and Materials Association, 67–80.
   Google Scholar
• Zhang Y, Breck G, Humiec F, Murski K, Abys JA: Proc. SMI ’96, San Jose, CA, USA, September 1996, SMI , 641-649.
   Google Scholar
• Lee B, Lee D: Acta Mater., 1998, 46, 3701–3714.
   Web of Science ®Google Scholar
• Schetty R: Proc. IPC Works Conf., September 2000, Miami, FL, USA, IPC/JEDEC, 137-161.
   Google Scholar
• Norris KC, Landzberg AH: IBM J. Res., 1969, 13, 266.
   Web of Science ®Google Scholar
• Dudek R, Faust W, Wiese S, Rollig M, Michel B: ‘Low-cycle fatigue of Ag-based solders dependent on alloying composition and thermal cycle conditions’, Proc. EPTC 2007, December 2007, Singapore, 14-20.
   Google Scholar
• Coffin LF, Schenectady NY: ASME Trans., 1954, 76, 931–950.
   Google Scholar
• Manson SS: ‘Thermal stress and low cycle fatigue’, 125–192; 1966, New York, Mc Graw-Hill.
   Google Scholar
• Kanchanomai C, Miyashita Y, Mutoh Y: J. Electron. Mater., 2002, 31, 456–465.
   Web of Science ®Google Scholar
• Kariya Y, Otsuka M: J. Electron. Mater., 1998, 27, 1229–1235.
   Web of Science ®Google Scholar
• Zhao J, Mutoh Y, Miyashita Y, Kanchanomai C: Solder. Surf. Mount Technol., 2005, 14, 37.
   Google Scholar
• Pan N, Henshall GA, Billaut F, Dai S, Strum MJ, Lewis R, Benedetto E, Rayner J: ‘An acceleration model for Sn–Ag–Cu solder joint reliability under various thermal cycle conditions’, Proc. SMTA Int. Conf., September 2005, Chicago, IL, USA, SMTA, 876-883.
   Google Scholar
• Clech J.-P: in ‘Lead-free soldering’, (ed. , Bath J S), 145–172; 2007, Berlin, Springer.
   Google Scholar
• Clech J.-P: ‘Lead-free and mixed assembly solder joint reliability trends’, Proc. IPC/SMEMA Council APEX, Anaheim, CA, USA, February 2004, IPC, S-28-3-1 to S-28-3-14.
   Google Scholar
• ‘JCAA/JG-PP Lead-free solder project’, NASA Technology Evaluation for Environmental Risk Mitigation (TEERM) Principal Center Joint test report, NASA, Washington, DC, USA, 2009.
   Google Scholar
• Schubert A, Dudek R, Auerswald E, Gollhardt A, Michel B, Reichl H: ‘Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation’, Proc. 53rd IEEE ECTC, May 2003, New Orleans, LA, USA, IEEE , 603-610.
   Google Scholar
• Cadek J: ‘Creep in metallic materials’; 1988, New York, Elsevier.
   Google Scholar
• Mathew MD, Yang H, Movva S, Murty KL: Metall. Mater. Trans. A, 2005, 36A, 99.
   Web of Science ®Google Scholar
• Langdon TG, Mohamed FA: Mater. Sci. Eng. A, 1978, A32, 103–112.
   Web of Science ®Google Scholar
• Ma H, Suhling JC: J. Mater. Sci., 2009, 44, 1141.
   Web of Science ®Google Scholar
• Mei Z, Morris JW: J. Electron. Mater., 1992, 21, 599–607.
   Web of Science ®Google Scholar
• Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meustel E, Michel B: Proc. IEEE 51st ECTC, May 2001, Orando, FL, USA, IEEE, 890.
   Google Scholar
• Clech JP: ‘Review and analysis of lead-free solder material properties’, Report, NIST, Gaithersburg, MD, USA, 2002, www.metallurgy.nist.gov/solder/clech/Introduction.htm
   Google Scholar
• Rist MA, Plumbridge WJ, Cooper S: J. Electron. Mater., 2006, 35, 1050–1058.
   Web of Science ®Google Scholar
• Shi XQ, Wang ZP, Yang QJ, Pang HLJ: J. Eng. Mater. Technol., 2003, 125, 81–88.
   Web of Science ®Google Scholar
• Xiao Q, Armstrong WD: J. Electron. Mater., 2005, 34, 196–211.
   Web of Science ®Google Scholar
• Zhang Q, Dasgupta A, Haswell P: ‘Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn–3·9Ag–0·6Cu solder alloy’, Proc. IEEE 53rd ECTC, May 2003, New Orleans, FL, USA, IEEE, 1862–1868.
   Google Scholar
• Lau J, Dauksher W, Vianco P: ‘Acceleration models, constitutive equations, and reliability of lead-free solder joints’, Proc. IEEE 53rd ECTC, May 2003, New Orleans, FL, USA, IEEE, 229–236.
   Google Scholar
• Pang JHL, Xiong BS, Low TH: ‘Creep and fatigue properties of lead free Sn–3·8Ag–0·7Cu solder’, Proc. IEEE 54th ECTC, June 2001, Piscataway, NJ, USA, IEEE, 1333–1337.
   Google Scholar
• Mei Z, Grivas D, Shine MC, Morris JW: J. Electron. Mater., 1990, 19, 1273–1280.
   Web of Science ®Google Scholar
• Wiese S, Schubert A, Walter H, Dudek R, Feustel F, Meusel E, Michel B: ‘Constitutive behaviour of lead-free solder vs. lead-containing solders – experiments on bulk specimens and flip-chip joints’, Proc. IEEE 51st ECTC, May 2001, Orando, FL, USA, IEEE, 1–13.
   Google Scholar
• Tsukada Y, Nishimura H, Yamamoto H, Sakane M: J. Electron. Packag., 2005, 127, 407–415.
   Web of Science ®Google Scholar
• Rhee H, Subramanian KN, Lee A, Lee JG: Sold. Surf. Mount Technol., 2003, 15, 21–26.
   Web of Science ®Google Scholar
• Liu CY, Chen C, Mal AK, Tu KN: J. Appl. Phys., 1999, 85, (7), 3882–3887.
   Web of Science ®Google Scholar
• Obaid AA, Sloan JG, Lamontia MA, Paesano A, Khan S, Gillepsie JW: J. Electron. Pack., 2005, 127, 430–440.
   Web of Science ®Google Scholar
• Darveaux R, Banerji K: IEEE Trans. CHMT, 1992, 15, (6), 1013–1024.
   Web of Science ®Google Scholar
• Chromik RR, Vinci RP, Allen SL: JOM, 2003, 55, 66–69.
   Web of Science ®Google Scholar
• Frost HJ, Ashby MF: ‘Deformation mechanism maps – the plasticity and creep of metals and ceramics’; 1982, Oxford, Pergamon.
   Google Scholar
• Clech J.-P: ‘An obstacle-controlled creep model for Sn–Pb and Sn-based lead-free solders’, Proc. SMTA, Int. Conf., September 2004, Chicago, IL, USA, SMTA, 776-802.
   Google Scholar
• H. J, Pao Y.-H: in ‘Solder joint reliability of BGA, CSP, flip-chip, and fine pitch SMT assemblies’, 1997, New York, McGraw-Hill, 91.
   Google Scholar
• Song HG, Morris JW, Hua F: JOM, 2002, 54, 30–32.
   Web of Science ®Google Scholar
• Anand L: J. Plast., 1985, 1, 213–231.
   Google Scholar
• Brown SB, Kim KH, Anand L: Int. J. Plast., 1989, 5, 95–130.
   Web of Science ®Google Scholar
• Wang GZ, Cheng ZN, Becker K, Wilde J: J. Electron. Packag., 2001, 123, 247–253.
   Web of Science ®Google Scholar
• Stephens JJ, Frear DR: Metall. Mater. Trans. A, 1999, 30A, 1301–1313.
   Web of Science ®Google Scholar
• Liu YC, Teo JWR, Tung SK, Lam KH: J. Alloys Compd., 2008, 448, 340–343.
   Web of Science ®Google Scholar
• Goodall R, Clyne TW: Acta Mater., 2006, 54, 5489–5499.
   Web of Science ®Google Scholar