References
- Wang SJ, Liu CY: Acta Mater., 2007, 55, (10), 3327–3335.
- Suh J.-Y, Lohwongwatana B, Garland CM, Conner RD, Johnson WL, Suh D: Scr. Mater., 2008, 59, (8), 905–908.
- Lin H.-J, Chuang T.-H: Microelectron. Reliab., 2011, 51, (2), 445–452.
- Kim J.-M, Jeong M.-H, Yoo S, Lee C.-W, Park Y.-B: Microelectron. Eng., 2012, 89, 55–57.
- Wu CML, Yu DQ, Law CMT, Wang L: Mater. Sci. Eng., 2004, 44, (1), 1–44.
- Wang S.-H, Chin T.-S, Yang C.-F, Chen S.-W, Chuang C.-T: J. Alloys Compd, 2010, 497, (1–2), 428–431.
- Yen Y.-W, Tsai P.-H, Fang Y.-K, Lo S.-C, Hsieh Y.-P, Lee C: J. Alloys Compd, 2010, 503, (1), 25–30.
- Kikuchi S, Nishimura M, Suetsugu K, Ikari T, Matsushige K: Mater. Sci. Eng., 2001, 319–321, 475–479.
- Erinc M, Schreurs PJG, Geers MGD: Mech. Mater., 2008, 40, (10), 780–791.
- Li D, Conway PP, Liu C: Corros. Sci., 2008, 50, (4), 995–1004.
- Babaghorbani P, Nai SML: J. Alloys Compd, 2009, 478, (1–2), 458–461.
- Kuna M, Wippler S: Eng. Fract. Mech., 2010, 77, (18), 3635–3647.
- Yeshchenko OA, Dmitruk IM, Alexeenko AA, Dmytruk AM: Phys. Rev. B, 2007, 75B, (8), 085434.
- Shibuta Y, Suzuki T: Chem. Phys. Lett., 2010, 498, (4–6), 323–327.
- Ide E, Angata S, Hirose A, Kobayashi KF: Acta Mater., 2005, 53, (8), 2385–2393.
- Bai JG, Zhang ZZ, Calata JN, Lu G.-Q: IEEE Trans. Compon. Packag. 2006, 29, (3), 589–593.
- Bai JG, Lu G.-Q: IEEE Reliab., 2006, 6, (3), 436–441.
- Morita T, Ide E, Yasuda Y, Hirose A: Jpn J. Appl. Phys., 2008, 47, (8), 6615–6622.
- Yasuda Y, Ide E, Toshiaki T: Jpn J. Appl. Phys., 2009, 48, (12), 125004.
- Nakamoto M, Yamamoto M, Kashiwagi Y, Kakiuchi H, Yoshida Y: ‘A variety of silver nanoparticle pastes for fine electronic circuit pattern formation’, Proc. 6th Int. IEEE Conf. on ‘Polymers and adhesives in microelectronics and photonics’, Tokyo, Japan, January 2007, IEEE, 105–109.
- Morita T, Yasuda Y, Ide E, Akada Y, Hirose A: Mater. Trans., 2008, 49, (12), 2875–2880.
- Morita T, Yasuda Y, Ide E, Hirose A: Mater. Trans., 2009, 50, (1), 226–228.
- Yasuda Y, Ide E, Morita T: ‘Direct bonding to aluminum utilizing silver oxide particles’, Proc. 15th Symp. on ‘Microjoining and assembly technology in electronics’, Yokohama, Japan, January 2009, 189–194.
- Morita T, Yasuda Y, Ide E, Hirose A: Erekutoronikusu-Jisso-Gakkai-Shi, 2009, 12, (2), 110–113.
- Hirose A, Tatsumi H, Takeda N, Akada Y, Ogura T, Ide E, Hirose A: J. Phys. Conf. Series, 2009, 165, (1), 012074.
- Morita T, Yasuda Y, Ide E, Hirose A: Mater. Jpn, 2010, 49, (1), 20–22.
- Ogura T, Nishimura M, Tatsumi H, Takeda N, Takahara W: Open Surf. Sci. J., 2011, 3, 55–59.
- Morisada Y, Nagaoka T, Fukusumi M, Kashiwagi Y, Yamamoto M, Nakamoto M: J. Electron. Mater., 2010, 39, (8), 1283–1288.
- Li Y.-S, Lu Y.-C, Chou K.-S, Liu F.-J: Mater. Res. Bull., 2010, 45, (12), 1837–1843.
- Wu S.-H, Chen D.-H: J. Colloid Interface Sci., 2004, 273, (1), 165–169.
- Athawalea AA, Katre PP, Kumar M, Majumdar MB: Mater. Chem. Phys., 2005, 91, (2–3), 507–512.
- Wang H, Hu X, Northwood DO: Mater. Lett., 2008, 62, (19), 3331–3333.
- Kim J, Kim D, Veriansyah B, Kang JW, Kim J.-D: Mater. Lett., 2009, 63, (21), 1880–1882.
- Bicer M, Sisman I: Powder Technol., 2010, 198, (2), 279–284.
- Song Y, Li R, Sun Q, Jin P: Chem. Eng. J., 2011, 168, (1), 477–484.
- Kobayashi Y, Shirochi T, Yasuda Y, Morita T: Solid State Sci., 2011, 13, (3), 553–558.
- Kobayashi Y, Shirochi T, Yasuda Y, Morita T: Int. J. Adhes. Adhes., 2012, 33, 50–55.
- Kim JY, Rodriquez JA, Hanson JC, Frenkle AI, Lee PL: J. Am. Chem. Soc., 2003, 125, (35), 10684–10692.
- Han W.-K, Choi J.-W, Hwang G.-H, Hong S.-J, Lee J.-S, Kang SG: Appl. Sur. Sci., 2006, 252, (8), 2832–2838.
- Yamukyan MH, Manukyan KhV, Kharatyan SL: J. Alloys Compd, 2009, 473, (1–2), 546–549.
- Jelic D, Biljana T.-T, Mentus S: Thermochim. Acta., 2011, 521, (1–2), 211–217.
- Kobayashi Y, Maeda T, Watanabe K, Ihara K, Yasuda Y, Morita T: J. Nanoparticle Res., 2011, 13, (10), 5365–5372.
- Khanna PK, Gaikwad S, Adhyapak PV, Singh N, Marimuthu R: Mater. Lett., 2007, 61, (25), 4711–4714.
- Singh M, Shinha I, Premkumar M, Singh AK, Mandal RK: Colloids Surf. A, 2010, 359A, (1–3), 88–94.