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Science and Technology of Welding and Joining Volume 17, 2012 - Issue 7
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Original Article

Metal–metal bonding process using copper oxide nanoparticles

T MaedaDepartment of Biomolecular Functional Engineering, College of Engineering, Ibaraki University, 4-12-1 Naka-narusawa-cho, Hitachi, Ibaraki316-8511, Japan
,
Y KobayashiDepartment of Biomolecular Functional Engineering, College of Engineering, Ibaraki University, 4-12-1 Naka-narusawa-cho, Hitachi, Ibaraki316-8511, JapanCorrespondence[email protected]
,
Y YasudaHitachi Research Laboratory, Hitachi Ltd, 7-1-1 Omika-cho, Hitachi, Ibaraki319-1292, Japan
&
T MoritaHitachi Research Laboratory, Hitachi Ltd, 7-1-1 Omika-cho, Hitachi, Ibaraki319-1292, Japan
Pages 556-563 | Received 16 May 2012, Accepted 18 Jun 2012, Published online: 12 Nov 2013

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