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Materials Research Innovations Volume 18, 2014 - Issue sup6: ICoSEM 2013
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Research Papers

Characterisation of insulated Cu wire ball bonding

H. Y. LeongCentre for Microelectronic and Nano EngineeringCOE, Universiti Tenaga Nasional, KM7 Jalan Ikram-Uniten, 43009Kajang, Selangor, Malaysia
,
B. K. YapCentre for Microelectronic and Nano EngineeringCOE, Universiti Tenaga Nasional, KM7 Jalan Ikram-Uniten, 43009Kajang, Selangor, MalaysiaCorrespondence[email protected]
,
N. KhanFresscale Semiconductor Malaysia SDN BHD, Free Industrial Zone Sungai Way, 47300Petaling Jaya, Selangor, Malaysia
,
M. R. IbrahimFresscale Semiconductor Malaysia SDN BHD, Free Industrial Zone Sungai Way, 47300Petaling Jaya, Selangor, Malaysia
,
L. C. TanFresscale Semiconductor Malaysia SDN BHD, Free Industrial Zone Sungai Way, 47300Petaling Jaya, Selangor, Malaysia
&
M. FaizDepartment of Mechanical EngineeringFaculty of Engineering Building, University of Malaya, 50603Kuala Lumpur, Malaysia
Pages S6-269-S6-273 | Published online: 05 Dec 2014

References

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  • C. J. Vath III, M. Gunasekaran and R. Malliah: ‘Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage’, Microelectron. Reliab., 2011, 51, 137–147.
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