REFERENCES
- A. Islam: ‘Two component micro injection moulding for moulded interconnect devices’, PhD thesis, Department of Mechanical Engineering, Technical University of Denmark, Kongens Lyngby, Denmark, 2008.
- K. Feldmann, C. Goth, J. Heyer and W. John: Proc. 8th Int. Congr. on ‘Moulded interconnect devices’ Nuremberg-Fueth, Germany, September 2008, Research Association Moulded Interconnect Devices 3-D MID e.V.
- A. Islam, H. N. Hansen, P. T. Tang and J. Sun: ‘Process chains for the manufacturing of moulded interconnect devices’, Int. J. Adv. Manuf Technol. , 2009, 42, 831–841.
- A. Islam, H. N. Hansen and P. T. Tang: ‘Micro-MID manufactur-ing by two-shot injection moulding’, Eur. Mag. OnBoard Technol. , 2008, 9, (2), 10–13.
- D. A. Arcilesi, R. K. Klein and D. Magda: ‘Sensitizing nonconductive substrates prior to electroless plating’, GB patent no. 2 154 251 A, 1985.