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Surface Engineering Volume 24, 2008 - Issue 5
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Articles

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique

S. J. HongDept. of Electronics Engineering and MITERI, Myongji University, Yongin, Korea
,
B-H. ParkDept. of Electronics Engineering and MITERI, Myongji University, Yongin, Korea
,
D. S. SeoBangmok College of Basic Studies, Myongji University, Yongin, Korea
&
C.-R. RyuBangmok College of Basic Studies, Myongji University, Yongin, Korea
Pages 337-340 | Published online: 19 Jul 2013

  • available at: http://www.rohs.gov.uk/
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